JPH0259677A - 電子ビームを用いた非接触試験方法 - Google Patents
電子ビームを用いた非接触試験方法Info
- Publication number
- JPH0259677A JPH0259677A JP88211420A JP21142088A JPH0259677A JP H0259677 A JPH0259677 A JP H0259677A JP 88211420 A JP88211420 A JP 88211420A JP 21142088 A JP21142088 A JP 21142088A JP H0259677 A JPH0259677 A JP H0259677A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- voltage
- measured
- pattern
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Current Or Voltage (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP88211420A JPH0259677A (ja) | 1988-08-25 | 1988-08-25 | 電子ビームを用いた非接触試験方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP88211420A JPH0259677A (ja) | 1988-08-25 | 1988-08-25 | 電子ビームを用いた非接触試験方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0259677A true JPH0259677A (ja) | 1990-02-28 |
| JPH0587789B2 JPH0587789B2 (cg-RX-API-DMAC10.html) | 1993-12-17 |
Family
ID=16605661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP88211420A Granted JPH0259677A (ja) | 1988-08-25 | 1988-08-25 | 電子ビームを用いた非接触試験方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259677A (cg-RX-API-DMAC10.html) |
-
1988
- 1988-08-25 JP JP88211420A patent/JPH0259677A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0587789B2 (cg-RX-API-DMAC10.html) | 1993-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5030908A (en) | Method of testing semiconductor elements and apparatus for testing the same | |
| US3531716A (en) | Method of testing an electronic device by use of an electron beam | |
| JP2682560B2 (ja) | 配線網の無接点テスト方法およびシステム | |
| US6047243A (en) | Method for quantifying ultra-thin dielectric reliability: time dependent dielectric wear-out | |
| US5485097A (en) | Method of electrically measuring a thin oxide thickness by tunnel voltage | |
| CN101958262A (zh) | 失效检测方法以及失效检测装置 | |
| JPS61225830A (ja) | 集積回路チツプの試験方法 | |
| US4786864A (en) | Photon assisted tunneling testing of passivated integrated circuits | |
| JPH0450674A (ja) | 絶縁破壊評価用試験素子 | |
| JPH0259677A (ja) | 電子ビームを用いた非接触試験方法 | |
| CN118962376A (zh) | 待测碳化硅器件的栅极氧化层失效的测试方法和系统 | |
| JPH11186350A (ja) | 半導体の少数キャリアの再結合ライフタイム測定方法 | |
| US7170056B2 (en) | Methodology and apparatus for leakage detection | |
| JPH09330964A (ja) | 半導体装置の寿命推定方法 | |
| Herrmann et al. | Some aspects concerning design for e-beam testability | |
| EP0237406A2 (en) | Electron beam testing of semiconductor wafers | |
| CN222561647U (zh) | 晶圆承载装置和半导体检测设备 | |
| JPH03132052A (ja) | Mis界面評価法及び装置 | |
| JPS61207028A (ja) | 電子デバイスの試験方法 | |
| Comizzoli | Investigation of Surface Ion Failure Mechanisms by Corona Discharge | |
| JP3319078B2 (ja) | 半導体素子測定方法 | |
| JP2584093B2 (ja) | 絶縁膜の信頼性評価方法 | |
| JPS60189953A (ja) | 集積回路 | |
| JPS61104633A (ja) | 半導体表面の帯電電荷量測定方法 | |
| JPH04146644A (ja) | 半導体評価装置およびそれを用いたtddb試験方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071217 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081217 Year of fee payment: 15 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081217 Year of fee payment: 15 |