JPH0258356U - - Google Patents
Info
- Publication number
- JPH0258356U JPH0258356U JP13671788U JP13671788U JPH0258356U JP H0258356 U JPH0258356 U JP H0258356U JP 13671788 U JP13671788 U JP 13671788U JP 13671788 U JP13671788 U JP 13671788U JP H0258356 U JPH0258356 U JP H0258356U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor device
- hole portions
- sided
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13671788U JPH0258356U (US08088816-20120103-C00036.png) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13671788U JPH0258356U (US08088816-20120103-C00036.png) | 1988-10-21 | 1988-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0258356U true JPH0258356U (US08088816-20120103-C00036.png) | 1990-04-26 |
Family
ID=31397485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13671788U Pending JPH0258356U (US08088816-20120103-C00036.png) | 1988-10-21 | 1988-10-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0258356U (US08088816-20120103-C00036.png) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0513818A (ja) * | 1991-07-05 | 1993-01-22 | Sharp Corp | 表面実装型発光ダイオード |
JPH05114751A (ja) * | 1991-10-23 | 1993-05-07 | Sharp Corp | 光半導体装置 |
JPH09181359A (ja) * | 1995-12-27 | 1997-07-11 | Shichizun Denshi:Kk | チップ型発光ダイオード |
JP2001160630A (ja) * | 1999-12-03 | 2001-06-12 | Rohm Co Ltd | チップ型半導体装置 |
JP2013105784A (ja) * | 2011-11-10 | 2013-05-30 | Seiko Instruments Inc | 光センサ装置およびその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55107283A (en) * | 1979-02-09 | 1980-08-16 | Matsushita Electric Ind Co Ltd | Luminous diode |
JPS6210456B2 (US08088816-20120103-C00036.png) * | 1980-12-10 | 1987-03-06 | Sanyo Denki Kk |
-
1988
- 1988-10-21 JP JP13671788U patent/JPH0258356U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55107283A (en) * | 1979-02-09 | 1980-08-16 | Matsushita Electric Ind Co Ltd | Luminous diode |
JPS6210456B2 (US08088816-20120103-C00036.png) * | 1980-12-10 | 1987-03-06 | Sanyo Denki Kk |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0513818A (ja) * | 1991-07-05 | 1993-01-22 | Sharp Corp | 表面実装型発光ダイオード |
JPH05114751A (ja) * | 1991-10-23 | 1993-05-07 | Sharp Corp | 光半導体装置 |
JPH09181359A (ja) * | 1995-12-27 | 1997-07-11 | Shichizun Denshi:Kk | チップ型発光ダイオード |
JP2001160630A (ja) * | 1999-12-03 | 2001-06-12 | Rohm Co Ltd | チップ型半導体装置 |
JP2013105784A (ja) * | 2011-11-10 | 2013-05-30 | Seiko Instruments Inc | 光センサ装置およびその製造方法 |