JPH0268442U - - Google Patents

Info

Publication number
JPH0268442U
JPH0268442U JP1988147185U JP14718588U JPH0268442U JP H0268442 U JPH0268442 U JP H0268442U JP 1988147185 U JP1988147185 U JP 1988147185U JP 14718588 U JP14718588 U JP 14718588U JP H0268442 U JPH0268442 U JP H0268442U
Authority
JP
Japan
Prior art keywords
capillary
point
bonding
wire
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988147185U
Other languages
Japanese (ja)
Other versions
JPH0521883Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988147185U priority Critical patent/JPH0521883Y2/ja
Publication of JPH0268442U publication Critical patent/JPH0268442U/ja
Application granted granted Critical
Publication of JPH0521883Y2 publication Critical patent/JPH0521883Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のワイヤボンデイング装置の実
施例の構成図、第２図はキヤピラリ先端中心の移
動説明図である。 １……キヤピラリ、２……ボンデイングアーム
、３……超音波振動子、４……上下駆動部、５…
…Ｘテーブル、６……Ｙテーブル、７……ワイヤ
クランプ、９……ボンデイング対象物、１０……
現在の第２ボンデイング点の座標信号、１１……
記憶部、１２……算出部、１４……位置決め制御
部、３０……ワイヤ、３１，３２……キヤピラリ
先端中心位置、３３……クランプ点、３４……引
張り移動終了点、３５，３６……キヤピラリ先端
中心位置、４１……現在の第１ボンデイング点、
４２……現在の第２ボンデイング点、５１……次
の第１ボンデイング点、５２……次の第２ボンデ
イング点、１００……キヤピラリ先端、１０１…
…リード、１０２……ＩＣチツプ、１０３……パ
ツド、１０４……クランプ位置円、１０５……次
のボンデイング点接続線。 FIG. 1 is a configuration diagram of an embodiment of the wire bonding apparatus of the present invention, and FIG. 2 is an explanatory diagram of movement of the center of the capillary tip. 1... Capillary, 2... Bonding arm, 3... Ultrasonic transducer, 4... Vertical drive unit, 5...
...X table, 6...Y table, 7...wire clamp, 9...bonding object, 10...
Coordinate signal of the current second bonding point, 11...
Storage unit, 12...Calculation unit, 14...Positioning control unit, 30...Wire, 31, 32...Capillary tip center position, 33...Clamp point, 34...Tension movement end point, 35, 36... Capillary tip center position, 41...Current first bonding point,
42...Current second bonding point, 51...Next first bonding point, 52...Next second bonding point, 100...Capillary tip, 101...
... Lead, 102 ... IC chip, 103 ... Pad, 104 ... Clamp position circle, 105 ... Next bonding point connection line.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤを所定の位置に導くこととボンデイング
とを行うキヤピラリと； ワイヤカツトのために
ワイヤを拘束するワイヤクランプと； キヤピラ
リとボンデイング対象物との相対位置を変える位
置変更手段と； キヤピラリに超音波振動を行わ
せる超音波励振手段と； ボンデイング対象物の
複数の第１ボンデイング点および複数の第２ボン
デイング点の各座標と、キヤピラリの先端半径と
、第２ボンデイング点からのキヤピラリ上昇高さ
と、ワイヤテール長さと、キヤピラリのワイヤカ
ツト移動量とを記憶する記憶部と； 現在の第２
ボンデイング点の座標と、記憶部から読み出した
次の第１ボンデイング点および第２ボンデイング
点の各座標と、キヤピラリの先端半径と、第２ボ
ンデイング点からのキヤピラリ上昇高さと、ワイ
ヤテール長さと、キヤピラリのワイヤカツト移動
量とから、キヤピラリ先端が現在の第２ボンデイ
ング点から次の第１ボンデイング点に移動する間
の、前記のキヤピラリ上昇高さにあるキヤピラリ
先端と現在の第２ボンデイング点との最短距離が
ワイヤテール長さに等しい時のキヤピラリ先端中
心位置であるクランプ点の座標と、クランプされ
たワイヤを現在の第２ボンデイング点から所定の
方向に引張り始める時のキヤピラリ先端中心位置
である引張り開始点の座標と、カツトされたワイ
ヤのテール先端を現在の第２ボンデイング点から
所定の距離だけはなす時のキヤピラリ先端中心位
置である引張り移動終了点の座標を算出する算出
部と； 現在の第２ボンデイング点の座標を算出
部へ送出することと、算出部から受けた各座標に
基づき、キヤピラリ中心を現在の第２ボンデイン
グ点を中心としてクランプ点を通る円の内部のみ
を経由させてクランプ点に到達させ、ついで該ク
ランプ点から引張り開始点へ移動させ、引張り開
始点から引張り移動終了点へはこれを結ぶ直線を
たどつて移動させる制御信号を位置変更手段へ送
出することとを行う制御部と； を具備すること
を特徴とするワイヤボンデイング装置。 A capillary that guides the wire to a predetermined position and performs bonding; A wire clamp that restrains the wire for wire cutting; A position changing means that changes the relative position between the capillary and the object to be bonded; A capillary that applies ultrasonic vibration to the capillary. ultrasonic excitation means; the coordinates of the plurality of first bonding points and the plurality of second bonding points of the bonding target, the tip radius of the capillary, the height of the capillary rise from the second bonding point, and the wire tail length; a storage unit that stores the amount of movement of the wire cut of the capillary;
The coordinates of the bonding point, the coordinates of the next first bonding point and second bonding point read from the storage unit, the tip radius of the capillary, the height of the capillary rise from the second bonding point, the wire tail length, and the capillary. The shortest distance between the capillary tip at the above-mentioned capillary rising height and the current second bonding point while the capillary tip moves from the current second bonding point to the next first bonding point based on the amount of wire cut movement. The coordinates of the clamp point, which is the center position of the capillary tip when is equal to the wire tail length, and the pulling start point, which is the center position of the capillary tip when the clamped wire starts to be pulled in a predetermined direction from the current second bonding point. a calculation unit that calculates the coordinates of the end point of the tension movement, which is the center position of the capillary tip when the tail tip of the cut wire is separated from the current second bonding point by a predetermined distance; Send the coordinates of the point to the calculation unit, and based on each coordinate received from the calculation unit, reach the clamp point by moving the capillary center only through the inside of the circle that passes through the clamp point with the current second bonding point as the center. a control unit that sends a control signal to the position changing means to move the clamp point to the tension start point, and then move from the tension start point to the tension end point by following a straight line connecting these points; A wire bonding device characterized by comprising;
JP1988147185U 1988-11-11 1988-11-11 Expired - Lifetime JPH0521883Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988147185U JPH0521883Y2 (en) 1988-11-11 1988-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988147185U JPH0521883Y2 (en) 1988-11-11 1988-11-11

Publications (2)

Publication Number Publication Date
JPH0268442U true JPH0268442U (en) 1990-05-24
JPH0521883Y2 JPH0521883Y2 (en) 1993-06-04

Family

ID=31417358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988147185U Expired - Lifetime JPH0521883Y2 (en) 1988-11-11 1988-11-11

Country Status (1)

Country Link
JP (1) JPH0521883Y2 (en)

Also Published As

Publication number Publication date
JPH0521883Y2 (en) 1993-06-04

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