JPH04122569A - Printed board polishing method device therefor - Google Patents

Abstract

PURPOSE:To perform smooth polishing without the generation of unpolished protruding parts by providing an elevation body with a hanging polishing member brought into oppressive contact with the printed board face at the time of transferring a printed board so as to polish its surface into a plane. CONSTITUTION:A printed board 1 is transferred horizontally by a transfer means 2. A plate like polishing member 3 provided opposedly above the transfer means 2 is oscillated horizontally by an oscillating means and simultaneously brought into oppressive contact with the printed board 1. In addition, abrasive material is supplied into this polishing position from a delivery hole 25 so as to polish the printed board 1 through the abrasive material.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method and an apparatus for polishing the surface of a printed circuit board used in the manufacturing industry of electronic equipment, etc. A flat polishing member is brought into elastic contact with the top surface of the printed circuit board to be polished, and the polishing member is horizontally oscillated to rub the surface, and the printed circuit board is polished while dispersing abrasive onto the polished surface. A method for polishing a printed circuit board, in which the entire surface of the printed circuit board can be polished with uniform flatness accuracy by surface polishing, and abnormal elongation of the printed circuit board due to excessive polishing pressure can be prevented, and the polishing method thereof Regarding equipment.

(Prior art) Conventionally, in printed circuit boards used in electronic devices,
A known polishing machine 40 as shown in FIG. 9 is used for removing burrs after drilling holes for inserting terminals of electronic devices and for polishing surfaces before printing and laminating.

In this device, a rotary polishing member 44 such as a cylindrical puff is placed opposite to a printed circuit board 43 that is transferred by a transfer member 42 such as a roller conveyor or a belt conveyor horizontally attached to a frame 41. , the desired surface polishing was performed by contacting the printed circuit board 43 without applying pressure.

(Problems to be Solved by the Invention) The conventional polishing machine 40 described above has a cylindrical rotating polishing member 4.
The above-described burr 45 after drilling was removed by up-cutting or down-cutting according to No. 7.
As shown in Fig. 7a, when a burr 45 is formed in the hole 46, polishing is performed by using the polishing method described above. Or the board 43 in the subsequent process may cause ear flops.
When assembling, etc., it causes problems such as poor contact and disconnection of electronic elements, etc.

Furthermore, in rotary polishing, the bristles of the polishing member adapt to the unevenness of the surface to be polished, and the bristles uniformly contact the flat surface and the convexity to be polished, so that the polishing member follows the shape of the convexities and convexities of the surface to be polished. Since the polished convex portions remain even after polishing, ink does not adhere well to printing in the subsequent process, and furthermore, when the surface material is laminated, it may cause poor adhesion.

In addition, in this polishing method, a rotating polishing member is brought into line contact with the top surface of the printed circuit board, and pressure due to polishing is performed through partial contact on the line, so frictional heat due to the pressure is generated. This may cause the printed circuit board to stretch, resulting in misalignment with the processing machine in the subsequent process.
The position of the drilled hole may be misaligned, resulting in a defective product.

It had various problems such as.

The present invention has been made in order to solve the above-mentioned problems, and includes a planar polishing member which is brought into elastic contact with the upper surface of a printed circuit board that is horizontally transferred by a transfer means, and is horizontally oscillated. By rubbing the printed circuit board and polishing the surface of the printed circuit board while dispersing an abrasive onto the polished surface, the entire surface of the printed circuit board can be polished with uniform flatness accuracy, and it is possible to polish the entire surface of the printed circuit board with uniform flatness accuracy. It is an object of the present invention to provide a method for polishing a printed circuit board that can prevent abnormal stretching of the printed circuit board, and a method for polishing the same.

(Means for Solving the Problems) The means of the present invention for achieving the above-mentioned objects are as follows: (1) ■Transferring a printed circuit board horizontally by means of a transfer means; ■Flat plates disposed oppositely above the transfer means. A method of polishing a printed circuit board, comprising: bringing a polishing member into contact with the printed circuit board elastically while vibrating horizontally, and (1) supplying an abrasive to this polishing position and polishing the printed circuit board through the abrasive. (2) ■ A transfer means provided horizontally on the frame and configured to transfer a printed circuit board placed on the top thereof from one side to the other; ■ Supported above the transfer means so as to be able to rise and fall freely on the frame an elevating body; (1) a polishing member that hangs below the elevating body and comes into elastic contact with the printed circuit board surface during transfer of the printed circuit board to planarly polish the surface; (2) linked to the polishing member; vibrating means for vibrating the printed circuit board; and (1) a supply unit for supplying abrasive to the polishing surface of the printed circuit board, which is disposed oppositely above the polishing position by the polishing member. It is in the configuration of the polishing device.

(Function) The method and apparatus for polishing a printed circuit board of the present invention configured as described above exhibits the following functions.

When each means in the device is operated and a printed circuit board is placed from the starting end side of the transfer means and is transferred at a predetermined speed, the printed circuit board is moved below the polishing member suspended from the elevating body as it is transferred. .

At this time, abrasive is sprayed onto the top surface of the printed circuit board from a supply unit installed above;
The polishing member is brought into planar contact with the printed circuit board surface by the pressing force of the elevating member as the elevating member descends.

Then, the polishing member, which is oscillated by the vibrating means, performs surface polishing through the polishing agent by horizontal lateral movement, so that if a crack is formed on the outer periphery of the hole, as shown in Fig. 5a, , the polishing surface pressure is uniformly applied to the surface to be polished, and the convex burrs are scraped off flush with the flat surface, resulting in uniform polishing. It is something that

(Embodiment) Next, an embodiment of the method and apparatus for polishing a printed circuit board according to the present invention will be described based on the drawings.

In FIGS. 1 and 2, A is a polishing device for polishing the surface of a printed circuit board 1 used for electronic equipment, etc., and includes the aforementioned printed circuit board 1 transfer means 2 and a polishing member 3 for the printed circuit board 1.
, a vibrating means 4 for the polishing member 3, and a supply section 5 for abrasive.

The printed circuit board 1 whose surface is polished by this polishing device A has a large number of terminal holes 1a drilled in accordance with the desired design for assembling electronic elements in a later process. The polishing is performed as a pretreatment for removing burrs lb generated when forming the terminal hole 1a and for laminating and printing to be performed in a subsequent process.

The transfer means 2 described above uses a belt conveyor type in which the printed circuit board 1 is placed and transferred from one side to the other at a predetermined speed. A belt 9 is tensioned and driven by a drive means (not shown) such as a motor.

Presser rollers 10 are disposed at intervals above the transfer means 2 to prevent the placed printed circuit board 1 from moving accidentally due to external polishing force during polishing by the polishing member 3, and to This is so that the printed circuit board 1 can be stably transferred.

Although not shown in the drawings, the transfer means 2 may also include roller conveyors arranged in large numbers at a predetermined pitch.

The polishing member 3 mentioned above comes into contact with the upper surface of the printed circuit board 1 to perform a prescribed polishing of the surface, and is formed in a prescribed rectangular shape so as to be in surface contact with the printed circuit board 1.
Above the transfer means 2, at the lower part of the elevating body 13 supported on the vertical guides 12, 12 of the frame 6 so as to be able to rise and fall freely, a swing shaft 14 protruding from the elevating body 13 and a vibration isolating rubber 15 are installed. It is made to hang down through.

As shown in FIG.
6 is an elastic body 17 such as a sponge having cushioning properties,
It is of a butt type that can be attached replaceably using a removable member (not shown) such as double-sided tape, and a polishing cloth 18 is attached to the lower surface of the elastic body 17.

In the case shown in FIG. 4, a brush type is used, in which a brush 19 made of an elastic, so-called stiff wire material is implanted on the lower surface of the mounting body 16, and this wire material is polished. Those with grains attached can also be used,
It is preferable that the bristles of this brush have a length of about 10 mm and are arranged closely together.

The above-mentioned elevating body 13 is linked with an elevating member 20 such as a fluid cylinder attached to the frame 6 above, and is thereby raised and lowered as desired. When the printed circuit board 1 reaches below the polishing member 3, the lifting member 20 operates the elevating body 13 to lower the polishing member 3 and apply it to the upper surface of the printed circuit board 1 with a predetermined pressure. It is something to be brought into contact with.

The above-mentioned vibration excitation means 4 horizontally vibrates the polishing member 3 to rub the surface of the printed circuit board, and as shown in FIG. 14,
The rotation of a motor 23 attached to one side of the elevating body 13 is supported by an eccentric bearing 21 so as to obtain a predetermined oscillating stroke (for example, 3 mm), and is attached to a pulley 22 attached to the upper end of the oscillating shaft 14. , the belt 24 or the like is used for the transmission, and the polishing member 3 is given a circular motion in the above-described stroke to perform the desired rubbing.

The above-described supply unit 5 supplies the abrasive when it is transferred by the above-described transfer means 2 and reaches below the polishing member 3, that is, at the polishing position of the printed circuit board 1,
Attach the discharge hole 25 to the upper frame 6,
The abrasive stored in the storage tank 26 is pumped to the discharge hole 25 by a pump (not shown), and then dropped into an inclined chute 27 provided on the lower side. Spray onto the surface of the substrate 1.

Further, the abrasive after polishing falls from the transfer means 2,
It is temporarily collected in a saucer 28 provided at the bottom of the drain pipe 29.
It is collected into the storage tank 26 via the storage tank 26.

Note that this abrasive uses either abrasive grains formed into granules or powder, or a polishing liquid made by mixing the abrasive grains with water and a solvent and stirring them to form a liquid. materials such as alumina oxide, silicon carbide, and volcanic ash.
It is formed to a grain size of 0 to 2000 meshes, and is appropriately selected according to the polishing condition of the printed circuit board 1 to be processed.
The above-mentioned materials are obtained by the required blending.

(Effects of the Invention) In the present invention configured as described above, a polishing member is suspended from an elevating body to flatten the surface of the printed circuit board by bringing it into elastic contact with the surface of the printed circuit board when the printed circuit board is transferred. Therefore, since the surface to be polished is polished over a wide planar area, the polishing member hits the convex parts first and strongly, resulting in extra polishing, and the unpolished parts of the convex parts are removed. Polished smoothly without causing any scratches.

In addition, since the abrasive supply section is provided above the polishing position of the printed circuit board by the polishing member, the polishing effect is improved in combination with the oscillating motion of the polishing member by the vibration excitation means, and it is easy to use in the post-processing process. This is done smoothly and without any inconvenience.

In addition, in this polishing method and device, the polishing member contacts the top surface of the printed circuit board in a wide surface contact, and the pressure applied by polishing is brought into contact with the flat surface and the pressure is dispersed, unlike the conventional method. Abnormal frictional heat due to partial contact is not generated (and the printed circuit board is not stretched due to this, so the position of the hole (reference hole for positioning during machining) drilled in the subsequent process etc. is out of order. There will be no defective products or unprocessable products.

It has special effects such as:

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of an apparatus employed in the polishing method according to the present invention. Figure 2 is a side view of the same as above. 3 and 4 are front views showing the same abrasive member as above, FIG. 3 shows a butt type polishing member, and FIG. 4 shows a brush type polishing member. Figures 5a to 6b show the polishing state of a printed circuit board in the same device as above, where Figure 5a is a perspective view before polishing, Figure 5b is a sectional view of the same, and Figure 6a is a perspective view after polishing. , FIG. 6b is a sectional view of the same. Figures 7a to 8b show the state of polishing a printed circuit board in a conventional device, where Figure 7a is a perspective view before polishing, Figure 7b is a sectional view of the same, and Figure 8a is a perspective view after polishing. , FIG. 8b is a sectional view of the same. FIG. 9 is a schematic front view showing a conventional grinding device. In the figure, 6 is a frame, 1 is a printed circuit board, 2 is a transfer means, 13 is an elevating body, 3 is a polishing member, 4 is an excitation means, 5
is an abrasive supply section. Patent application agent Shizuka Kato, V Tomido 5 Ro, Figure, Shiloh, A, No.

Claims (2)

[Claims] (1) A printed circuit board is transferred horizontally by a transfer means, and a flat polishing member placed oppositely above the transfer means is vibrated horizontally by an excitation means, and is brought into elastic contact with the printed circuit board. A method for polishing a printed circuit board, characterized in that the printed circuit board is polished by supplying an abrasive to the polishing position and polishing the printed circuit board through the abrasive. (2) a transfer means for transferring a printed circuit board placed on the upper part of the frame horizontally from one side to the other; and an elevating body supported on the frame so as to be able to rise and fall above the transfer means; a polishing member that hangs down from the lower part of the elevating body and comes into elastic contact with the printed circuit board surface during transfer of the printed circuit board to planarly polish the surface; A printed circuit board polishing apparatus comprising: a vibrating means for vibrating; and a supply section for supplying abrasive to the polishing surface of the printed circuit board, which is disposed oppositely above the polishing position by the polishing member.