JPH0263567U - - Google Patents
Info
- Publication number
- JPH0263567U JPH0263567U JP14293688U JP14293688U JPH0263567U JP H0263567 U JPH0263567 U JP H0263567U JP 14293688 U JP14293688 U JP 14293688U JP 14293688 U JP14293688 U JP 14293688U JP H0263567 U JPH0263567 U JP H0263567U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- terminal
- conductor
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000003973 paint Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 239000011889 copper foil Substances 0.000 claims 3
- 238000009413 insulation Methods 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の構成を示す一部省略斜視図、
第２図は両プリント配線板の接合状態を示す一部
省略断面図、第３図はスリツト８の作用を示す一
部拡大断面図、第４図は従来例を示す一部省略斜
視図、第５図は同一部省略断面図である。
図において、１は第一のプリント配線板、２は
第二のプリント配線板、３は端子部、４は端子孔
、５はプリント配線板１の導体端子、６はプリン
ト配線板２の導体端子、７ははんだフイレツト、
８はプリント配線板１の導体端子５に配設したス
リツト、９は絶縁塗料またははんだレジスト層で
ある。
FIG. 1 is a partially omitted perspective view showing the configuration of the present invention;
2 is a partially omitted sectional view showing the bonding state of both printed wiring boards, FIG. 3 is a partially enlarged sectional view showing the action of the slit 8, and FIG. 4 is a partially omitted perspective view showing the conventional example. FIG. 5 is a partially omitted cross-sectional view of the same part. In the figure, 1 is a first printed wiring board, 2 is a second printed wiring board, 3 is a terminal portion, 4 is a terminal hole, 5 is a conductor terminal of the printed wiring board 1, and 6 is a conductor terminal of the printed wiring board 2. , 7 is the solder fillet,
8 is a slit provided in the conductor terminal 5 of the printed wiring board 1, and 9 is an insulating paint or a solder resist layer.
Claims (1)
子部を形成し、該端子部に所定の導体巾と絶縁間
隔からなる複数の導体端子を前記突出方向と同方
向に形成し、第１のプリント配線板に上記端子部
の板厚と巾に適合する端子孔を形成し、銅箔側に
該端子孔と直角に上記導体端子と同等の導体巾と
絶縁間隔からなる複数の導体端子を形成し、上記
第２のプリント配線板の端子部を第１のプリント
配線板の該端子孔に挿通し、第１のプリント配線
板と第２のプリント配線板の導体端子をはんだ付
けにより接続してなる端子接続構造において、第
１のプリント配線板の導体端子間に該端子孔淵か
ら所定の長さと巾のスリツトを形成し、さらに第
２のプリント配線板の上記端子部の該端子孔によ
り隠れる部分の銅箔側に絶縁塗料またはレジスト
の印刷を施したプリント配線板。 (2) 第１のプリント配線板銅箔面の導体端子間
に、前記スリツトが該端子孔淵から所定の長さと
巾のに形成した溝からなる請求項(1)記載のプリ
ント配線板。[Claims for Utility Model Registration] (1) A protruding terminal portion is formed on the outer periphery of the second printed wiring board, and a plurality of conductor terminals having a predetermined conductor width and insulation spacing are arranged on the terminal portion in the protruding direction. A terminal hole is formed in the same direction, and a terminal hole is formed on the first printed wiring board to match the board thickness and width of the terminal part, and a conductor width and insulation equivalent to the above conductor terminal are formed on the copper foil side at right angles to the terminal hole. A plurality of conductor terminals are formed at intervals, and the terminal portion of the second printed wiring board is inserted into the terminal hole of the first printed wiring board, and the terminals of the first printed wiring board and the second printed wiring board are connected. In a terminal connection structure in which conductor terminals are connected by soldering, a slit of a predetermined length and width is formed from the terminal hole edge between the conductor terminals of the first printed wiring board, and A printed wiring board in which an insulating paint or resist is printed on the copper foil side of the portion of the terminal portion that is hidden by the terminal hole. (2) The printed wiring board according to claim 1, wherein the slit is a groove formed with a predetermined length and width from the edge of the terminal hole between the conductor terminals on the copper foil surface of the first printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14293688U JPH0263567U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14293688U JPH0263567U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263567U true JPH0263567U (en) | 1990-05-11 |
Family
ID=31409305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14293688U Pending JPH0263567U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263567U (en) |
-
1988
- 1988-10-31 JP JP14293688U patent/JPH0263567U/ja active Pending