JPS5968995A - Method of producing multilayer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method of manufacturing a multilayer wiring board.

For multilayer wiring boards, inner layer circuit boards, outer layer circuit boards, and outer layers! lO
1A for each component of multilayer wiring boards such as foil and Grigreg
A level hole for positioning is provided, a reference bottle for positioning is fully inserted into the warp reference hole, the position of the valley structure is adjusted, and the positioning is repeated, and a heating force is applied using a press hot plate to manufacture the product. .

A hole t for a reference bottle for determining the position 1g is pre-drilled in the lifting platform and the copper-clad laminate board for the distribution plate, and an inner layer circuit is formed using the hole as a reference. Position each layer based on the sled rear position I & determination reference bin association standard, and from l to crow, eboki 7, etc.
2J with Regleg! :Ru. Conventional C machining, use the reference hole for positioning the position of each layer using the reference hole for positioning. The method is to place all of the reference bottles on top of each other and layer the constituent materials on top of each other while playing the song. Insert it into the reference bottle of the upper jig for contacting the layer, and press it with heating force on the pressing plate as shown in Figure 6.

In Figures 1 to 6, 1 is a reference bottle, 2 is a multilayer arrangement plate constituent material, 6 is an intermediate plate, 4 is a multilayered accommodation tool, and 5 is a jig reference hole for multilayered rowing. , 6, upper jig for multilayer contact, 7D
Place the feed plate and the plate at 8.

Number 9 is cushion paper, number 10 is bracelet P board.

In this method, in order to prevent damage to the heating device of the press machine (CL), even if the sagging of the EVA multilayer wiring board bottom feather is reduced during heating and pressing, the heating and pressing body can be The reference bins C/J are designed to hang so that the reference bins do not protrude from the lower jig.

In other words, as shown in Fig. 2, all of the top and bottom jigs for contact and the heating and pressure cutting of the multilayer wiring board constituent materials are made in the same way as the standard bottle, with a short length f. . Therefore, if the lower end of the reference bottle falls under the lower end of the multi-layer bonding jig during bonding work, etc., it is necessary to fit all of the materials into the reference bottle as shown in Fig. 4, U-9. It is difficult to set up a standard bin for LOC.
There was a problem in that productivity was reduced by striking the lower jig from below and moving it upwards.

Uninventively, in view of this point, the reference bottle is fixed to a reference bottle fixing plate provided with a hole for fixing the positioning reference bottle at a predetermined position, and multilayer wiring is carried out. Plate CtJ component material CtJ reference hole While inserting into the reference bottle, attach the component material of the multilayer wiring board to the π wave, remove the reference bottle fixing plate, use the reference bottle multilayer adhesive soil, and hold it in the reference hole of the lower jig. In general, apply a clamping force to the upper and lower jigs for connecting the multilayer wiring board CI) to the constituent materials [1C and t% of heat pressurization]
Fix the standard bottle to the standard bottle (/J fixing plate, and then create the overlay of the multi-layer concept board #4 bottom material. IL can be made of any material. stomach.

For example, thermosetting resin laminates, hard rubber, and Kinpo plates are used. The depth of the fitting hole (a) on the fixed plate is such that there is enough space left on the fixing plate for the reference pin to insert all of the material into the reference pin. The shape of the hole may be a bottomed hole or a through hole, but in the case of a through hole,
To set the tab, make sure to keep the required length of the reference bottle or the rigid plate.
b7C Meniso IL Worker Thousand People Kikusa IL Ru OV Sueha 0
．． 1 to Q, it is better to increase the size by about 5 mm. There is no problem even if the reference pin area in the mating hole is large.

The fitting hole of the standard bottle fixing plate is machined, and the lower end of the V standard bottle is given a certain length and protrudes to the outside of the multilayer fat plate material.
7: IL sea urchin is good.

FIG. 5 shows one method of the present invention, in which reference numeral 11 indicates a reference bin fixing plate, and 12 indicates a hole for fixing a positioning reference bin.

Example standard bottle fixing plate uses one paper and phenol laminated board,
Standard bottle on the wainscot (diameter 5.[]+++m) I hollowed out depth i 1.5mm diameter 5.02m
A hole of 1l1 or more is provided, a reference bottle is inserted into the reference hole of the first multilayer wiring board constituent material, and an inserter is inserted into the hole of the reference bottle fixed foot plate. After that, Junkai 2 is the multilayer wiring board S layer material (
Copper-clad laminates, prepregs, etc.) are applied across the layer, and after the work is completed, the reference bin fixing plate area is removed, and the positioning page mount is multi-layered. Insert it into the reference hole of the jig and sandwich it between the upper and lower jigs for multilayer adhesion and apply heat and pressure. C/JK for inserting all of the constituent materials - Since sufficient reference bins are maintained, the productivity of the work is significantly increased.

[Brief explanation of drawings]

Figures 1 to 4 are cross-sectional views showing the manufacturing process of multilayer wiring boards. Plate constituent material 6
Intermediate plate 4 Jig for multi-layered contact layer 5 Jig reference hole for multi-layered contact layer 6 Jig for multi-layered contact layer 7 Feed plate
8 Cover plate 9 Shoes 737 paper 10 Breath heater 11 Reference bottle fixing plate 12 Reference bottle identification plate hole 5
0 5th garden

Claims (1)

[Claims] 1. Place the pre-determined 2IA base bottle for positioning. Make a hole for the LI reference pin and fix the reference pin on the multilayer front shaft plate (/J structure) while inserting one reference hole into the reference bottle. For stacking, remove ην from the π plate facing the reference bottle, insert the reference bottle into the reference hole of the upper 9th jig for multilayer bonding, and use it to inspect the bottom of the multilayer wiring board. A method for manufacturing a multilayer wiring board in which the % characteristic is ``T'' and ``T''.