JPH0259860U - - Google Patents

Info

Publication number
JPH0259860U
JPH0259860U JP14059788U JP14059788U JPH0259860U JP H0259860 U JPH0259860 U JP H0259860U JP 14059788 U JP14059788 U JP 14059788U JP 14059788 U JP14059788 U JP 14059788U JP H0259860 U JPH0259860 U JP H0259860U
Authority
JP
Japan
Prior art keywords
solder
ceramic wiring
wiring board
flux
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14059788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14059788U priority Critical patent/JPH0259860U/ja
Publication of JPH0259860U publication Critical patent/JPH0259860U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14059788U 1988-10-27 1988-10-27 Pending JPH0259860U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14059788U JPH0259860U (enrdf_load_stackoverflow) 1988-10-27 1988-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14059788U JPH0259860U (enrdf_load_stackoverflow) 1988-10-27 1988-10-27

Publications (1)

Publication Number Publication Date
JPH0259860U true JPH0259860U (enrdf_load_stackoverflow) 1990-05-01

Family

ID=31404914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14059788U Pending JPH0259860U (enrdf_load_stackoverflow) 1988-10-27 1988-10-27

Country Status (1)

Country Link
JP (1) JPH0259860U (enrdf_load_stackoverflow)

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