JPH0254223U - - Google Patents
Info
- Publication number
- JPH0254223U JPH0254223U JP13391988U JP13391988U JPH0254223U JP H0254223 U JPH0254223 U JP H0254223U JP 13391988 U JP13391988 U JP 13391988U JP 13391988 U JP13391988 U JP 13391988U JP H0254223 U JPH0254223 U JP H0254223U
- Authority
- JP
- Japan
- Prior art keywords
- exterior
- anode
- cathode
- element body
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案に係る固体電解コンデンサの一
実施例を示す分解外観斜視図、第２図は第１図の
側断面図、第３図は従来のチツプ型固体電解コン
デンサの一具体例を示す側断面図である。
９……素子本体、１０……外部陽極部材、１１
……外部陰極部材、１２……樹脂ケース、１３…
…樹脂ブタ、１４，１５……導電性接着剤、１６
……陰極引出層、１７……陽極リード。
Fig. 1 is an exploded external perspective view showing an embodiment of a solid electrolytic capacitor according to the present invention, Fig. 2 is a side sectional view of Fig. 1, and Fig. 3 is a specific example of a conventional chip-type solid electrolytic capacitor. FIG. 9... Element body, 10... External anode member, 11
...External cathode member, 12...Resin case, 13...
... Resin pig, 14, 15 ... Conductive adhesive, 16
... Cathode extraction layer, 17 ... Anode lead.
Claims (1)
部材を有する樹脂ケース内で、外装陰極部材に素
子本体周面の陰極引出層を接続させ、外部陽極部
材に上記素子本体に植設された陽極リードを接続
させて、樹脂ブタにて封止したことを特徴とする
チツプ型電子部品。 In an exterior type chip component, within a resin case having anode and cathode members at both left and right ends, a cathode extraction layer on the peripheral surface of the element body is connected to the exterior cathode member, and an anode implanted in the element body is connected to the exterior anode member. A chip-type electronic component characterized by connecting leads and sealing with a resin pot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13391988U JPH0254223U (en) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13391988U JPH0254223U (en) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254223U true JPH0254223U (en) | 1990-04-19 |
Family
ID=31392223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13391988U Pending JPH0254223U (en) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254223U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817686A (en) * | 1994-04-28 | 1996-01-19 | Rohm Co Ltd | Structure of packaged solid electrolytic capacitor |
| JP2012099812A (en) * | 2010-11-01 | 2012-05-24 | Avx Corp | Solid electrolytic capacitor for high voltage and high temperature application |
-
1988
- 1988-10-13 JP JP13391988U patent/JPH0254223U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0817686A (en) * | 1994-04-28 | 1996-01-19 | Rohm Co Ltd | Structure of packaged solid electrolytic capacitor |
| JP2012099812A (en) * | 2010-11-01 | 2012-05-24 | Avx Corp | Solid electrolytic capacitor for high voltage and high temperature application |
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