JPH0262948B2 - - Google Patents
Info
- Publication number
- JPH0262948B2 JPH0262948B2 JP60271731A JP27173185A JPH0262948B2 JP H0262948 B2 JPH0262948 B2 JP H0262948B2 JP 60271731 A JP60271731 A JP 60271731A JP 27173185 A JP27173185 A JP 27173185A JP H0262948 B2 JPH0262948 B2 JP H0262948B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- chip
- testing
- laser
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/717,409 US4644264A (en) | 1985-03-29 | 1985-03-29 | Photon assisted tunneling testing of passivated integrated circuits |
| US717409 | 1985-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61225830A JPS61225830A (ja) | 1986-10-07 |
| JPH0262948B2 true JPH0262948B2 (cg-RX-API-DMAC7.html) | 1990-12-27 |
Family
ID=24881911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60271731A Granted JPS61225830A (ja) | 1985-03-29 | 1985-12-04 | 集積回路チツプの試験方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4644264A (cg-RX-API-DMAC7.html) |
| EP (1) | EP0196475B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPS61225830A (cg-RX-API-DMAC7.html) |
| CA (1) | CA1236929A (cg-RX-API-DMAC7.html) |
| DE (1) | DE3675236D1 (cg-RX-API-DMAC7.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4786864A (en) * | 1985-03-29 | 1988-11-22 | International Business Machines Corporation | Photon assisted tunneling testing of passivated integrated circuits |
| US4755748A (en) * | 1985-06-05 | 1988-07-05 | Bell Communications Research, Inc. | Method and apparatus for analyzing semiconductor devices using charge-sensitive electron-beam-injected-carrier microscopy |
| EP0264482B1 (en) * | 1986-10-23 | 1991-12-18 | International Business Machines Corporation | Method for contactless testing of integrated circuit packaging boards under atmospheric conditions |
| EP0264481B1 (en) * | 1986-10-23 | 1992-05-13 | International Business Machines Corporation | Testing method for integrated circuit packaging boards using a laser in vacuum |
| NL8700933A (nl) * | 1987-04-21 | 1988-11-16 | Philips Nv | Testmethode voor lcd-elementen. |
| JP2690908B2 (ja) * | 1987-09-25 | 1997-12-17 | 株式会社日立製作所 | 表面計測装置 |
| US5225771A (en) * | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
| US5034685A (en) * | 1988-05-16 | 1991-07-23 | Leedy Glenn J | Test device for testing integrated circuits |
| US5020219A (en) * | 1988-05-16 | 1991-06-04 | Leedy Glenn J | Method of making a flexible tester surface for testing integrated circuits |
| US5512397A (en) * | 1988-05-16 | 1996-04-30 | Leedy; Glenn J. | Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits |
| EP0404970A1 (en) * | 1989-06-26 | 1991-01-02 | International Business Machines Corporation | Method and system for contactless testing of electronic activity in an integrated circuit chip-to-test after passivation thereof |
| US5111137A (en) * | 1990-10-29 | 1992-05-05 | Hewlett-Packard Company | Method and apparatus for the detection of leakage current |
| DE69118319T2 (de) * | 1990-11-06 | 1996-08-08 | Texas Instruments Inc | Anwendung eines STM-artigen Systems zur Messung der Knotenspannung in integrierten Schaltungen |
| US5179279A (en) * | 1991-01-25 | 1993-01-12 | Rensselaer Polytechnic Institute | Non-contact electrical pathway |
| US6472889B1 (en) | 2000-06-15 | 2002-10-29 | University Of Connecticut | Apparatus and method for producing an ion channel microprobe |
| TWI565119B (zh) * | 2011-05-27 | 2017-01-01 | 半導體能源研究所股份有限公司 | 發光裝置的製造方法及發光裝置 |
| FR3112653B1 (fr) * | 2020-07-15 | 2025-10-24 | St Microelectronics Alps Sas | Circuit intégré et procédé de diagnostic d’un tel circuit intégré |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4051437A (en) * | 1976-04-02 | 1977-09-27 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for semiconductor profiling using an optical probe |
| DE2824308A1 (de) * | 1978-06-02 | 1979-12-13 | Siemens Ag | Verfahren zum einpraegen einer spannung mit einem elektronenstrahl |
| US4301409A (en) * | 1978-06-06 | 1981-11-17 | California Institute Of Technology | Solar cell anomaly detection method and apparatus |
| US4417203A (en) * | 1981-05-26 | 1983-11-22 | International Business Machines Corporation | System for contactless electrical property testing of multi-layer ceramics |
| US4415851A (en) * | 1981-05-26 | 1983-11-15 | International Business Machines Corporation | System for contactless testing of multi-layer ceramics |
| US4419530A (en) * | 1982-02-11 | 1983-12-06 | Energy Conversion Devices, Inc. | Solar cell and method for producing same |
-
1985
- 1985-03-29 US US06/717,409 patent/US4644264A/en not_active Expired - Fee Related
- 1985-12-04 JP JP60271731A patent/JPS61225830A/ja active Granted
-
1986
- 1986-01-15 CA CA000499662A patent/CA1236929A/en not_active Expired
- 1986-03-04 EP EP86102791A patent/EP0196475B1/en not_active Expired - Lifetime
- 1986-03-04 DE DE8686102791T patent/DE3675236D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE3675236D1 (de) | 1990-12-06 |
| JPS61225830A (ja) | 1986-10-07 |
| US4644264A (en) | 1987-02-17 |
| EP0196475A1 (en) | 1986-10-08 |
| EP0196475B1 (en) | 1990-10-31 |
| CA1236929A (en) | 1988-05-17 |
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| JPH0262948B2 (cg-RX-API-DMAC7.html) | ||
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