JPH027475Y2 - - Google Patents
Info
- Publication number
- JPH027475Y2 JPH027475Y2 JP14308684U JP14308684U JPH027475Y2 JP H027475 Y2 JPH027475 Y2 JP H027475Y2 JP 14308684 U JP14308684 U JP 14308684U JP 14308684 U JP14308684 U JP 14308684U JP H027475 Y2 JPH027475 Y2 JP H027475Y2
- Authority
- JP
- Japan
- Prior art keywords
- cutting line
- printed wiring
- wiring board
- cutting
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000001514 detection method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
（技術分野）
本考案は印刷配線板に関し、とくに直接的に編
集された印刷配線板を分離する切削ラインの良否
を検出する構造に関する。[Detailed Description of the Invention] (Technical Field) The present invention relates to printed wiring boards, and more particularly to a structure for detecting the quality of cutting lines separating directly edited printed wiring boards.
（従来技術）
一般に、電気部品の自動実装の効率化を図るた
め、第３図に示す如く連続的に集合化した編集基
板１は従来列の個々の領域の印刷配線板１ａ，１
ｂ毎に導体の回路パターン４をそれぞれ形成した
ものを連続的に接続編集し、自動実装に必要な基
準孔を設けて電気部品実装後の個々の印刷配線板
１ａ，１ｂに分離するため、第４図に示すように
断面Ｖ字状の切削ライン３を編集基板１の表裏面
に施したものである。第３図に示すように断面Ｖ
字状の切削ライン３の上には回路パターン４及び
ソルダーレジスト被膜５は設けられていないた
め、断面Ｖ字状の切削ライン３を形成後の切削ラ
イン上の色調は同一色であるため、断面Ｖ字状の
切削ライン３形成の有無の目視チエツクでは混同
し間違えやすい。また、表裏面の切削ライン形成
後の位置ズレの検出は、図面との照合作業及び定
規等の治具を用いて検出しなければならないた
め、検出の工数は膨大であつた。さらに、検出の
見逃し等により良品中に検出洩れによる不良品の
混入が生じることがあつた。(Prior Art) In general, in order to improve the efficiency of automatic mounting of electrical components, as shown in FIG.
Conductor circuit patterns 4 are formed for each circuit pattern 4 for each circuit board, and the circuit patterns 4 are connected and edited continuously, and reference holes necessary for automatic mounting are provided to separate the printed wiring boards 1a and 1b after electrical components are mounted. As shown in FIG. 4, cutting lines 3 having a V-shaped cross section are formed on the front and back surfaces of the editing board 1. As shown in Figure 3, the cross section V
Since the circuit pattern 4 and the solder resist film 5 are not provided on the cutting line 3 having a V-shaped cross section, the color tone on the cutting line after forming the cutting line 3 having a V-shaped cross section is the same color, so the cross section Visually checking the presence or absence of the V-shaped cutting line 3 is easy to confuse and make a mistake. In addition, detection of positional deviations after cutting lines have been formed on the front and back surfaces requires comparison with drawings and the use of a jig such as a ruler, which requires an enormous number of man-hours. Furthermore, due to missed detection, defective products may be mixed in with good products due to missed detection.
（考案の目的）
本考案の目的はかかる従来の欠点を解消した印
刷配線板を提供することにある。(Purpose of the invention) An object of the invention is to provide a printed wiring board that eliminates such conventional drawbacks.
（考案の構成）
本考案によれば単一の印刷配線板を複数連接し
て編集した配線板と、上記配線板の連接部に単一
の印刷配線板毎に切断分離する切削ライン上に切
削ラインの幅より広い帯状の絶縁性被膜を設けた
ことを特徴とする印刷配線板が得られる。(Structure of the invention) According to the invention, a wiring board is created by connecting and editing a plurality of single printed wiring boards, and cutting is performed on a cutting line that cuts and separates each single printed wiring board at the joint part of the wiring board. A printed wiring board is obtained which is characterized by having a band-shaped insulating coating wider than the width of the lines.
（実施例）
以下、本考案の実施例を第１図及び第２図を参
照して説明する。(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.
個別の印刷配線板１１ａ，１１ｂが連続的に編
集された編集基板１１であり、破線で示した仮想
分離ライン２上に切削ライン３の開口部の幅より
幅の広いソルダーレジスト被膜６を回路パターン
４の配設した製品領域内のソルダーレジスト被膜
５を形成すると同時に公知のスクリーン印刷手段
などにより被着形成する。次に刃の先端の断面が
Ｖ字型をした切削カツターを用いた切削機で編集
基板１１の仮想分離ライン２に第４図に示す如く
断面Ｖ字状の切削ライン３を形成すると仮想分離
ライン２上の被着した切削ライン３の幅より幅の
広いソルダーレジスト被膜６の一部が切削ライン
３の幅で削除された切削ライン３の形成前と形成
後の区別が容易に検出できる状態になる。また、
切削ライン３の左右に平行に残存したソルダーレ
ジスト被膜６の幅の状態をチエツクすることによ
り切削ライン位置も容易に検出できる。 This is an editing board 11 in which individual printed wiring boards 11a and 11b are continuously edited, and a solder resist film 6 wider than the width of the opening of the cutting line 3 is formed on the virtual separation line 2 shown by the broken line in a circuit pattern. At the same time as forming the solder resist film 5 in the product area provided in 4, the solder resist film 5 is adhered by a known screen printing means or the like. Next, a cutting line 3 having a V-shaped cross section as shown in FIG. 4 is formed on the virtual separation line 2 of the editing board 11 using a cutting machine using a cutting cutter whose blade tip has a V-shaped cross section. A part of the solder resist film 6 that is wider than the width of the cutting line 3 adhered on 2 is removed by the width of the cutting line 3, and the difference between before and after the formation of the cutting line 3 can be easily detected. Become. Also,
By checking the width of the solder resist film 6 remaining parallel to the left and right sides of the cutting line 3, the position of the cutting line can be easily detected.
以上、本考案により(i)切削ライン形成前と形成
後の色調が異なるため、切削ライン形成の有無を
混同して間違えることがなくなる。(ii)また、切削
ライン形成後のソルダーレジスト被膜の残り幅の
測定により位置ズレを容易に検出することができ
るので、検出工数を大幅に短縮することができ
る。(iii)さらに不良品の検出精度が向上するので印
刷配線板の信頼性を向上させることができる。 As described above, according to the present invention, (i) since the color tone before and after the cutting line is formed is different, it is no longer possible to confuse the presence or absence of the cutting line and make a mistake. (ii) Furthermore, positional deviations can be easily detected by measuring the remaining width of the solder resist film after the cutting line is formed, so the number of steps for detection can be significantly reduced. (iii) Furthermore, since the detection accuracy of defective products is improved, the reliability of printed wiring boards can be improved.
第１図、第２図は本考案の一実施例の切削ライ
ン形成の前後の印刷配線板の正面図および斜視
図。第３図、第４図は従来の切削ライン形成後の
印刷配線板のそれぞれ正面図および側面図。
１，１１……編集基板、１ａ，１ｂ，１１ａ，
１１ｂ……印刷配線板、２……仮想分離ライン、
３……切削ライン、４……回路パターン、５……
（回路パターン領域内の）ソルダーレジスト被膜、
６……（切削ライン幅より幅の広い）ソルダーレ
ジスト被膜。
1 and 2 are a front view and a perspective view of a printed wiring board before and after cutting lines are formed according to an embodiment of the present invention. FIGS. 3 and 4 are a front view and a side view, respectively, of a printed wiring board after conventional cutting lines have been formed. 1, 11...Editing board, 1a, 1b, 11a,
11b...Printed wiring board, 2...Virtual separation line,
3...Cutting line, 4...Circuit pattern, 5...
solder resist coating (in the circuit pattern area),
6...Solder resist film (wider than the cutting line width).
Claims (1)
板と、前記配線板の連接部に単一の印刷配線板毎
に切断分離する切削ライン上に切削ラインの幅よ
り広い帯状の絶縁性の被膜を設けたことを特徴と
する印刷配線板。 A wiring board made by connecting and editing a plurality of single printed wiring boards, and a strip-shaped insulating strip wider than the width of the cutting line on the cutting line that cuts and separates each single printed wiring board at the joint part of the wiring board. A printed wiring board characterized by being provided with a film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14308684U JPH027475Y2 (en) | 1984-09-21 | 1984-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14308684U JPH027475Y2 (en) | 1984-09-21 | 1984-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6159369U JPS6159369U (en) | 1986-04-21 |
| JPH027475Y2 true JPH027475Y2 (en) | 1990-02-22 |
Family
ID=30701399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14308684U Expired JPH027475Y2 (en) | 1984-09-21 | 1984-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH027475Y2 (en) |
-
1984
- 1984-09-21 JP JP14308684U patent/JPH027475Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6159369U (en) | 1986-04-21 |
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