JPH0267630U - - Google Patents
Info
- Publication number
- JPH0267630U JPH0267630U JP14637888U JP14637888U JPH0267630U JP H0267630 U JPH0267630 U JP H0267630U JP 14637888 U JP14637888 U JP 14637888U JP 14637888 U JP14637888 U JP 14637888U JP H0267630 U JPH0267630 U JP H0267630U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- component body
- resin case
- lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は本考案に係るチツプ型電子部品の一実
施例である固体電解コンデンサの縦断面図、第２
図及び第３図は同じく製造工程を示す縦断面図で
ある。第４図は従来のチツプ型固体電解コンデン
サの縦断面図、第５図及び第６図は同じく製造工
程を示す平面図及び縦断面図である。
１……部品本体（コンデンサエレメント）、２
……内部リード、４……第１の外部リード、４ａ
……内端部、６……第２の外部リード、１３……
樹脂ケース、１４……封入樹脂。
Fig. 1 is a longitudinal cross-sectional view of a solid electrolytic capacitor which is an embodiment of the chip-type electronic component according to the present invention;
3 and 3 are longitudinal cross-sectional views showing the manufacturing process. FIG. 4 is a longitudinal sectional view of a conventional chip type solid electrolytic capacitor, and FIGS. 5 and 6 are a plan view and a longitudinal sectional view showing the manufacturing process. 1... Part body (capacitor element), 2
...Internal lead, 4...First external lead, 4a
...Inner end, 6...Second external lead, 13...
Resin case, 14... Encapsulating resin.
Claims (1)
端部を底面より導出させた有底筒状の樹脂ケース
と、 上記樹脂ケース内に納置され、底部で上記第１
の外部リードに電気的に接続され、上面に第２の
外部リードを電気的に接続する内部リードを植設
した部品本体と、 樹脂ケース内に上記部品本体を封止するよう充
填された封入樹脂とで構成したことを特徴とする
チツプ型電子部品。[Scope of Claim for Utility Model Registration] A bottomed cylindrical resin case in which the inner end of a first external lead is housed inside and the outer end is led out from the bottom surface; 1st above at the bottom
a component body that is electrically connected to the external lead of the component body and has an internal lead planted on the top surface that electrically connects the second external lead; and an encapsulating resin that is filled in a resin case so as to seal the component body. A chip-type electronic component characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14637888U JPH0267630U (en) | 1988-11-08 | 1988-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14637888U JPH0267630U (en) | 1988-11-08 | 1988-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267630U true JPH0267630U (en) | 1990-05-22 |
Family
ID=31415811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14637888U Pending JPH0267630U (en) | 1988-11-08 | 1988-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267630U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001167978A (en) * | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | Solid electrolytic capacitor |
-
1988
- 1988-11-08 JP JP14637888U patent/JPH0267630U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001167978A (en) * | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | Solid electrolytic capacitor |
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