JPH0262541A - Production of semiconductor product of semi-customized goods - Google Patents

Abstract

PURPOSE:To decrease stages for forming a reticule and to speed up operations by providing plural wiring patterns on the same reticule and blank parts at need thereon and exposing the wiring patterns and the periphery of a wafer. CONSTITUTION:The reticule 1 is segmented by light shielding zones 6 and the different patterns A to D are provided to the wiring pattern parts 2 to 5. When a customer requests the pattern A, the other parts are shielded of light and this pattern is exposed. The cost and man-hours of forming the reticule are reduced and the prepn. time for exposing is shortened by this constitution. Exposing to remove the resist in the peripheral part is executable with one sheet of the reticule 1a by using the reticule 1a formed with the transparent blank parts 7 in the part D and exposing the photoresist of the periphery of the wafer by using the blank parts 7.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and in particular, to a method for manufacturing a semiconductor device, in particular, only the wiring process is performed using a unique wiring pattern according to customer requirements using substrates having the same underlying pattern. The present invention relates to a method for manufacturing a semi-customized semiconductor device formed using a semiconductor device.

[Prior Art] Conventionally, in this type of semi-custom product, when forming a wiring pattern in the wiring process, one reticle 1b as shown in FIG. It was manufactured by performing an exposure operation using 1b. The reticle 1b shown in FIG. 3 is provided with a wiring pattern A part 2 surrounded by a light-shielding band 6, and within this wiring pattern A part 2, pellet boundaries 8 are arranged parallel to the light-shielding band 6 and perpendicular to each other. It is formed.

Also, during peripheral exposure to remove photoresist from the periphery of the wafer, a transparent reticle without wiring patterns is used for exposure, and the photoresist is removed in a separate process from the wiring pattern exposure process. Was.

[Problems to be Solved by the Invention] However, in the conventional manufacturing method for semi-custom products described above, reticles are individually created according to the requirements of each customer, so it is necessary to create a large number of reticles. However, the disadvantage is that it takes a lot of cost and man-hours to create a reticle. Furthermore, since one reticle is used when forming a pattern on a wafer, it is necessary to perform each reticle cleaning, dust inspection, and alignment one by one, and it also takes time to replace the reticle. However, it also has the disadvantage that it takes a lot of preparation time and man-hours to form a pattern on the wafer.

The present invention has been made in view of such problems, and includes:
It is an object of the present invention to provide a method for manufacturing a semiconductor device of a semi-custom product, which can quickly form a wiring pattern of a semi-custom product with a small number of man-hours and at low cost.

[Means for Solving the Problems] A method for manufacturing a semi-customized semiconductor device according to the present invention uses a reticle provided with a plurality of types of wiring patterns, and selects a desired wiring pattern according to a customer's request. The present invention is characterized in that when another desired wiring pattern is exposed, another wiring pattern of the same reticle is used without exchanging the reticle.

In addition, as a reticle, in addition to multiple wiring patterns,
A transparent blank section for peripheral exposure for resist removal may also be provided.

[Operation] In the present invention, a plurality of wiring patterns are provided on the same reticle, and a blank portion is provided as necessary to perform the exposure work of the wiring patterns or the periphery of the wafer. Therefore, even when forming a different wiring pattern or performing peripheral exposure after forming a wiring pattern, the same reticle can be used for exposure work without changing the reticle. Therefore, the reticle production cost and process can be reduced, and the exposure work can be speeded up.

[Example] Next, an example of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view of a reticle 1 used in the first embodiment method of the present invention. This reticle 1 has four sides, and has four different wiring patterns A in the wiring pattern portion 2°3, 4.5.

B, C, and D are formed. Each wiring pattern section 2.3
, 4.5 are surrounded by a light shielding zone 6. This light shielding band 6 is provided to prevent light from leaking to adjacent pellets on the wafer.

When forming a wiring pattern using the reticle 1 configured in this way, if the customer's request is wiring pattern A, the light shielding plate of the exposure apparatus main body is attached to the wiring pattern 78 section 3, the wiring pattern C section 4, and the wiring pattern C section 4. The wiring pattern 79 section 5 is set so as not to be exposed to light, and the wafer for the wiring pattern A is exposed using the wiring pattern A section 2.

Next, when exposing another wiring pattern B, the wiring pattern A section 2, the wiring pattern C section 4, and the wiring pattern 70 section 5 are covered with the light shielding plate, and the wafer for the wiring pattern B is exposed. A similar operation is performed when exposing a wafer for wiring pattern C or wiring pattern D.

2, four wiring patterns A are placed on the same reticle 1.
, B, C, and D, four types of wiring patterns can be formed using one reticle, reducing reticle production costs and man-hours, and significantly reducing the time required for preparation work prior to exposure. Can be shortened.

Note that even in the case where the reticle has multiple surfaces other than the four-sided reticle as in the above embodiment, a plurality of wiring patterns can be provided on the same reticle as described above.

FIG. 2 is a plan view showing a modification of the reticle.

This reticle 1a is similar to reticle 1. shown in FIG. In place of the wiring pattern 79 section 5, a transparent blank section 7 is provided.

When forming a wiring pattern using this reticle 1a, after exposing the wiring pattern on the wafer using either the wiring pattern section 2 or 3.
The blank section 7 is used to expose the photoresist at the periphery of the wafer. By using this reticle 1a as a tube, peripheral exposure for the purpose of removing photoresist around the wafer can be performed with a single reticle, which further reduces the time required for reticle replacement or alignment. There is an advantage.

[Effects of the Invention] As explained above, the present invention uses a reticle in which a plurality of wiring patterns are provided on the same reticle and a blank portion is provided as necessary, and a plurality of wiring patterns can be exposed using the same reticle. or so-called peripheral exposure, it is possible to reduce the cost and man-hours for creating a plurality of reticles or transparent reticles according to customer requirements or the purpose of peripheral exposure.

In addition, we also clean reticles during exposure work, inspect dust,
Another effect is that the time required for replacement and alignment can be significantly shortened.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a reticle used in the embodiment method of the present invention, FIG. 2 is a plan view showing a modified example of the reticle, and FIG. 3 is a plan view showing a reticle used in the conventional method. 1, la, lb; reticle, 2; wiring pattern A section, 3
; Wiring pattern 78 parts, 4; Wiring pattern C part, 5; Wiring pattern 20 parts, 6; Shading zone, 7; Blank part, 8: Bullet boundary

Claims (1)

[Claims] (1) Using a reticle with multiple types of wiring patterns, select and expose the desired wiring pattern according to the customer's request, and change the reticle when exposing another desired wiring pattern. 1. A method for manufacturing a semiconductor device of a semi-custom product, characterized in that exposure is performed using different wiring patterns on the same reticle without any additional wiring.