JPH0271968A - Surface polishing method for flat members such as surface polishing in the manufacturing process of printed wiring boards - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention was developed as a surface polishing method for printed circuit boards for surface treatment of printed circuit boards in the process of manufacturing printed circuit boards, but it is widely applicable to flat members. It can be implemented as a surface polishing method.

[Conventional technology]

Patent application filed on November 10, 1988 by the applicant
The surface polishing method for a flat member disclosed in Japanese Patent No. 283368 discloses a method for polishing the surface of a flat member using a polishing member that moves eccentrically in the plane.

According to the above-described invention, unlike the bristles of a rotating brush, which are given different energy depending on their radial distance, the bristles of an eccentrically moving brush are each given the same energy and perform the same abrasive action on the planar member, thereby improving the brush's performance. Wear is also even.

In addition, the applicant has proposed that conventional polishing devices each perform a single function, and although it is natural from a structural and functional point of view, in cases where there is relatively little equipment allowance, for example, in the case of a polishing brush and a polishing wheel, In the method of polishing the surface of a flat member using a polishing member that moves eccentrically in a plane where continuous work is desired, polishing is performed using a roughly rectangular brush on the upstream side and a polishing member on the downstream side. We have just filed a patent application No. 71167/1983 for a method for polishing the surface of a flat member.

Therefore, the invention related to the application will be explained below.

FIG. 2 is a perspective view showing the configuration of the surface polishing apparatus 1 for carrying out the printed circuit board surface polishing method, FIG. 3 is a front view of the main parts of FIG. 2, and FIG. 4 is the surface of the printed circuit board. FIG.

As shown in the figure, the surface polishing device 1 includes a transport device 3 for transporting a printed circuit board 2 (see FIG. 3), and a transport device 3 for transporting a printed circuit board 2 (see FIG. 3).
The apparatus is comprised of a polishing section 4 for polishing the surface 2a of the printed circuit board 2 conveyed through the system, and an apparatus body 5 that houses the conveyance device 3 and the polishing section 4.

The conveying device 3 includes two conveying rolls 6.7 configured to be rotatably driven, and an endless belt 8 wound around the conveying rolls 6.7.
It is composed of so-called belt conhair. Reference numeral 9 indicates a conveyance guide roll for guiding the conveyance of the printed circuit board 2.

The polishing brush section 4 includes a brush body (or scotch) 10, a brush holding section 11 that holds the brush body 10, and an eccentric shaft 12 with polishing wheels 15 arranged in parallel on the downstream side. As shown in FIG. 4, the brush main body 10 is formed in a brush holder 11 that is relatively long and rectangular in plan.

The brush holder 11 and the grindstone 15 are set to be eccentrically driven via the eccentric shaft 12. That is, the brush holder 11 and the polishing wheel 1 are eccentrically driven via the eccentric shaft 12.
5, the lines on the surface of the printed circuit board 2 (stripes polished by a brush) are set evenly in the front-back and left-right directions of the board surface, and are further set smooth by a polishing wheel.

An opening 13 is provided on the side surface of the device main body 5 for carrying (supplying) the printed circuit board 2 to be subjected to surface polishing into the device;
An opening 14 is opened for carrying out (discharging) the printed circuit board 2 after the surface polishing process out of the apparatus. In addition, opening 1
3.14 may be set for import or export.

Next, the surface polishing device 1 having the above configuration is used to print i.
A method for polishing the surface 2a of the plate 2 will be explained.

First, the printed circuit board 2 to be surface polished is placed in the opening 13 (
Or, it is supplied into the device through the opening 14).

Next, the supplied printed circuit board 2 is transported toward the polishing brush section 4 via the transport device 3.

Next, the brush main body (brush) 10 and grindstone 15 of the polishing brush section 4 are eccentrically moved via the eccentric shaft 12 to polish the surface 2a of the printed substrate Fi2 that has been transported. Due to the eccentric movement of the brush body 10 and the grinding wheel 15, the printed circuit board 2
A spiral "brush pattern" is formed on the surface of the printed circuit board 2a, and the surface 2a of the printed circuit board is smoothly roughened by the spiral "brush pattern" and is further smoothed by the grindstone 15.

Then, as a final step, the printed circuit board 2 whose surface has been smoothed and polished is transferred to the transport device 1i! 3
It is conveyed in the direction of the opening 14 (or the opening 13) through the opening 14, and is carried out of the apparatus through the opening 14.

Figure 5.6 shows an embodiment suitable for polishing relatively soft materials such as the W4 foil of printed circuit boards.

The brush 10 includes a large number of brush bundles 16, and the fibers constituting each brush bundle 16 contain an abrasive material. The main body 11 has a large number of water supply holes 18, and water is injected from a water supply device (not shown). In the illustrated example, the parallel grindstones 15 are rubber grindstones. This configuration allows different types of abrasive members to be used in parallel to obtain the desired finish without the need for extremely precise relative position adjustment devices.

By the above polishing method, the flat brush body 10 and the grinding wheel 1 are
5 is eccentrically moved via the eccentric shaft 12 for polishing, a smooth finish is obtained with uniform brush marks, and therefore, the printed circuit board surface 2a is polished smoothly. As a result, the surface roughness is smoothed, and the lamination adhesion in the post-process and the ink cutting performance in the printing process are all improved.
Fine Bakoon formation can be achieved. Moreover, since the brush shape is not circular but flat, the brush can be easily processed and costs can be reduced.

Further, since the structure is simple and the processing line can be set extremely short, there is an advantage that the apparatus can be simplified and costs can be reduced.

(Problems to be Solved by the Invention) Now, the invention disclosed in the above-mentioned application of the applicant makes it possible to perform surface polishing of the intended planar member. In particular, we are proposing a surface polishing method that is most suitable for surface polishing after hole filling in copper through-hole printed wiring boards.

That is, the object of the present invention is to provide a surface Vr@ method for obtaining appropriate polishing of the hole-filled portion and surface finish without unnecessary polishing of the copper foil portion.

[Means to solve the problem]

The present invention further improves the above-mentioned invention of the applicant, and uses the following method as a means for achieving the above-mentioned object.

In a method of polishing the surface of a flat member using a polishing member that moves eccentrically or a rotary polishing member, a plurality of brush bundles are arranged in a brush holder provided with a plurality of jetting holes for polishing liquid, and each brush bundle is Polishing is performed using a polishing member coated with a polishing cloth, and in conjunction with the polishing by the polishing member, polishing is performed while spouting a polishing liquid from a polishing liquid jet hole of the polishing member.

[Effect]

The present invention provides a method for polishing the surface of a flat member using a polishing member that moves eccentrically or a rotary polishing member, in which a plurality of brush bundles are disposed in a brush holder provided with a plurality of jetting holes for polishing liquid, and each brush is The brush bundle is polished by polishing the bundle with a polishing member coated with a steel-like polishing cloth, and in conjunction with the polishing by the polishing member, the polishing liquid is spouted from the jet hole of the polishing liquid of the polishing member, thereby polishing the brush bundle. The elasticity and the steel-like abrasive cloth covering it prevent unnecessary wear and scratches on the surface to be polished, and the jetting of the polishing liquid provides an appropriate polishing action for the final polished surface from the hole-filling portion 9. be.

〔Example〕

The polishing method of the present invention will be explained below.

FIG. 1 shows a polishing brush section used in the polishing method of the present invention, FIG. 1a is a front view of the polishing brush section, and FIG. 1 is a perspective view of the main body of the polishing brush section.

The polishing brush section 40 shown in the first diagram includes a brush body 41 and a brush holding section 42 that holds the brush body 41, as well as a metal steel-like polishing cloth 43 that covers the brush body 41.

As shown in FIG. 1a, the brush body 41 includes a brush bundle 45 planted on a long rectangular planting plate 44, and a polishing liquid ejection hole 46 formed in the planting plate 44. It is composed of:

Further, the brush holding portion 42 has a shape corresponding to the planting plate 44 that is sufficient to hold the brush main body 4X, and
It is constructed by drilling water supply holes 47 for the polishing liquid at positions corresponding to the respective ejection holes 46 drilled in 4.

Furthermore, the hard polishing cloth 43 is made of a woven cloth made by weaving metal fibers into a steel-like shape, and after covering each brush bundle 45 side of the brush body 41 with the woven cloth having a desired shape, the open ends 43a and 43b are attached to the brush body. 41 (see Fig. 1), and the open ends 43a, 43b are fixed to the upper side of the brush body 41 with adhesive or the like, and then the brush holding part 42 is overlapped with the upper side of the brush body 41, and both By fixing them, the open ends 43a and 43b of the steel-like polishing cloth 43 can be inserted and fixed to form the polishing brush section 40.

Each brush bundle 45 is made of a fiber bundle made of metal or synthetic resin, and the steel polishing cloth 43 is made of a woven fabric made of synthetic resin fiber or other fibers instead of a woven fabric made of metal fiber. It is also possible to configure various configurations, and the polishing method can be selected and implemented depending on the requirements of the surface to be polished and its finished surface.

Similarly, a steel polishing cloth 4 made of these woven cloths is also prepared.
3. Depending on the type of surface to be polished or the requirements for the finished surface, diamond or other abrasive grains are fixed by means of vapor deposition or the like.

Now, the polishing brush section 40 having the above configuration is replaced with the polishing brush section 4 shown in the second figure, and is attached to the eccentric shaft 12, and the surface of a desired planar member is polished by the surface polishing apparatus 1 shown in the second figure.

Therefore, the implementation of the method of the present invention by the surface polishing apparatus 1 shown in FIG. 2 differs only in the configuration in which the polishing brush section 40 is used, and the other methods are as shown in FIGS. 2, 3, and 4. This polishing method is similar to the polishing method, and for example, the method of polishing the surface 2a of the printed circuit board 2 shown in the figure will be explained below.

Incidentally, polishing of the surface 2a of the printed circuit board 2 is performed, for example, in the production of copper through-hole printed wiring boards, by drilling the required holes in a tear-stretched laminate, and then plating the through-holes. The purpose is to fill the through holes after plating with UV curing resin (or thermosetting resin) and harden the resin to fill the holes and then polish the surface.

First, the pudding is surface polished!・Opening 13 in substrate 2
(or opening 14) into the device.

Next, the supplied printed circuit board 2 is transported toward the polishing brush section 40 via the transport device 3.

Next, the polishing brush section 40 is eccentrically moved via the eccentric shaft 12, and polishing fluid is supplied to the polishing brush section 4o from a polishing fluid supply section (not shown) through the supply hole 47 and the jet hole 45. The surface 2a of the printed circuit board 2 that has been transported is polished while spouting a polishing liquid. By such polishing,
The required polishing of the surface 2a can be performed while effectively removing the UV cured resin (or thermoset resin) without damaging the copper foil surface on the front side 2a of the printed circuit board 2.

In other words, for this type of surface polishing, one method of belt sanding has traditionally been adopted, which can severely damage the copper foil surface and cause electrical defects such as disconnections, poor soldering, or short circuits in printed wiring in subsequent processes. However,
Implementation of the method of the present invention can eliminate such drawbacks, and in the case of a one-way belt sanguine, there is a work disadvantage due to clogging of the belt sanguine, and in order to prevent this, replacement of the belt sanguine is required, which is costly. However, by implementing the method of the present invention, it has been found that these points can be significantly improved both operationally and economically.

As for the polishing liquid, the polishing is carried out by mixing a solution that can act to remove UV or thermosetting resin in addition to increasing the original polishing action.

Then, as a final step, the printed circuit board 2 whose surface has been polished with a smoothed surface is transported toward the opening 14 (or opening +3) via the transport device 3, and transported out of the device from the opening 14. .

Incidentally, in the above embodiment, a method of polishing while moving the polishing brush part 40 eccentrically in a plane has been described, but the polishing brush part 4
Of course, it is also possible to polish while rotating 0.

[Effects of the Invention] As described above, according to the method of the present invention, the surface polishing of a flat member such as a printed circuit board in the manufacturing process of printed wiring boards can be performed with the necessary polishing step 2 and an appropriate finished surface. The workability and economic efficiency of this type of polishing can be improved.

[Brief explanation of the drawing]

Fig. 1 shows a polishing brush section used in carrying out the present invention, Fig. 1a is a front view, Fig. 1 is a perspective view of the brush main body, Fig. 2 is a perspective view showing a polishing device, Fig. 3 is a front view of the main parts of Fig. 2, Fig. 4 is a perspective view showing the state in which the surface of the printed circuit board is being polished, Fig. 5 is a plan view showing an example of the brush and grindstone, and Fig. FIG. 6 is an end view of FIG. 5. 2...Printed circuit board 2a...Surface 4.40
... l1IFa brush part 10.41 ... brush body 12 ... eccentric shaft 15 ... polishing whetstone 45 ... brush bundle 18 ... water supply hole 42 ... plan holding part 43 ... steel Polishing cloth 44...planting plate 46...spout hole 47...water supply hole

Claims (4)

[Claims] (1) In a method of polishing the surface of a flat member using a polishing member that moves eccentrically in the plane or a rotating polishing member, a plurality of brush bundles are arranged in a brush holder having a plurality of jetting holes for polishing liquid, and each brush is The bundle is polished with a polishing member coated with a steel-like polishing cloth, and in conjunction with the polishing with the polishing member, the bundle is polished while spouting a polishing liquid from a polishing liquid jet hole of the polishing member. A method for polishing the surface of a flat member. (2) The steel-like polishing cloth is made of a woven cloth made of metal fibers or other fibers, and is used for surface polishing of planar members such as surface polishing in the manufacturing process of printed wiring boards according to claim 1. Method. (3) The steel-like polishing cloth has diamond or other abrasive grains fixed thereto by vapor deposition or other means, and is used for surface polishing, etc. in the manufacturing process of the printed wiring board according to claim 1. A method for polishing the surface of a flat member. (4) The polishing liquid is a solution such as water, hot water, soda carbonate, or other polishing liquid. Polishing method.