JPH0274848A - Instruction method in board inspecting apparatus - Google Patents

Abstract

PURPOSE:To facilitate the manufacture of a reference board for instruction and to make it possible to utilize said board again by attaching a label to a component mounting position on the board, picking up the image of the label, and instructing the mounting position and the kind of the component. CONSTITUTION:A specified part 21S is properly soldered to a component mounting position on a reference board 20, and the excellent mounting state is formed. A label 50 is attached to the approximately central position of the upper surface of each component 21S. The label 50 is used for instructing the mounting position of the component 21S and the kind and the mounting direction of the mounted part. Namely, the reference board 20 is supplied to a board inspecting apparatus, and the image of each label 50 is picked up. The mounting position of the component 21S is instructed by the label attached position. The kind of the component 21S is instructed based on the color or the shape of the label.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a board inspection device used to inspect the mounting condition of components surface-mounted on a board, such as the quality of soldering. In particular, the present invention relates to a teaching method for teaching this type of board inspection apparatus the mounting position of a component and the type of mounted component prior to board inspection.

<Prior art> Conventionally, visual inspection has been performed to check the quality of the mounting state of surface-mounted components on a board.In particular, the quality of soldering is determined by the presence or absence of solder, It, This visual inspection determines solubility, short circuits, poor continuity, etc. However, in such visual inspection, the occurrence of inspection errors is unavoidable, the judgment results vary depending on the person conducting the inspection, and there is a limit to the inspection processing capacity.

Therefore, in recent years, various automatic inspection devices that can automatically perform this type of inspection have been proposed.

FIG. 13 shows an example of an automatic inspection device that can detect three-dimensional shape information. The device shown in the figure irradiates a slit beam 1 from a laser light source to a soldering area on a substrate 2, and a light cutting line 3 that is distorted along the surface shape of the surface of the substrate 2 including the soldering area. is generated. This light cutting line 3
The reflected light image is captured by the imaging device 4, and by checking the distortion state of the captured pattern, the three-dimensional shape of the soldering area is detected.

However, in the case of this inspection method, only the shape information of the portion irradiated with the slit light 1 is obtained, and it is difficult to grasp the three-dimensional shape of the other portions.

As a way to solve this problem, soldering is performed by irradiating light with different incident angles onto the surface of the part and capturing the pattern of each reflected light image of the part. There are methods for detecting orientation.

This method focuses on the fact that when a fixed pattern of light beams is applied to an inspection object, the pattern of the reflected light beam is deformed according to the three-dimensional shape of the inspection object, and the shape of the inspection object can be determined from the deformation pattern. It is estimated.

FIG. 14 is a diagram explaining the principle of this method, and shows the light projecting device 5.
The positional relationship between a detection system consisting of a and an imaging device 6 and a soldering part 7 to be inspected is shown.

In the figure, when the light beam 8 is projected from the light projecting device 5 onto the surface of the soldering part 7 at an incident angle i, the angle i' (=i
) is incident on the imaging device 6 located directly above and detected. This means that it has been detected that the curved surface element of the soldering area 7 illuminated by the light beam 8 is oriented at an angle of i with respect to the reference plane 10. Therefore, when soldering is made up of a large number of curved elements oriented in different directions, if multiple light projectors with different incident angles are used to project light onto the part 7, a group of curved elements corresponding to each incident angle will be imaged. This is detected by the device 6, and thereby the orientation of each curved surface element of the soldered portion 7 can be detected, that is, the surface texture of the soldered portion can be detected.

Further, the projector 5 has an incident angle of 2 from i+Δi to iΔi.
If a beam of light 8 having a width of Δi is projected, a reflected beam of light 9 having a width corresponding to the width will be detected by the imaging device 6.

That is, in this case, the inclination angle with respect to the reference plane 10 is i+Δ
This means that it is possible to detect curved surface elements having angles with widths from j to i-Δj.

Furthermore, as shown in FIG.
If it is a ring-shaped object installed horizontally to The distance from the portion 7 is constant, and the orientation of the curved surface element in the rotation angle direction is eliminated, so only the inclination angle formed with the reference plane 10 is detected.

Further, as shown in FIG. 15, the soldering device 5 has a plurality of ring-shaped light emitters 11 having different angles of incidence on the portion 7.
, 12.13, it is possible to detect the curved surface element with the orientation corresponding to the incident angle of the light beams 14, 15.16 from each light emitting body in greater detail as described above.

Now, three ring-shaped light emitters 11, 12, and 13 with radius rn (where n = 1.2.3) are placed at a height of (n = 1.2.3) with respect to the reference plane 10. If installed horizontally, each light beam 14, 15.1 to part 7 will be soldered.
The incident angle of 6 is 17 (n=1.2.3), respectively, and each curved surface element having an inclination angle of 17 at soldering site 7 can be detected by the imaging device 6. At this time, since the size of the curved surface element from each light emitting body 11, 12, 13 to the soldering part 7 through the surface of the part 7 to the imaging device 6 is sufficiently small compared to the total optical path length, the incident angle can be determined by the following equation, What is necessary is to determine the inclination angle of the curved surface element to be detected.

Based on the above principle, a method using a white light source for each of the light emitters 11, 12 and 13 has been proposed as a method for inspecting the appearance of soldering parts (Japanese Patent Laid-Open No. 61-2936
No. 57). In this inspection method, in order to mutually identify the reflected light images from the three light emitters 11 and 12.13 having different incident angles with respect to the part, the soldering is carried out at different timings. It turns on the light and turns it off again.

However, this method requires a memory to store each image obtained at different light emitting timings, a calculation device to process these images as the same visual field image, and a computer to instantaneously turn on each light emitting body. A lighting device and the like are required, which is technically complicated, and this also poses problems in terms of cost and reliability.

In order to solve the problems of this time sharing system all at once, the inventor of the present invention recently proposed a board inspection apparatus having the configuration shown in FIG. This board inspection equipment is
The details will be described later, but soldering is equipped with a light projection unit 24 for irradiating the surface of the part with red light, green light, and blue light at different angles of incidence; It is composed of an imaging section 25 for capturing an image on the hue side, and a processing section 26 for detecting the properties of each curved surface element of the soldering part from the imaging pattern obtained by the imaging section 25, and The portion 24 uses three ring-shaped light emitters 2B and 29.30 that generate red light, green light, and blue light, respectively. Each of the light emitters 2B and 29.30 has a luminescence energy distribution with respect to wavelength such that white light is produced by combining the light from each light emitter. The amount of light can be adjusted.

According to this board inspection device, when soldering is performed by irradiating red light, green light, and blue light from each light emitting body 2B, 29° 30 at different incident angles to the part, the soldering is performed by irradiating red, green, and blue light from the surface of the part. , blue reflected light images are simultaneously separated and detected by the imaging unit 25. In this case, each light emitter 2
B, 29°30, red light, green light, and blue light are combined to form white light, so in addition to information about the curved surface properties of parts, soldering requires information about each component on the board (for example, part number, It can detect peripheral information essential for automatic inspection of board-mounted components, such as polarity, color code, etc.) and board pattern information (various marks, etc.).

<Problems to be Solved by the Invention> When using such a board inspection device, before inspecting a board to be inspected, a board (this is referred to as a "reference board") on which predetermined components are correctly mounted in predetermined positions is inspected. It is necessary to manually input various types of data related to the above-mentioned data using a keyboard. This teaching work is called "teaching", and it includes data regarding the position of one type of component mounted on the reference board, the inspection area, etc., and the characteristics of the mounting state (for example, soldering state) of each component within the inspection area. Data is taught.

However, in this key human-powered teaching method,
Since there is an extremely large amount of key data that must be manually handled, the manual work requires a great deal of time and effort, and the workload is heavy.

As a teaching method to solve this problem, the surface of the board is colored with black paint, and the mounting parts are colored with white paint to create a positioning board, and this positioning board is imaged by a board inspection device. A device was proposed that taught reference data (part positions, etc.) when inspecting a board to be inspected (Japanese Patent Laid-Open No. 180251/1983).
issue).

However, in the case of this teaching method, painting work is not only required to prepare the positioning board (the board can no longer be reused for painting, which is extremely uneconomical). If the parts are not painted, the position of the parts cannot be taught correctly, and furthermore, with this method, it is not easy to teach other than the position of the parts, such as the type of the part.

This invention was made in view of the above problem, and by using labels to teach the mounting position of components and the type of mounted components, it is easy to prepare a reference board for teaching, and the board can be reused. The purpose of this invention is to provide a teaching method for a new board inspection device that can be used.

Means for Solving the Problems> In order to achieve the above object, the present invention allows a board inspection device that inspects mounted components on a board to determine the mounting position of the component and the type of the mounted component prior to inspecting the board. To teach, the circuit board inspection device is supplied with a label attached to each component mounting position on the board, and by imaging each label, the component mounting position is taught from the label attachment position. At the same time, the type of component is taught from the color or shape of the label.

Function> Prior to inspecting the board to be inspected, a reference board is prepared by pasting a label with a color or shape depending on the type of component at the component mounting position on the board. This reference board is imaged by a board inspection device, and the label attachment position, shape, and color are read.
As a result, the mounting position of the component and the type of the mounted component are taught.

In the case of this teaching method, the reference substrate can be easily produced by simply pasting a label on it, and if the label is peeled off, the substrate can be reused, which is economical. Moreover, according to this teaching method, it is easy to teach other than the position of parts, for example, the type of parts.

<Example> FIG. 1 shows a schematic configuration of a board inspection apparatus.

This board inspection apparatus uses feature parameters (judgment data) of the inspection area of each component 21S on the reference board 203 obtained by imaging the reference board 203, and a board to be inspected 20T.
Characteristic parameters of the inspection area of each component 21T on the substrate to be inspected 2OT obtained by imaging (data to be inspected)
This is to check whether each of these parts 21T is correctly mounted and soldered by comparing the X-axis table section 22 and the Y-axis table section 23.
．． Light projecting section 24. Imaging unit 25. The configuration includes a processing section 26 and the like.

The X-axis table section 22 and the Y-axis table section 23 are each equipped with a motor (not shown) that operates based on a control signal from the processing section 26, and the drive of these motors causes the X-axis table section 22 to operate as an imaging section. 25 in the X direction, and the conveyor 27 on which the Y-axis table section 23 supports the substrates 2O3, 20T is moved in the X direction.

These substrates 203 and 20T are imaged by the imaging section 25 while receiving the irradiation light from the light projecting section 24.

The light projecting unit 24 includes ring-shaped light emitters 2B and 29 that generate red light, green light, and blue light, respectively, based on the control signal from the processing unit 26, and irradiate the object to be inspected at different incident angles.
．． 30, and the substrate 203.2 is illuminated by the mixed light of the three primary colors emitted by the light emitters 2B and 29.30.
07, and an image of the reflected light is obtained by the imaging section 25 and converted into an electrical signal. In the case of this embodiment, each of the light emitting bodies 2B and 29.30 has a structure in which a white light source is covered with colored transparent plates of red, green, and blue. If so, you can use three ring-shaped color fluorescent lamps (red, green, and blue), or use three ring-shaped neon tubes (red, green, and blue).

green, blue) can also be used.

Moreover, this light projecting unit 24 illuminates the substrate 203.20 under its illumination.
In order to make it possible to detect information regarding the components on the T (part number, scratch resistance, color code, etc.) and board pattern information (various marks, etc.), each light emitting body 2B, 29.3
It is designed so that when the light of each hue emitted by 0 is mixed, it becomes completely white light. That is, each light emitter 28.2
9.30 is composed of a light emitting body that emits light in a red light spectrum, a green light spectrum, and a blue light spectrum having a wavelength-to-wavelength emission energy distribution such that white light is produced by color mixing, and each light emitting body 28.29.30 The imaging controller 31 is capable of adjusting the amount of light of each hue so that the red, green, and blue lights emitted from the light are mixed to form white light.

Next, the imaging unit 25 includes a color television camera 32 located above the light projecting unit 24, and
The reflected light from the 3 or 20T is converted into three primary color signals R, G, and B by the color television camera 32 and supplied to the processing section 26.

The processing section 26 includes an A/D conversion section 33. Memory 38° Teaching table 351 Image processing section 34° Judgment section 36. X
, Y table controller 37° imaging controller 31
．． CR7 display section 41. Printer 42. Keyboard 40.
Floppy disk device 43. It is composed of a control unit (CPU) 39 and the like, and when in the teaching mode, the mounting position of each component 21S, the type of mounted component, the mounting direction, and the like are determined from the reference board 20S using a method described later.

In addition to detecting the inspection area, the color signals R, G, and B of the reference board 20S are processed to detect the red, green, and blue hue patterns of each component 213 that is in good soldering condition. Generate parameters and create a judgment data file. Furthermore, in the inspection mode, the processing unit 26 outputs color signals R, R, and R for the substrate to be inspected 20T.
G and B are processed, similar hue patterns are detected in the inspection area of each component 21T on the board, characteristic parameters are generated, and a data file to be inspected is created. This inspected data file is compared with the determination data file, and based on the comparison result, it is automatically determined whether the soldered portion of a predetermined component 21T on the inspected board 2OT is good or defective.

Figure 2 shows the cross-sectional form of the solder 44 when the soldering is good, when a component is missing, and when there is insufficient solder, and the imaging patterns in each case: a red Bakun, a green pattern, and a blue pattern. It shows the relationship with the patterns in a list, and since there are clear differences between any hue patterns, it is possible to judge the presence or absence of parts and the quality of soldering.

Returning to FIG. 1, when the A/D conversion section 33 is supplied with the color signals R, G, and B from the imaging section 25, the A/D conversion section 33 converts the color signals from analog to digital and outputs them to the control section 39. The memory 38 includes a RAM and the like, and is used as a work area for the control section 39. The image processing section 34 performs image processing on the image data supplied via the control section 39 to create the above-mentioned inspected data file and judgment data file, and supplies these to the control section 39 and the judgment section 36.

The teaching table 35 is connected to the control unit 3 during teaching.
When the judgment data file is supplied from the control unit 9, it is stored, and when the control unit 39 outputs a transfer request during inspection, the judgment data file is read out in response to this request and sent to the control unit 39 and the judgment unit. 36 etc.

The determination unit 36 compares the determination data file supplied from the control unit 39 at the time of inspection with the data file to be inspected transferred from the image processing unit 34, and determines the quality of the board 2 to be inspected.
At 0T, it is determined whether the soldering condition is good or bad, and the determination result is output to the control section 39.

The imaging controller 31 includes an interface for connecting the control section 39 with the light projecting section 24 and the imaging section 25, and controls each light emitting body 2B of the light projecting section 24 based on the output of the control section 39.
, 29, 30, and maintains the mutual balance of the light outputs of each hue of the color television camera 32' of the imaging section 25.

The X, Y table controller 37 includes a control section 39 and the
It includes an interface for connecting the axis table section 22 and the Y-axis table section 23, and controls the X-axis table section 22 and the Y-axis table section 23 based on the output of the control section 39.

The CR7 display section 41 is equipped with a cathode ray tube (CRT), and when image data, judgment results, key manual data, etc. are supplied from the control section 39, they are displayed on the screen. When the printer 42 is supplied with the determination result etc. from the control unit 39,
This is printed out in a predetermined format. The keyboard 40 provides operation information and the reference board 20
The keyboard 40 is equipped with various keys necessary for inputting data related to S and the reference to be inspected 20T, and information and data inputted from the keyboard 40 are supplied to the control section 39.

The control unit 39 includes a microprocessor, etc.
The teaching and testing operations are controlled according to the following steps.

First, at the time of teaching, the control section 39 controls each section of the apparatus to turn on the light projecting section 24 and the imaging section 25 at the start point in FIG. 3, and also sets the imaging conditions and data processing conditions. Next, the operator operates the keyboard 40 to register the name of the board to be taught in Step 1 (indicated by "ST1" in the figure), and inputs the size of the board manually, and then in Step 2. , set the reference substrate 2O3 on the Y-axis table section 23 and press the start key. Then, in step 3, when the origin and the points at the upper right and lower left corners of the reference substrate 2O3 are entered manually, the control section 39 controls the X-axis table section 22 and the Y-axis table section 20 based on the input data.
The axis table section 23 is controlled to position the reference substrate 20S to the initial position.

The reference board 20S has a predetermined component 21 at a component mounting position.
S is properly soldered to form a good mounting condition, and labels 50 and 51 as shown in FIGS. 6 and 7 are affixed to approximately the center of the top surface of each component 21S. ing.

These labels 50 and 51 are used to teach the mounting position of the component 21S, the type of the component to be mounted, and the mounting direction, respectively. For a rectangular component 21S, a yellow semicircular label 50 is attached with the arc portion facing the mounting direction, and for a square component 21S, such as a QFP, which has a large number of boards 52 on the four surrounding sides. A red circular label 51 is attached, and other labels of different colors or shapes are attached to chip parts such as square chips (not shown). In the case of this embodiment, the mounting position of the component is taught by the label pasting position, the type of component is taught by the color and shape of the label, and the mounting direction of the component is taught by the label pasting direction. In this embodiment, both the color and shape of the label are used to identify the type of component, but this is to prevent erroneous identification due to independent information.

In this embodiment, a predetermined component 21S is placed at the component mounting position.
The labels 50 and 51 are affixed to the top surface of each component 21S using the reference board 2O3 to which the components are properly soldered, but the present invention is not limited to this. At the mounting position of the above label 50.51
may be attached directly. In the case of the latter,
In addition to the reference board for teaching component positions, it is necessary to separately prepare a reference board for teaching feature parameters to be described later.

Returning to FIG. 3, when the reference board 20S is positioned at the initial position, in step 4, a teaching procedure regarding the mounting position of the component, the type of the mounted component, etc. is started.

FIG. 4 shows the details of this teaching procedure. In step 4-1 of the same figure, the counter i for counting the imaging area of the control unit 39 is initially set to "1", and the content of the counter i is The area on the reference substrate 2O3 is imaged and a first screen is generated (step 4-2).

In FIG. 8, the area on the board 20S is divided vertically and horizontally into 8x2y rectangular areas 53, and each rectangular area 53 corresponds to the size of one screen.First, the screen of the lower left area is is generated and the following procedures (steps 4-3 to 4-10) are executed, and thereafter similar processing is repeatedly executed for each rectangular area 53 along the arrows in the figure.

First, in step 4-3, the image processing section 34 extracts a red region.

Now, each pixel position on the image is represented by coordinates (x, y), and the gray level value of each color signal of the three primary colors for the pixel at coordinates (x, y) is expressed as R(x, y), G(x, y), B
(x, y), each hue value of red, green, and blue r (x, y), g (x, y) b (
x, y) are given by the following 0-0 formula.

htenty tenb Extraction of the red region in step 4-3 is performed using R(x.

y)≧T, and r (x, y)≧T2 (however, T1T
2 is a preset fixed value).

9(1) to (3) show the red area 55 extracted on the image 54, of which FIG. 9(1) shows the red area 55 extracted on the image 54.
4, and FIGS. 9(2) and 9(3) are the end positions of the image 54, where a red area 55 is extracted, respectively.

Next, in step 4-4, a circumscribed rectangle abcd is generated by tracing the outline of this red area 55, and the lengths of two sides of this circumscribed rectangle are both the radius of the label 51! From this, it is determined whether the size of this red area 55 is larger than a certain value, that is, whether this red area 55 corresponds to the image of the red label 51.

If the determination in step 4-4 is "No", the process skips step 4-5 and proceeds to step 4-6, but if the determination in step 4-4 is "YES", the control unit 39 executes the next step 4. -5, the center coordinates of the red region 55 are calculated according to each case of FIG. 9 (1) to (3).

That is, FIG. 9(1) shows a case where the extracted red region 55 does not touch any side of the image 54, and in this case, the center position of the circumscribed rectangle abcd is calculated as the center position of the label 51.

FIG. 9(2) shows a case where the extracted red region 55 touches one side of the image 54, and in this case, a length of 21 is taken from one point a of the circumscribed rectangle abcd in the direction of the line segment ab. A rectangle ab'c' d is created, and the center position of this rectangle is calculated as the center position of the label 51.

FIG. 9(3) shows a case where the extracted red region 55 touches two sides of the image 54, and in this case, the circumscribed rectangle abcd
A rectangle ab'c'd' is created by taking lengths of 21 in each direction of line segments ab and ad from one point a, and the center position of this rectangle is calculated as the center position of the label 51.

When the center position coordinates of this label 51 are determined, the control unit 39
converts these coordinates into a coordinate system on the reference board 20S and uses this as the component position.

Next, the image processing unit 34 extracts a yellow region in step 4-6. Extraction of this yellow region is R(x,
y)≧T, and r (x, y)≧T4 and G(x, y)
≧T, and g (x, y)≧T, and B (x,
This is achieved by extracting pixels that satisfy V ) < T7 and b (x, y) <'rB (where T, ~T, are fixed values set in advance).

FIG. 10 shows the yellow area 57 extracted on the image 56, of which FIG. 10 (1) is the central position of the image 56, and FIG. A yellow region 57 is extracted at each end position.

Next, in step 4-7, a circumscribed rectangle abcd is generated by tracing the outline of this yellow area 57, and the length of one side of this circumscribed rectangle is the radius of the label 50! It is determined whether the size of this yellow area 57 is larger than f/2 and the length of the other side is greater than f/2.
It is determined whether the image corresponds to 0.

If the determination in step 4-7 is "NO", step 4-8 is skipped and the process proceeds to step 4-9; however, when step 4-7 is "YES", the control unit 39 executes the next step. In 4-8, the center coordinates of the yellow region 57 are calculated according to each case of FIG. 10 (1) to (3).

That is, FIG. 1O (1) shows a case where the extracted yellow region 57 does not touch any side of the image 56, and in this case, the center position of the circumscribed rectangle abcd is calculated as the center position of the label 50.

FIG. 10(2) shows that the extracted yellow area 57 is in the image 56.
In this case, one side of the circumscribed rectangle abcd is ! , a rectangle (indicated by a broken line in the figure) with the other side being 2/2 is created, and the center position of this rectangle is calculated as the center position of the label 50.

In Figure 1O (3), the extracted yellow area 57 is the image 56.
In this case, the circumscribed rectangle abc
Create a rectangle (indicated by a broken line in the figure) with one side of d being 2 and the other side being 2/2, and label the center position of this rectangle as 5.
Calculated as the center position of 0.

When the center position coordinates of the label 50 are determined, the control unit 39
converts these coordinates into the coordinate system on the reference board 203 and uses this as the component position.

The control unit 39 also calculates the coordinates of the gravity center position G of the yellow area 57, and determines which direction the arcuate portion of the yellow label 50 faces based on the positional relationship between the gravity center position G and the center position 0. Detect whether there are any. For example, the circumscribed rectangle ab
cd center position coordinates (XOI>'0), yellow area 57
If the center of gravity position coordinates of are (xc, y+,), then Yo=3'
If c + Xo <Xa, it is determined that the arc portion of the yellow label 50 faces leftward.

When the extraction of the red region 51 and the yellow region 50 and the calculation of their center positions are completed in this way, the counter i is incremented by 1 in step 4-9, and all rectangular regions on the reference substrate 20S are It is determined whether the processing for 53 has been completed (step 4-10). If the determination is "NO", the process returns to step 4-2, and the rectangular area 57 on the reference substrate 2O3 corresponding to the contents of the counter i is
Imaging is performed for each time, and the same procedure is performed thereafter.

FIG. 12(1) shows the display screen of the CRT display unit 41 during the progress of the above procedure, and shows a predetermined area 5 on the screen.
8 is a rectangular part 20S with a yellow label 50 attached.
detection position 59 (indicated by the center part of the figure) and detection position 60 (indicated by the figure) of the square component 20S with the red label 51 attached.
) is displayed.

Thus, if the determination in step 4-10 is "YES", the procedure for teaching the component position and type is completed, and the process proceeds to step 5 in FIG. 3, where the reference board 20S is carried out.

In the next step 6, the operator sets the reference board 20S on which predetermined parts are properly mounted at predetermined positions on the Y-axis table section 23, presses the start key on the keyboard 40, and then moves to the inspection area. Start the teaching procedure to set the . Note that in this embodiment, the reference substrate 2
Although the OS used in the teaching procedure of step 4 is reused, it is of course not limited to this.

First, in step 7, the component counting counter j of the control section 39 is initially set to "1", and the control section 39 controls the X-axis table section 2 based on the component position data obtained in the previous teaching.
2 and the Y-axis table section 23 to position the first component 203 within the field of view of the television camera 32 and image the component.

FIG. 11 specifically shows a method of setting the inspection area for the image 61 of the SOP component obtained by this imaging. This method applies to the image 61 by forming rectangular areas 62A and 62 indicated by chain lines in FIG. 11(1) corresponding to both sides of the SOP component.
B, and after automatically extracting the image 63 of the land portion on the board in each rectangular area 62A, 62B, each rectangular area 6
2A and 62B, a circumscribed rectangle including the image 63 of each land portion is found, and further enlarged by a certain width, as shown in FIG. 11 (2).
The rectangular areas 64A and 64B shown in are found and set as inspection areas. Although the method for setting the inspection area for SOP parts has been exemplified here, it goes without saying that the inspection areas for other parts can also be set using a similar method.

After the inspection area has been set for the first part in this way, when the operator presses the next key on the keyboard 40 in step 9, the counter j is incremented by 1, and all It is determined whether an inspection area has been set for the part (step 10.11). If the determination in step 11 is NO'', the next part will be imaged and the same procedure as above will be executed.

FIG. 12(2) shows the display screen of the CRT display unit 41 during the progress of the above procedure, and each time the inspection area for the component is set in the area 58 at the component detection position 59, 60, the Display according to the shape and size of 65.66
It switches to

In this way, the same process is repeatedly executed for all the parts, and when the determination in step 11 becomes "YES", the reference substrate 20S is carried out, and the process moves to the characteristic parameter teaching procedure.

First, in step 13, the counter n for counting the number of boards in the control unit 39 is initially set to "1", and then the next step 1
In step 4, the operator sets the first reference board 20S (on which the specified parts are properly mounted and soldered in the specified positions) on the Y-axis table section 23, and presses the start key on the keyboard 40. When operated, in step 15, the control section 39 controls the X-axis table section 22 and the Y-axis table section 23 based on the component position data obtained in the previous teaching.
is controlled so that the field of view of the television camera 32 is sequentially positioned on each component and images are taken.

The color signals R of the three primary colors obtained in each imaging operation,
G and B are A/D converted by the A/D converter 33, and the conversion results are stored in the memory 38 in real time. Next, the control section 39 causes the image data corresponding to each hue to be transferred from the memory 38 to the image processing section 34 for the inspection area of each component obtained in the previous teaching, and the image processing section 34 processes the image data of each hue. The data is binarized using an appropriate threshold value for each hue, etc. After detecting the normal soldering state of each land as red, green, and blue patterns, the characteristics of these patterns are used as feature parameters. Calculated as

When extraction of feature parameters for each component is completed for the first reference board 20S, that board is carried out, the counter n is incremented by 1, the second reference board 20S is designated, and the process is similar to the above. The feature parameter extraction process is executed in the following steps.

When the feature parameter extraction process for a predetermined number (n) of reference substrates 20S is completed in this way, step 1
The determination in step 6 becomes "YES" and the process proceeds to step 8. In step 18, the control unit 39 statistically processes the feature parameters of the n reference boards 203 to obtain average value data in order to obtain the average feature amount for each component, and makes a judgment based on this average value data. A data file is created and stored in the teaching table 35, and the data is corrected as necessary to complete the teaching.

When the teaching is completed in the above manner, this board inspection apparatus is in a state where it is possible to automatically inspect the board to be inspected 20T after soldering.

(The operator then shifts to the inspection mode shown in FIG. 5, selects the name of the board to be inspected in step 1.2, and performs an operation to start the board inspection.

The next step 3 is to transfer the substrate 20 to be inspected to the substrate inspection device.
The supply of T is being checked, and if the determination is "YES", the conveyor 27 is activated, the substrate to be inspected 20T is carried into the Y-axis table section 23, and the substrate inspection is started (steps 4 and 5).

In step 5, the control section 29 controls the X-axis table section 22
and controls the Y-axis table section 23 to position the field of view of the television camera 32 to take an image of the first component 21T on the board to be inspected, and automatically extract each land area within the inspection area. The characteristic parameters of each land area are calculated to create a data file to be inspected.

Next, the control unit 39 transfers the inspection data file to the determination unit 36, compares the inspection data file with the determination data file, and selects the first part 21T.
Have them judge whether the soldering is good or bad.

This kind of inspection is performed on all parts 21 on the board 20T to be inspected.
As a result, if there is a defect in soldering, the defective part and the details of the defect are displayed on the CRT display section 4.
1 or printed on the printer 42, the substrate to be inspected 20T is carried out from the inspection position (steps 7-8).

FIG. 12 (3) shows the CR7 display section 4 displaying the determination results.
1 shows the display screen of No. 1.

In the screen shown in the figure, the area 58 has the above-mentioned parts display 65.
．． 66 is performed, and the soldering is performed on the defective part 65'.
is displayed in a specific color, and in a screen area 67 below it, details of the failure of the component 65' designated by the operator as defective in soldering are displayed in detail.

Note that the parts specified by the operator are clearly displayed on this screen in a color different from the color indicating the defective soldered part 65'.

<Effects of the Invention> As described above, the present invention supplies labels affixed to component mounting positions on a board to a board inspection device and shakes each label, thereby mounting components from the label affixing positions. Since the position is taught and the type of part is taught from the color or shape of the label, it is easy to create a board for teaching, and it is also economical because the board can be reused by peeling off the label. It is true.

Further, according to the teaching method of the present invention, not only the position of the parts but also the type of the parts can be taught, which achieves the remarkable effect of achieving the object of the invention.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing the overall configuration of the board inspection device, FIG. 2 is an explanatory diagram showing the relationship between the soldering condition and the pattern, and FIGS. 3 and 4 are flowcharts showing the teaching procedure. FIG. 5 is a flowchart showing the inspection procedure, FIGS. 6 and 7 are plan views of parts showing the state of label attachment, FIG. 8 is an explanatory diagram showing the divided areas on the board and the order of processing, and FIG. 10 and 10 are explanatory diagrams showing the image of the label extracted on the image and its circumscribing rectangle, FIG. 11 is an explanatory diagram showing the method of setting the inspection area, and FIG.
FIG. 13 is an explanatory diagram showing the principle of a conventional automatic inspection device; FIGS. 14 and 15 are diagrams illustrating the principle of the automatic inspection device. 20S...Reference board 21S...Part 5
0, 51...Label

Claims (1)

[Scope of Claims] A teaching method for teaching a board inspection device that inspects mounted components on a board about the mounting position of the component and the type of the mounted component prior to inspecting the board, the teaching method comprising: On the other hand, by supplying labels affixed to the component mounting positions on the board and imaging each label, the mounting position of the component can be taught from the label affixing position, and the component mounting position can be determined from the color or shape of the label. A teaching method in a board inspection apparatus characterized by teaching a type.