JPH0273659A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPH0273659A
JPH0273659A JP22613688A JP22613688A JPH0273659A JP H0273659 A JPH0273659 A JP H0273659A JP 22613688 A JP22613688 A JP 22613688A JP 22613688 A JP22613688 A JP 22613688A JP H0273659 A JPH0273659 A JP H0273659A
Authority
JP
Japan
Prior art keywords
plating
leads
frame
lead frame
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22613688A
Other languages
Japanese (ja)
Inventor
Seiji Takao
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP22613688A priority Critical patent/JPH0273659A/en
Publication of JPH0273659A publication Critical patent/JPH0273659A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent silver plating from leaking from its side face, to easily manufacture to finish solder plating in a sheath plating step, and to improve the reliability of a lead frame by forming at least one protrusion on two side face of the inner leads of a frame for a resin-sealed semiconductor device.
CONSTITUTION: Protrusions 6 are formed on the side faces of the inner leads 2 of a lead frame for a semiconductor device, and formed by pressing or etching at the time of manufacture of the frame. The protrusions 6 are provided at the leads 2 thereby to shut OFF the leakage of the silver plating by the protrusions 6 to prevent a silver plating film 5 from forming to the side face of outer leads 3. This process prevents the silver plating from leaking to the side face to easily manufacture solder plating finish in a sheath plating step, thereby improving the reliability of the frame.
COPYRIGHT: (C)1990,JPO&Japio
JP22613688A 1988-09-08 1988-09-08 Lead frame for semiconductor device Pending JPH0273659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22613688A JPH0273659A (en) 1988-09-08 1988-09-08 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22613688A JPH0273659A (en) 1988-09-08 1988-09-08 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPH0273659A true JPH0273659A (en) 1990-03-13

Family

ID=16840414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22613688A Pending JPH0273659A (en) 1988-09-08 1988-09-08 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPH0273659A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7801466B2 (en) 2006-05-19 2010-09-21 Ricoh Company, Limited Developing device and image forming apparatus
JP2011003903A (en) * 2009-06-17 2011-01-06 Lsi Corp Lead frame design for improving reliability

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7801466B2 (en) 2006-05-19 2010-09-21 Ricoh Company, Limited Developing device and image forming apparatus
JP2011003903A (en) * 2009-06-17 2011-01-06 Lsi Corp Lead frame design for improving reliability

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