JPH0262729U - - Google Patents
Info
- Publication number
- JPH0262729U JPH0262729U JP14125088U JP14125088U JPH0262729U JP H0262729 U JPH0262729 U JP H0262729U JP 14125088 U JP14125088 U JP 14125088U JP 14125088 U JP14125088 U JP 14125088U JP H0262729 U JPH0262729 U JP H0262729U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor
- coated
- semiconductor device
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14125088U JPH0262729U (uk) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14125088U JPH0262729U (uk) | 1988-10-28 | 1988-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0262729U true JPH0262729U (uk) | 1990-05-10 |
Family
ID=31406158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14125088U Pending JPH0262729U (uk) | 1988-10-28 | 1988-10-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0262729U (uk) |
-
1988
- 1988-10-28 JP JP14125088U patent/JPH0262729U/ja active Pending