JPH026240B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for fixing a multilayer printed wiring board before press molding.

[Prior art] Figures 4 to 6 are, for example, from Sumitomo Bakelite Co., Ltd.'s catalog ``Materials for multilayer printed wiring boards''.
JAN1982'' is a process explanatory diagram showing a conventional method for manufacturing a multilayer printed wiring board.

In the figure, 1 is an inner layer copper clad plate with copper clad on both sides, 2 is a positioning guide hole drilled near both ends of this inner layer copper clad plate 1, and 3 is this inner layer copper clad plate 1. 5 is a copper clad plate for an outer layer coated with copper on one side; 6 is a copper clad plate for an outer layer 5 having respective guide holes 2 in the vicinity of both ends of the copper clad plate for an inner layer 1; Positioning guide holes set and drilled at the same pitch, 7 is an interlayer adhesive (prepretg), and 8 is an interlayer adhesive 7 near both ends with the same pitch as each guide hole 2 of the inner layer copper clad plate 1. 9 is a laminated guide pin, 10 is a holding plate for this guide pin, 12 is cushion paper, and 13 is a hot press hot plate.

Next, to explain the process steps, first, as shown in Fig. 4, positioning guide holes 2 are bored in each inner layer copper clad plate 1, 1' cut to a predetermined size using a drilling machine or press punching. Then, using this guide hole 2 as a reference, perform normal exposure using a negative film.
A copper circuit 3 is created by developing and etching.
On the other hand, each outer layer copper clad plate 5 and each interlayer adhesive 7 are prepared with positioning guide holes 6 and 8 opened in the same manner as the inner layer copper clad plate 1. Next, positioning guide holes 2 are placed in the laminated guide pin holding plate 10.
The outer layer copper laminate 5, the interlayer adhesive 7, the inner layer copper laminate 1', the interlayer adhesive 7, the inner layer copper laminate 1, and the interlayer adhesive are attached to the laminated guide pins 9, which are installed upright at the same pitch as the laminate guide pins 9. The material 7 and the outer layer copper clad plate 5 are passed through, and the laminated guide pin holding plate 10 is further placed on top of the other to align these. Thereafter, as shown in FIG. 5, each outer layer copper clad plate 5,5 with a laminated guide pin holding plate 10 arranged on the outside is heated with a hot press hot plate 13, 13 for a predetermined period of time through a cushion paper 12. It is molded into one piece by applying pressure and heating.

[Problems to be Solved by the Invention] Conventional multilayer printed wiring boards are manufactured through the steps described above, so it is necessary to pressurize and heat the lamination guide pin 9 while it is inserted during lamination molding. Therefore, the laminated guide pin holding plate 10
However, it is difficult to transport the multilayer printed wiring board set on the laminated guide pin holding plate 10, and it is not only impossible to mold it immediately, but also requires a large amount of space to store it. Furthermore, during storage, there was a limit to the number of layers that could be set in the same stage due to the strength of the laminated guide pin 9.

Furthermore, according to the conventional manufacturing method, the interlayer adhesive 7 eluted during pressurization and heating passes through the guide hole and hardens in the gap between the hot press hot plate 13 and the laminated guide pin 9, and the laminated guide pin holding plate 10 and the multilayer printed wiring board from the outside and also fix the laminated guide pin 9 to the guide hole, the laminated guide pin holding plate 10 and the laminated guide pin 9 are attached.
It took a lot of time to separate the molded multilayer printed wiring board from the molded multilayer printed wiring board.

In view of the above points, an object of the present invention is to obtain a manufacturing method capable of molding a multilayer printed wiring board without using a lamination guide pin or a large jig during lamination molding.

[Means for Solving the Problems] The method for manufacturing a multilayer printed wiring board of the present invention includes an inner layer copper laminate on which a wiring pattern is formed, and a layer on both sides of the inner layer copper laminate via an interlayer adhesive. In the manufacturing method of a multilayer printed wiring board, in which the outer layer copper laminates to be arranged and fixed are laminated and positioned, and these are integrally molded by applying pressure and heating, the above-mentioned inner and outer layer copper laminates and interlayer adhesive material are After inserting and aligning the guide pins erected on the guide pin holding plate through the guide holes, fixing means such as caulking each aligned member in the notch formed in the guide pin holding plate. The fixed members are then removed from the guide pin holding plate, and then pressurized with a press or the like.
It is characterized by being molded in one piece by heating.

[Function] In the present invention, the copper clad plate for the inner and outer layers is held in a predetermined relative position by a fixing means using a guide pin and its retaining plate, and then pressurized and applied. Since the process proceeds to a hot process, there is no need to use a lamination guide pin holding plate or a lamination guide pin during lamination molding, and the problem of adhesion with the interlayer adhesive after molding is also resolved, making it possible to significantly improve workability.

[Embodiment] Hereinafter, the present invention will be described with reference to an embodiment shown in FIGS. 1 to 3, in which parts corresponding to conventional ones are denoted by the same reference numerals.

In the figure, reference numeral 14 indicates a guide pin, and reference numeral 15 indicates a holding plate for the guide pin, each of which has cutout portions 16 formed near its four corners. Reference numeral 17 indicates the expected caulking positions of each of the copper clad plates 1, 1', 5 for the inner and outer layers and each interlayer adhesive 7, which are set at positions corresponding to the notches 16 of the guide pin holding plate 15, respectively. ing. In Fig. 2, 18 indicates a crimped state, and 19 indicates a crimping pin.
is a hot plate to equalize surface pressure. The configuration other than the above is the same as the conventional one, so a description thereof will be omitted.

Next, the process steps of the present invention will be explained. First, as shown in FIG. Copper circuit 3 is made by performing normal exposure, development, and etching using negative film.
and an alignment mark 4 are respectively created, and then a guide hole 2 is accurately drilled in the center of the alignment mark 4 using a drilling machine equipped with a magnifying glass.

On the other hand, positioning guide holes 6 and 8 at a predetermined pitch are also formed in each outer layer copper clad plate 5 and each interlayer adhesive 7, respectively. Next, the guide pins 14, which are provided upright on the guide pin holding plate 15 at the same pitch as the guide holes 2, are attached to the outer layer copper clad plate 5, the interlayer adhesive 7, the inner layer copper clad plate 1', and the interlayer adhesive. 7. Pass the inner layer copper clad plate 1, the interlayer adhesive 7, and the outer layer copper clad plate 5,
At the same time, use the notch 16 of the guide pin holding plate 15 to place a 3.1 mm hollow rivet (brass,
The inner and outer copper clad plates 1, 1', 5 and the interlayer adhesive material 7 are held in position by caulking with a fixing means such as 6 mm in length. Thereafter, the caulked laminate is removed from the guide pin holding plate 15,
As shown in FIG. 2, a hot plate 19 is placed on the outside of each copper clad plate 5, 5 for the outer layer, which is pressed and heated for a predetermined period of time by hot press hot plates 13, 13 through cushion paper 12. By doing this, it is integrally molded.

As described above, the multilayer printed wiring board of the present invention proceeds to the pressing and heating process with the copper clad plates for the inner and outer layers being held in a predetermined positional relationship by the hollow rivets. Therefore, copper clad plate for outer layer 5,
The inner layer copper laminate 1 and the interlayer adhesive 7 can be laminated without misalignment. Further, during lamination molding, there is no need to use conventional lamination guide pin holding plates or lamination guide pins to align each of the above-mentioned members, and the problem of adhesion with the interlayer adhesive after molding is also resolved. That is, the resin contained in the interlayer adhesive material 7 flows during press molding, and the displacement between the inner and outer copper laminates 1 and 5 and the interlayer adhesive material 7 is eliminated. Therefore, workability can be significantly improved.

In the above embodiments, hollow rivets are used as the fixing means, but other means such as staples or stitchers may be used to achieve the same effect as described above.

[Effects of the Invention] As described above, according to the method for manufacturing a multilayer printed wiring board of the present invention, the guide pins and their retaining plates are used to hold the inner and outer layer copper-clad boards in the normal position during lamination molding. As the process is followed by integral molding, there is no need for the conventional laminated guide pin holding plate or laminated guide pins, there is no guide pin sticking or increase in weight, and the number of jigs can be reduced depending on the number of molds during laminated molding. Only one positioning jig is required instead of the pin method that was previously required, and it is now possible to position and fix the materials that make up the structure in advance, making it possible to prepare a large amount of stacked materials, which improves the rotation rate and work efficiency of the device. Not only can this be significantly improved, but it also has the economical effect of being extremely inexpensive and space-saving, and furthermore, the accuracy of the manufactured multilayer printed wiring board can be significantly improved. The positioning of the inner and outer copper clad plates before lamination molding involves inserting them into the guide pins of the guide pin holding plate and fixing them using the notches of the guide pin holding plate, so that the relative position between the members can be accurately determined. It is effective in ensuring that

[Brief explanation of drawings]

FIG. 1 is a perspective process diagram showing the manufacturing method of the present invention;
Fig. 2 is a sectional view showing the laminated molding state according to the method of the present invention, Fig. 3 is a flowchart showing the manufacturing process of the invention, Fig. 4 is a perspective process diagram showing the conventional manufacturing method, and Fig. 5 is a conventional FIG. 6 is a cross-sectional view showing the laminated molding state according to the method, and a flowchart showing the conventional manufacturing process. 1, 1' are copper clad plates for inner layers, 2 are guide holes, 3 are copper circuits, 5 are copper clad plates for outer layers, 7 is interlayer adhesive, 1
4 is a guide pin, 15 is a guide pin holding plate, 16
is the notch, 17 is the expected caulking position, and 18 is the caulking pin. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. Laminate and position the inner layer copper clad plate on which the wiring pattern is formed and the outer layer copper clad plate, which are respectively arranged and fixed on both sides of the inner layer copper clad plate via an interlayer adhesive, and apply pressure and heat. In a method for manufacturing a multilayer printed wiring board in which these are integrally molded, the above-mentioned inner and outer copper clad plates and interlayer adhesive are inserted through their guide holes and into guide pins erected on a guide pin holding plate. After alignment, each of these aligned members is fixed in a notch formed in the guide pin holding plate by a fixing means such as caulking, and then each of the fixed members is removed from the guide pin holding plate. A method for manufacturing a multilayer printed wiring board, which is then integrally molded by pressurizing and heating using a press or the like.