JPH0258385U - - Google Patents
Info
- Publication number
- JPH0258385U JPH0258385U JP13678488U JP13678488U JPH0258385U JP H0258385 U JPH0258385 U JP H0258385U JP 13678488 U JP13678488 U JP 13678488U JP 13678488 U JP13678488 U JP 13678488U JP H0258385 U JPH0258385 U JP H0258385U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply device
- board
- housing
- metal board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136784U JPH0729670Y2 (ja) | 1988-10-19 | 1988-10-19 | 電源装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136784U JPH0729670Y2 (ja) | 1988-10-19 | 1988-10-19 | 電源装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258385U true JPH0258385U (US06244707-20010612-C00011.png) | 1990-04-26 |
| JPH0729670Y2 JPH0729670Y2 (ja) | 1995-07-05 |
Family
ID=31397614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988136784U Expired - Lifetime JPH0729670Y2 (ja) | 1988-10-19 | 1988-10-19 | 電源装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729670Y2 (US06244707-20010612-C00011.png) |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717156A (en) * | 1980-03-26 | 1982-01-28 | Thomson Csf | Sealing box for power module of hybrid circuit |
| JPS58133985U (ja) * | 1982-03-03 | 1983-09-09 | 株式会社日立製作所 | 集積回路の取付構造 |
| JPS59146949U (ja) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | 混成集積回路モジユ−ル |
| JPS59224192A (ja) * | 1983-06-03 | 1984-12-17 | 松下電器産業株式会社 | 高熱伝導性金属ベ−スプリント配線板 |
| JPS60167399A (ja) * | 1984-02-09 | 1985-08-30 | 松下電器産業株式会社 | 高熱伝導性金属ベ−ス回路基板 |
| JPS61156754A (ja) * | 1984-12-27 | 1986-07-16 | Matsushita Electric Ind Co Ltd | 高熱伝導性金属ベ−スプリント基板 |
| JPS61166148A (ja) * | 1985-01-18 | 1986-07-26 | Sanyo Electric Co Ltd | 多層混成集積回路装置 |
| JPS61207072U (US06244707-20010612-C00011.png) * | 1985-06-18 | 1986-12-27 | ||
| JPS627145A (ja) * | 1985-07-02 | 1987-01-14 | Sharp Corp | 電力半導体装置 |
| JPS62208653A (ja) * | 1986-03-07 | 1987-09-12 | Matsushita Electric Ind Co Ltd | ハイブリツドｉｃ |
| JPS62214696A (ja) * | 1986-03-15 | 1987-09-21 | 松下電工株式会社 | プリント配線板およびその製造方法 |
| JPS62237750A (ja) * | 1986-04-09 | 1987-10-17 | Hitachi Ltd | 半導体モジユ−ル素子 |
| JPS6346853U (US06244707-20010612-C00011.png) * | 1986-09-12 | 1988-03-30 | ||
| JPS6359386U (US06244707-20010612-C00011.png) * | 1986-10-06 | 1988-04-20 | ||
| JPS6395296U (US06244707-20010612-C00011.png) * | 1986-12-11 | 1988-06-20 | ||
| JPS63250900A (ja) * | 1987-04-08 | 1988-10-18 | 株式会社日立製作所 | パワ−モジユ−ルの実装構造 |
| JPS6477153A (en) * | 1987-09-18 | 1989-03-23 | Mitsubishi Electric Corp | Power module |
| JPH01129885U (US06244707-20010612-C00011.png) * | 1988-02-26 | 1989-09-04 |
-
1988
- 1988-10-19 JP JP1988136784U patent/JPH0729670Y2/ja not_active Expired - Lifetime
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717156A (en) * | 1980-03-26 | 1982-01-28 | Thomson Csf | Sealing box for power module of hybrid circuit |
| JPS58133985U (ja) * | 1982-03-03 | 1983-09-09 | 株式会社日立製作所 | 集積回路の取付構造 |
| JPS59146949U (ja) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | 混成集積回路モジユ−ル |
| JPS59224192A (ja) * | 1983-06-03 | 1984-12-17 | 松下電器産業株式会社 | 高熱伝導性金属ベ−スプリント配線板 |
| JPS60167399A (ja) * | 1984-02-09 | 1985-08-30 | 松下電器産業株式会社 | 高熱伝導性金属ベ−ス回路基板 |
| JPS61156754A (ja) * | 1984-12-27 | 1986-07-16 | Matsushita Electric Ind Co Ltd | 高熱伝導性金属ベ−スプリント基板 |
| JPS61166148A (ja) * | 1985-01-18 | 1986-07-26 | Sanyo Electric Co Ltd | 多層混成集積回路装置 |
| JPS61207072U (US06244707-20010612-C00011.png) * | 1985-06-18 | 1986-12-27 | ||
| JPS627145A (ja) * | 1985-07-02 | 1987-01-14 | Sharp Corp | 電力半導体装置 |
| JPS62208653A (ja) * | 1986-03-07 | 1987-09-12 | Matsushita Electric Ind Co Ltd | ハイブリツドｉｃ |
| JPS62214696A (ja) * | 1986-03-15 | 1987-09-21 | 松下電工株式会社 | プリント配線板およびその製造方法 |
| JPS62237750A (ja) * | 1986-04-09 | 1987-10-17 | Hitachi Ltd | 半導体モジユ−ル素子 |
| JPS6346853U (US06244707-20010612-C00011.png) * | 1986-09-12 | 1988-03-30 | ||
| JPS6359386U (US06244707-20010612-C00011.png) * | 1986-10-06 | 1988-04-20 | ||
| JPS6395296U (US06244707-20010612-C00011.png) * | 1986-12-11 | 1988-06-20 | ||
| JPS63250900A (ja) * | 1987-04-08 | 1988-10-18 | 株式会社日立製作所 | パワ−モジユ−ルの実装構造 |
| JPS6477153A (en) * | 1987-09-18 | 1989-03-23 | Mitsubishi Electric Corp | Power module |
| JPH01129885U (US06244707-20010612-C00011.png) * | 1988-02-26 | 1989-09-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729670Y2 (ja) | 1995-07-05 |
