JPH0267603U - - Google Patents
Info
- Publication number
- JPH0267603U JPH0267603U JP1988146231U JP14623188U JPH0267603U JP H0267603 U JPH0267603 U JP H0267603U JP 1988146231 U JP1988146231 U JP 1988146231U JP 14623188 U JP14623188 U JP 14623188U JP H0267603 U JPH0267603 U JP H0267603U
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- resistor
- trimming
- laser
- boundary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案のレーザートリミング装置を示
すブロツク図、第２図は本実施例の作用を説明す
るフローチヤート、第３図は本考案におけるトリ
ミング処理の原理を説明するグラフ、第４図はト
リミング処理を説明する平面図である。
２，３……導体、４……抵抗体、５……切り込
み、６……レーザー光源、１２……抵抗値測定ユ
ニツト、１３……コンピユーター。
Fig. 1 is a block diagram showing the laser trimming device of the present invention, Fig. 2 is a flowchart explaining the operation of this embodiment, Fig. 3 is a graph explaining the principle of trimming processing in the present invention, and Fig. 4 is a FIG. 3 is a plan view illustrating trimming processing. 2, 3...Conductor, 4...Resistor, 5...Notch, 6...Laser light source, 12...Resistance value measuring unit, 13...Computer.
Claims (1)
レーザー加工手段と、抵抗体の抵抗値を測定する
測定手段と、抵抗体のトリミングによる最終的な
目標抵抗値から所定量だけ離れた境界抵抗値を少
なく共１つ設定し、この境界抵抗値よりも抵抗値
が小さい状態では上記測定手段の測定をレーザー
光照射Ｎ１回毎に行い、この境界値よりも抵抗値
が大きい状態ではＮ２回毎に行い、且つＮ１＞Ｎ
２となるように制御する手段と、を有することを
特徴とするレーザートリミング装置。 A laser processing means for trimming the resistor by irradiating the resistor with a laser beam, a measuring means for measuring the resistance value of the resistor, and a method for reducing the boundary resistance value that is a predetermined amount away from the final target resistance value by trimming the resistor. When the resistance value is smaller than this boundary resistance value, the measurement by the measuring means is performed every N times of laser beam irradiation, and when the resistance value is larger than this boundary value, the measurement is performed every N times. and N 1 >N
2. A laser trimming device characterized by comprising: means for controlling the laser trimming so that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988146231U JPH0267603U (en) | 1988-11-09 | 1988-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988146231U JPH0267603U (en) | 1988-11-09 | 1988-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267603U true JPH0267603U (en) | 1990-05-22 |
Family
ID=31415527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988146231U Pending JPH0267603U (en) | 1988-11-09 | 1988-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267603U (en) |
-
1988
- 1988-11-09 JP JP1988146231U patent/JPH0267603U/ja active Pending
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