JPH01246057A - Surface polishing of plane member - Google Patents
Surface polishing of plane memberInfo
- Publication number
- JPH01246057A JPH01246057A JP7116688A JP7116688A JPH01246057A JP H01246057 A JPH01246057 A JP H01246057A JP 7116688 A JP7116688 A JP 7116688A JP 7116688 A JP7116688 A JP 7116688A JP H01246057 A JPH01246057 A JP H01246057A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- polishing
- printed circuit
- circuit board
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 claims description 15
- 238000003754 machining Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板を製造する工程においてプリント
基板の表面処理を行うためのプリント基板の表面研磨方
法として開発されたものであるが広く平面部材の表面研
磨方法として実施することが可能である。[Detailed Description of the Invention] [Industrial Application Field] The present invention was developed as a surface polishing method for printed circuit boards for surface treatment of printed circuit boards in the process of manufacturing printed circuit boards, but it is widely applicable to flat members. It can be implemented as a surface polishing method.
出願人の昭和６２年１）月１０日出願に係る特願昭６２
−２８３３６８号の平面部材の表面研磨方法には平面偏
心運動する研磨部材にて平面部材表面を研磨する方法を
開示した。Patent application filed by applicant on January 10, 1988
The surface polishing method for a flat member disclosed in Japanese Patent No. 283368 discloses a method for polishing the surface of a flat member using a polishing member that moves eccentrically in a plane.
上述の発明によって、回転ブラシの毛が半径方向距離に
よって異なるエネルギを付与されるのと異なり、偏心運
動ブラシの毛は夫々同じエネルギを付与され、平面部材
に対して同じ研磨作用を行い、ブラシの摩耗も均等であ
る。According to the above-described invention, unlike the bristles of a rotating brush, which are given different energy depending on their radial distance, the bristles of an eccentrically moving brush are each given the same energy and perform the same abrasive action on the planar member, thereby improving the brush's performance. Wear is also even.
従来の研磨装置は夫々単一の機能を行う構成であり、構
造機能上から当然とされているが比較的研摩代の少ない
場合、例えば研磨ブラシと研摩砥石の場合には連続作業
とすることが希望される。Conventional polishing equipment has a configuration that each performs a single function, and although it is natural from the structural and functional standpoint, when the polishing amount is relatively small, for example, in the case of a polishing brush and a polishing wheel, it is possible to perform continuous operation. desired.
本発明の目的は上述の課題を解決することにあり研磨面
がほぼ平面な研磨部材を偏心軸を介して平面偏心運動可
能に保持しつつ表面研磨する方法において、上記研磨部
材の平面形をほぼ長方形として並列した互いに異なる第
１．第２の研磨部材を同時に上記偏心軸によって駆動し
つつ研磨することを特徴とする平面部材の表面研磨方法
である。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to provide a method for surface polishing a polishing member having a substantially flat polishing surface while allowing eccentric movement in the plane via an eccentric shaft. The first, which are different from each other, are arranged in parallel as rectangles. This is a surface polishing method for a flat member, characterized in that the second polishing member is simultaneously driven by the eccentric shaft and polished.
Ｃ作用）
上述の方法によって、偏心駆動の特性を利用して研磨ブ
ラシと研磨砥石とを並列させて同じモータによって駆動
しつつ、平面部材の表面の仕上までの工程は著しく簡素
化し得る。C) By the method described above, the polishing brush and the polishing wheel are arranged in parallel and driven by the same motor by utilizing the characteristics of eccentric drive, and the process up to finishing the surface of the planar member can be significantly simplified.
本発明を例示とした実施例並びに図面について説明する
。平面部材としてプリント基板の研磨を例示するが、こ
れに限定されない。Embodiments and drawings illustrating the present invention will be described. Although polishing of a printed circuit board is exemplified as a planar member, the present invention is not limited thereto.
第１図は、本発明に係るプリント基板表面研磨方法を実
施するための表面研摩装置１の構成を示す斜視図、第２
図は、第１図の要部の正面図、第３図は、プリント基板
の表面を研磨している状態を示す斜視図である。FIG. 1 is a perspective view showing the configuration of a surface polishing apparatus 1 for carrying out the printed circuit board surface polishing method according to the present invention, and FIG.
The figure is a front view of the main part of FIG. 1, and FIG. 3 is a perspective view showing a state in which the surface of the printed circuit board is being polished.
図に示すように表面研磨装置１は、プリント基板２（第
２図参照）を搬送するための搬送装置３と、搬送装置３
を介して搬送されるプリント基板２の表面２ａを研磨処
理するための研磨部４と、搬送装置３及び研磨部４を収
容する装置本体５等より構成しである。As shown in the figure, the surface polishing device 1 includes a conveying device 3 for conveying a printed circuit board 2 (see FIG. 2), and a conveying device 3 for conveying a printed circuit board 2 (see FIG. 2).
The apparatus is comprised of a polishing section 4 for polishing the surface 2a of the printed circuit board 2 conveyed through the system, and an apparatus body 5 that houses the conveyance device 3 and the polishing section 4.
搬送装置３は、回転駆動自在に構成された２本の搬送ロ
ール６．７と、搬送ロール６．７に巻回された無端帯８
とより構成してあり、いわゆるベルトコンベアーにて構
成しである。９で示すのは、プリント基板２の搬送案内
用の搬送ガイドロールである。The conveying device 3 includes two conveying rolls 6.7 configured to be rotatably driven, and an endless belt 8 wound around the conveying rolls 6.7.
It is composed of a so-called belt conveyor. Reference numeral 9 indicates a conveyance guide roll for guiding the conveyance of the printed circuit board 2.
研磨ブラシ部４は、ブラシ本体（又はスコッチ）ｌＯと
、ブラシ本体１０を保持するブラシ保持部１）と、下流
側に並列した研磨砥石１５を偏心軸１２とより構成しで
ある。ブラシ本体ｌＯは、第３図にて示すごとく比較的
長尺の平面矩形状のブラシ保持部１）に形設しである。The polishing brush section 4 is composed of a brush main body (or scotch) 10, a brush holding section 1) that holds the brush main body 10, and an eccentric shaft 12 with a polishing grindstone 15 arranged in parallel on the downstream side. As shown in FIG. 3, the brush main body 1O is formed into a relatively long brush holding portion 1) having a rectangular planar shape.
ブラシ保持部１）及び砥石１５は、偏心軸１２を介して
偏心駆動されるように設定しである。即ち偏心軸１２を
介して偏心駆動されるブラシ保持部１）及び研磨紙、石
１５により、プリント基板２表面上のスジ目（ブラシに
よる研磨のスジ目）を板面の前後、左右方向に均等に設
定され、更に研磨砥石によって平滑に設定できるように
構成しである。The brush holder 1) and the grindstone 15 are set to be eccentrically driven via an eccentric shaft 12. That is, the brush holder 1), which is eccentrically driven via the eccentric shaft 12, and the abrasive paper and stone 15, uniformly form the lines on the surface of the printed circuit board 2 (stripes polished by the brush) in the front, back, left and right directions of the board surface. It is configured so that it can be set smoothly using a grindstone.
装置本体５の側面部には、表面研磨処理されるプリント
基板２を装置内に搬入（供給）するための開口１３と、
表面研磨処理後のプリント基板２を装置外に搬出（排出
）するための開口１４とが開設しである。なお、開口１
３．１４は、いずれを搬入用又は搬出用に設定してもよ
い。An opening 13 is provided on the side surface of the device main body 5 for carrying (supplying) the printed circuit board 2 to be subjected to surface polishing into the device;
An opening 14 is opened for carrying out (discharging) the printed circuit board 2 after the surface polishing process out of the apparatus. In addition, opening 1
3.14 may be set for import or export.
次に、上記構成よりなる表面研磨装置１にてプリント基
板２の表面２ａを研摩する方法について説明する。Next, a method of polishing the surface 2a of the printed circuit board 2 using the surface polishing apparatus 1 having the above configuration will be described.
まず、表面研磨処理されるプリント基板２を開口１３（
又は開口１４）から装置内に供給する。First, the printed circuit board 2 to be surface polished is placed in the opening 13 (
Or, it is supplied into the device through the opening 14).
次に、供給されたプリント基板２を搬送装置３を介して
研磨ブラシ部４方向に搬送する。Next, the supplied printed circuit board 2 is transported toward the polishing brush section 4 via the transport device 3.
次に、研摩ブラシ部４のブラシ本体（ブラシ）１０及び
砥石１５を偏心軸１２を介して偏心運動させ、搬送され
たプリント基板２の表面２ａを研磨する。このブラシ本
体１０と砥石１５の偏心運動により、プリント基板２の
表面上に螺旋状の「ブラシ目」ができ、この螺旋状の「
ブラシ目」によりプリント基板表面２ａが滑らかに粗さ
れ、更に砥石１５によって平滑に仕上げられる。Next, the brush main body (brush) 10 and grindstone 15 of the polishing brush section 4 are eccentrically moved via the eccentric shaft 12 to polish the surface 2a of the printed circuit board 2 that has been transported. This eccentric movement of the brush body 10 and the grinding wheel 15 creates a spiral "brush eye" on the surface of the printed circuit board 2, and this spiral "brush eye" is formed on the surface of the printed circuit board 2.
The printed circuit board surface 2a is smoothly roughened by the "brush marks" and further smoothed by the grindstone 15.
そして、最終工程として、表面を平滑化された状態で表
面研磨処理されたプリント基板２を、搬送装置３を介し
て開口１４（又は開口１３）方向に搬送し、開口１４か
ら装置外に搬出させる。Then, as a final step, the printed circuit board 2 whose surface has been polished with a smoothed surface is transported toward the opening 14 (or opening 13) via the transport device 3, and transported out of the device from the opening 14. .
第４，５図はプリント基板の銅箔等の比較的軟質の材料
の研磨に好適な実施例を示す。Figures 4 and 5 show an embodiment suitable for polishing relatively soft materials such as copper foil for printed circuit boards.
ブラシ１０は多数のブラシの束１６を有し、各ブラシの
束１６を構成する繊維は研磨材入りとする。本体１）に
は多数の給水孔１８を有し、図示しない給水装置から水
を噴射する。並列した砥石１５は図示の例ではゴム砥石
とする。この構成によって、著しく精密な相対位置ＷＲ
ｗｉ装置を必要とせずに、異なる種類の研磨部材を並列
使用でき、所要の仕上げを得られる。The brush 10 has a large number of brush bundles 16, and the fibers constituting each brush bundle 16 contain an abrasive material. The main body 1) has a large number of water supply holes 18, and water is injected from a water supply device (not shown). In the illustrated example, the parallel grindstones 15 are rubber grindstones. This configuration allows extremely precise relative position WR.
Different types of polishing members can be used in parallel to obtain the desired finish without the need for wi equipment.
以上のように、本実施例においては、平面のブラシ本体
１０と砥石１５を偏心軸１２を介じて偏心運動させて研
磨させるものであるので、均等なブラシ目が平滑な仕上
となり、従って、プリント基板表面２ａが滑らかに研磨
されることになる。As described above, in this embodiment, since the planar brush body 10 and the grindstone 15 are eccentrically moved via the eccentric shaft 12 to perform polishing, a smooth finish with uniform brush marks is obtained, and therefore, The printed circuit board surface 2a will be polished smoothly.
その結果、表面粗度が平滑化され、後工程のラミネート
密着、印刷工程におけるインクの切れ性等全て良好とな
り、ファインパターン形成が実現できる。又、ブラシ形
状が円ではなく平面であるので、ブラシの加工が容易と
なり、コストの低減化が図れる。As a result, the surface roughness is smoothed, the lamination adhesion in the post-process, the ink cutting property in the printing process, etc. are all improved, and fine pattern formation can be realized. Moreover, since the brush shape is not circular but flat, the brush can be easily processed and costs can be reduced.
又、簡単な構成にて、かつ、加工ラインも極めて短か（
設定できるので、装置の筒略化、低コスト化が図れる利
点がある。In addition, it has a simple configuration and an extremely short processing line (
Since it can be set, there is an advantage that the device can be simplified and the cost can be reduced.
尚、図面上は省略したが、ブラシ１０及び砥石１５に対
する夫々の押圧力の設定調製を可能とすることは勿論で
ある。Although not shown in the drawings, it is of course possible to set and adjust the respective pressing forces for the brush 10 and the grindstone 15.
なお、上記構成における研磨ブラシ部４に、ブラシ本体
１０内から高圧の水をプリント基板表面２ａ上に噴射さ
せるべく、洗浄水噴射部（図示省略）を設けて構成して
もよい。かかる構成によれば、表面研磨工程において、
プリント基板表面２ａに付着した銅粉１ゴミを洗浄しう
る効果がある。Note that the polishing brush section 4 having the above structure may be provided with a cleaning water spraying section (not shown) to spray high-pressure water from inside the brush body 10 onto the printed circuit board surface 2a. According to this configuration, in the surface polishing step,
This has the effect of cleaning copper powder 1 dust adhering to the printed circuit board surface 2a.
以上のように本発明方法によればプリント基板等の平面
部材に対する２種類の平面加工を１個の簡単な装置によ
って行うことができ加工の容易化。As described above, according to the method of the present invention, two types of planar processing on a planar member such as a printed circuit board can be performed using one simple device, thereby facilitating the processing.
ファインパターン形成の実現化、装置の筒略化。Realization of fine pattern formation and simplification of equipment.
低コスト化等が図れるものである。This allows cost reduction, etc.
第１図は、本発明の１実施例を示す斜視図、第２図は、
第１図の要部の正面図、
第３図は、プリント基板表面を研磨している状態を示す
斜視図、
第４図はブラシと砥石の実施例を示す平面図、第５図は
第４図の端面図である。
２・・・プリント基板 ２ａ・・・表面４・・・研
磨ブラシ部 １０・・・ブラシ本体１２・・・偏心
軸 １５・・・研磨砥石１６・・・ブラシの
束 １８・・・給水孔第４図
第５図FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
Figure 1 is a front view of the main parts, Figure 3 is a perspective view showing the state in which the surface of a printed circuit board is polished, Figure 4 is a plan view showing an example of the brush and grindstone, and Figure 5 is the FIG. 3 is an end view of the figure. 2... Printed circuit board 2a... Surface 4... Polishing brush portion 10... Brush body 12... Eccentric shaft 15... Polishing whetstone 16... Bundle of brushes 18... Water supply hole No. Figure 4 Figure 5
Claims (1)
面偏心運動可能に保持しつつ表面研磨する方法において
、上記研磨部材の平面形をほぼ長方形として並列した互
いに異なる第１、第２の研磨部材を同時に上記偏心軸に
よって駆動しつつ研磨することを特徴とする平面部材の
表面研磨方法。(1) In a method of surface polishing while holding a polishing member whose polishing surface is substantially planar so as to be capable of eccentric movement in a plane via an eccentric shaft, first and second different polishing members arranged in parallel with each other having a substantially rectangular planar shape of the polishing member are provided. A method for polishing a surface of a flat member, characterized in that the polishing member is simultaneously driven by the eccentric shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7116688A JPH01246057A (en) | 1988-03-25 | 1988-03-25 | Surface polishing of plane member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7116688A JPH01246057A (en) | 1988-03-25 | 1988-03-25 | Surface polishing of plane member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01246057A true JPH01246057A (en) | 1989-10-02 |
Family
ID=13452790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7116688A Pending JPH01246057A (en) | 1988-03-25 | 1988-03-25 | Surface polishing of plane member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01246057A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01246059A (en) * | 1988-03-25 | 1989-10-02 | Cmk Corp | Surface polishing device for plane member |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS611353B2 (en) * | 1981-01-21 | 1986-01-16 | Hitachi Ltd | |
| JPH01246059A (en) * | 1988-03-25 | 1989-10-02 | Cmk Corp | Surface polishing device for plane member |
-
1988
- 1988-03-25 JP JP7116688A patent/JPH01246057A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS611353B2 (en) * | 1981-01-21 | 1986-01-16 | Hitachi Ltd | |
| JPH01246059A (en) * | 1988-03-25 | 1989-10-02 | Cmk Corp | Surface polishing device for plane member |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01246059A (en) * | 1988-03-25 | 1989-10-02 | Cmk Corp | Surface polishing device for plane member |
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