JPH01246060A - Surface polishing device for plane member - Google Patents
Surface polishing device for plane memberInfo
- Publication number
- JPH01246060A JPH01246060A JP7116988A JP7116988A JPH01246060A JP H01246060 A JPH01246060 A JP H01246060A JP 7116988 A JP7116988 A JP 7116988A JP 7116988 A JP7116988 A JP 7116988A JP H01246060 A JPH01246060 A JP H01246060A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- polishing
- printed circuit
- circuit board
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 49
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板を製造する工程においてプリント
基板の表面処理を行うためのプリンl板の表面研磨装置
として開発されたものであるが広く平面部材の表面研磨
装置としても使用できる。Detailed Description of the Invention [Field of Industrial Application] The present invention was developed as a surface polishing device for printed circuit boards for surface treatment of printed circuit boards in the process of manufacturing printed circuit boards. It can also be used as a surface polishing device for parts.
出願人の昭和62年11月10日出願に係る特願昭62
−283368号の平面部材の表面研磨方法とその装置
には平面偏心運動する研磨部材にて平面部材表面を研磨
することが記載されている。Patent application filed on November 10, 1988 by the applicant
Japanese Patent Publication No. 283368 describes a method for polishing the surface of a flat member and an apparatus therefor, in which the surface of the flat member is polished by a polishing member that moves eccentrically in the plane.
上述の発明によって、回転ブラシの毛が半径方向距離に
よって異なるエネルギを付与されるのと異なり、偏心運
動ブラシの毛は夫々同じエネルギを付与され、平面部材
に対して同し研磨作用を行い、ブラシの摩耗も均等であ
る。According to the above-described invention, unlike the bristles of a rotating brush, which are given different energies depending on their radial distance, the bristles of an eccentrically moving brush are each given the same energy and perform the same abrasive action on the planar member. wear is also uniform.
〔発明が解決しようとする課題]
従来の研磨装置は夫々単一の機能を行う構成であり、構
造機能上から当然とされているが比較的研摩代の少ない
場合、例えば研磨ブラシと研磨砥石の場合には連続作業
とすることが希望される。[Problems to be Solved by the Invention] Conventional polishing devices each have a configuration that performs a single function, and although it is natural from the structural and functional standpoint, when the polishing amount is relatively small, for example, the polishing brush and the polishing wheel are In some cases, continuous work is desirable.
(課題を解決するための手段〕
本発明の目的は上述の課題を解決することにある0本発
明による平面部材の表面研磨装置は平面偏心運動する研
磨部材にて平面部材表面を研磨する場合に、上記研磨部
材をほぼ長方形として上流側のブラシと下流側の研磨砥
石から成ることを特敗とする。(Means for Solving the Problems) An object of the present invention is to solve the above-mentioned problems. A surface polishing device for a flat member according to the present invention is suitable for polishing the surface of a flat member with a polishing member that moves eccentrically in the plane. , it is assumed that the polishing member is approximately rectangular and consists of a brush on the upstream side and a polishing stone on the downstream side.
本発明の他の特徴は、研磨面が平面な研磨部材を、偏心
軸を介して平面偏心運動可能に保持して構成した場合に
、上記研磨部材をほぼ長方形として上流側のブラシと下
流側の研磨砥石から成り、同時に上記偏心軸によって駆
動する。Another feature of the present invention is that when a polishing member having a flat polishing surface is held so as to be capable of eccentric movement in a plane through an eccentric shaft, the polishing member is formed into a substantially rectangular shape and has a brush on the upstream side and a brush on the downstream side. It consists of a grinding wheel and is simultaneously driven by the eccentric shaft mentioned above.
〔作用]
上述の構成によって、偏心駆動の特性を利用して研磨ブ
ラシと研磨砥石とを並列させて同しモータによって駆動
でき、平面部材の表面の仕上までの装置は著しく簡単に
なる。[Operation] With the above-described configuration, the polishing brush and the polishing wheel can be driven in parallel by the same motor by utilizing the characteristics of eccentric drive, and the apparatus for finishing the surface of a flat member can be significantly simplified.
本発明を例示とした実施例並びに図面について説明する
。平面部材としてプリント基板の研磨を例示するが、こ
れに限定されない。Embodiments and drawings illustrating the present invention will be described. Although polishing of a printed circuit board is exemplified as a planar member, the present invention is not limited thereto.
第1図は、本発明に係るプリンl−1板表面研摩を実施
するための表面研磨装置1の構成を示す斜視図、第2図
は、第1図の要部の正面図、第3図は、プリント基板の
表面を研磨している状態を示す斜視図である。FIG. 1 is a perspective view showing the configuration of a surface polishing apparatus 1 for polishing the surface of a pudding l-1 plate according to the present invention, FIG. 2 is a front view of the main parts of FIG. 1, and FIG. FIG. 2 is a perspective view showing a state in which the surface of a printed circuit board is being polished.
図に示すように表面研磨装置Iは、プリント基板2(第
2図参照)を搬送するための搬送装置3と、搬送装置3
を介して搬送されるプリント基板2の表面2aを研磨処
理するための研磨部4と、搬送装置3及び研磨部4を収
容する装置本体5等より構成しである。As shown in the figure, the surface polishing apparatus I includes a transport device 3 for transporting a printed circuit board 2 (see FIG. 2), and a transport device 3 for transporting a printed circuit board 2 (see FIG. 2).
The apparatus is comprised of a polishing section 4 for polishing the surface 2a of the printed circuit board 2 conveyed through the system, and an apparatus body 5 that houses the conveyance device 3 and the polishing section 4.
搬送装置3は、回転駆動自在に構成された2本の搬送ロ
ール6.7と、搬送ロール6.7に巻回された無端帯8
とより構成してあり、いわゆるベルトコンベアーにて構
成しである。9で示すのは、プリント基板2の搬送案内
用の搬送ガイドロールである。The conveying device 3 includes two conveying rolls 6.7 configured to be rotatably driven, and an endless belt 8 wound around the conveying rolls 6.7.
It is composed of a so-called belt conveyor. Reference numeral 9 indicates a conveyance guide roll for guiding the conveyance of the printed circuit board 2.
研磨ブラシ部4は、ブラシ本体(又はスコツチ)10と
、ブラシ本体lOを保持するブラシ保持部11と、下流
側に並列した研磨砥石15を偏心軸12とより構成しで
ある。ブラシ本体10は、第3図にて示すごとく比較的
長尺の平面矩形状のブラシ保持部11に形設しである。The polishing brush section 4 is composed of a brush main body (or Scotchi) 10, a brush holding section 11 that holds the brush main body 10, and an eccentric shaft 12 with a polishing grindstone 15 arranged in parallel on the downstream side. As shown in FIG. 3, the brush body 10 is formed in a brush holding portion 11 that is relatively long and rectangular in plan.
ブラシ保持部11及び砥石15は、偏心軸12を介して
偏心駆動されるように設定しである。即ち偏心軸12を
介して偏心駆動されるブラシ保持部11及び研磨砥石1
5により、プリント基板2表面上のスジ目(ブラシによ
る研磨のスジ目)を板面の前後、左右方向に均等に設定
され、更に研磨砥石によって平滑に設定できるように構
成しである。The brush holder 11 and the grindstone 15 are set to be eccentrically driven via the eccentric shaft 12. That is, the brush holder 11 and the polishing wheel 1 are eccentrically driven via the eccentric shaft 12.
5, the lines on the surface of the printed circuit board 2 (stripes polished by a brush) are set evenly in the front-back and left-right directions of the board surface, and are further set smooth by a polishing wheel.
装置本体5の側面部には、表面研磨処理されるプリント
基板2を装置内に搬入(供給)するための開口13と、
表面研磨処理後のプリント基板2を装置外に搬出(排出
)するための開口14とが開設しである。なお、開口1
3.14は、いずれを搬入用又は搬出用に設定してもよ
い。An opening 13 is provided on the side surface of the device main body 5 for carrying (supplying) the printed circuit board 2 to be subjected to surface polishing into the device;
An opening 14 is opened for carrying out (discharging) the printed circuit board 2 after the surface polishing process out of the apparatus. In addition, opening 1
3.14 may be set for import or export.
次に、上記構成よりなる表面研磨装置lにてプリント基
Fi2の表面2aを研磨する方法について説明する。Next, a method of polishing the surface 2a of the printed base Fi2 using the surface polishing apparatus 1 having the above configuration will be described.
まず、表面研磨処理されるプリント基板2を開口13(
又は開口14)から装置内に供給する。First, the printed circuit board 2 to be surface polished is placed in the opening 13 (
Or, it is supplied into the device through the opening 14).
次に、供給されたプリント基板2を搬送装置3を介して
研磨ブラシ部4方向に搬送する。Next, the supplied printed circuit board 2 is transported toward the polishing brush section 4 via the transport device 3.
次に、研磨ブラシ部4のブラシ本体(ブラシ)10及び
砥石15を偏心軸12を介して偏心運動させ、搬送され
たプリント基板2の表面2aを研磨する。このブラシ本
体10と砥石15の偏心運動により、プリント基板2の
表面上に螺旋状の「ブラシ目」ができ、この螺旋状の「
ブラシ目」によりプリント基板表面2aが滑らかに粗さ
れ、更に砥石15によって平滑に仕上げられる。Next, the brush main body (brush) 10 and grindstone 15 of the polishing brush section 4 are eccentrically moved via the eccentric shaft 12 to polish the surface 2a of the printed circuit board 2 that has been transported. This eccentric movement of the brush body 10 and the grinding wheel 15 creates a spiral "brush eye" on the surface of the printed circuit board 2, and this spiral "brush eye" is formed on the surface of the printed circuit board 2.
The printed circuit board surface 2a is smoothly roughened by the "brush marks" and further smoothed by the grindstone 15.
そして、最終工程として、表面を平滑化された状態で表
面研磨処理されたプリント基板2を、搬送装置3を介し
て開口14(又は開口13)方向に搬送し、開口14か
ら装置外に搬出させる。Then, as a final step, the printed circuit board 2 whose surface has been polished with a smoothed surface is transported toward the opening 14 (or opening 13) via the transport device 3, and transported out of the device from the opening 14. .
第4.5図はプリント基板の銅箔等の比較的軟質の材料
の研磨に好適な実施例を示す。Figure 4.5 shows an embodiment suitable for polishing relatively soft materials such as copper foil for printed circuit boards.
ブラシ10は多数のブラシの束16を有し、各ブラシの
束16を構成する繊維は研磨材入りとする。本体11に
は多数の給水孔18を有し、図示しない給水装置から水
を噴射する。並列した砥石15は図示の例ではゴム砥石
とする。この構成によって、著しく精密な相対位置調節
装置を必要とせずに、異なる種類の研磨部材を並列使用
でき、所要の仕上げを得られる。The brush 10 has a large number of brush bundles 16, and the fibers constituting each brush bundle 16 contain an abrasive material. The main body 11 has a large number of water supply holes 18, and water is injected from a water supply device (not shown). In the illustrated example, the parallel grindstones 15 are rubber grindstones. This configuration allows different types of abrasive members to be used in parallel to obtain the desired finish without the need for extremely precise relative position adjustment devices.
以上のように、本実施例においては、平面のブラシ本体
10と砥石15を偏心軸12を介して偏心運動させて研
磨させるものであるので、均等なブラシ目が平滑な仕上
となり、従って、プリント基板表面2aが滑らかに研磨
されることになる。As described above, in this embodiment, since the planar brush body 10 and the grinding wheel 15 are eccentrically moved via the eccentric shaft 12 for polishing, a smooth finish with uniform brush marks is obtained, and therefore, the print The substrate surface 2a will be polished smoothly.
その結果、表面粗度が平滑化され、後工程のラミネート
密着、印刷工程におけるインクの切れ性等全て良好とな
り、ファインパターン形成が実現できる。又、ブラシ形
状が円ではなく平面であるので、ブラシの加工が容易と
なり、コストの低減化が図れる。As a result, the surface roughness is smoothed, the lamination adhesion in the post-process, the ink cutting property in the printing process, etc. are all improved, and fine pattern formation can be realized. Moreover, since the brush shape is not circular but flat, the brush can be easily processed and costs can be reduced.
又、簡単な構成にて、かつ、加工ラインも極めて短かく
設定できるので、装置の簡略化5低コスト化が図れる利
点がある。Further, since the structure is simple and the processing line can be set extremely short, there is an advantage that the apparatus can be simplified and the cost can be reduced.
尚、図面上は省略したが、ブラシlO及び砥石15に対
する夫々の押圧力の設定調製を可能とすることは勿論で
ある。Although not shown in the drawings, it is of course possible to set and adjust the respective pressing forces for the brush 1O and the grindstone 15.
なお、上記構成における研磨ブラシ部4に、ブラシ本体
lO内から高圧の水をプリン]・基板表面2a上に噴射
させるべく、洗浄水噴射部(図示省略)を設けて構成し
てもよい。かかる構成によれば、表面研磨工程において
、プリント基板表面2aに付着した銅粉、ゴミを洗浄し
うる効果がある。Note that the polishing brush section 4 in the above configuration may be provided with a cleaning water spraying section (not shown) to spray high-pressure water from inside the brush body IO onto the surface 2a of the substrate. This configuration has the effect of cleaning copper powder and dust adhering to the printed circuit board surface 2a in the surface polishing step.
以上のように本発明によれば、簡単な装置にてプリント
a仮等の平面部材に対する2種類の平面加工を1個の簡
単な装置によって行うことができ加工の容易化、ファイ
ンパターン形成の実現化。As described above, according to the present invention, two types of planar processing on a planar member such as a temporary print a can be performed with one simple device, facilitating processing and realizing fine pattern formation. ification.
装置の簡略化、低コスト化等が図れるものである。This makes it possible to simplify the device and reduce costs.
第1図は、本発明の1実施例を示す斜視図、第2図は、
第1図の要部の正面図、
第3図は、プリント基板表面を研磨している状態を示す
斜視図、
第4図はブラシと砥石の実施例を示す平面図、第5図は
第4図の端面図である。
2・・・プリント基板 2a・・・表面4・・・研
磨ブラシ部 lO・・・ブラシ本体12・・・偏心
軸 15・・・研磨砥石16・・・ブラシの
束 18・・・給水孔第4図
第5図FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
Figure 1 is a front view of the main parts, Figure 3 is a perspective view showing the state in which the surface of a printed circuit board is polished, Figure 4 is a plan view showing an example of the brush and grindstone, and Figure 5 is the FIG. 3 is an end view of the figure. 2... Printed circuit board 2a... Surface 4... Polishing brush portion lO... Brush body 12... Eccentric shaft 15... Polishing whetstone 16... Bunch of brushes 18... Water supply hole No. Figure 4 Figure 5
Claims (2)
磨する装置において、上記研磨部材をほぼ長方形として
上流側のブラシと下流側の研磨部材とから構成したこと
を特徴とする平面部材の表面研磨装置。(1) A device for polishing the surface of a flat member with a polishing member that moves eccentrically in the plane, wherein the polishing member is approximately rectangular and is composed of an upstream brush and a downstream polishing member. Polishing equipment.
、前記研磨砥石は研磨材入りのゴム砥石とする特許請求
の範囲第1記載の平面部材の表面研磨装置。(2) The surface polishing device for a planar member according to claim 1, wherein the brushes are a plurality of bundles of brushes containing an abrasive, and the polishing wheel is a rubber grindstone containing an abrasive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7116988A JPH01246060A (en) | 1988-03-25 | 1988-03-25 | Surface polishing device for plane member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7116988A JPH01246060A (en) | 1988-03-25 | 1988-03-25 | Surface polishing device for plane member |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01246060A true JPH01246060A (en) | 1989-10-02 |
Family
ID=13452885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7116988A Pending JPH01246060A (en) | 1988-03-25 | 1988-03-25 | Surface polishing device for plane member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01246060A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS611353B2 (en) * | 1981-01-21 | 1986-01-16 | Hitachi Ltd |
-
1988
- 1988-03-25 JP JP7116988A patent/JPH01246060A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS611353B2 (en) * | 1981-01-21 | 1986-01-16 | Hitachi Ltd |
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