JPH0258356U - - Google Patents

Info

Publication number
JPH0258356U
JPH0258356U JP13671788U JP13671788U JPH0258356U JP H0258356 U JPH0258356 U JP H0258356U JP 13671788 U JP13671788 U JP 13671788U JP 13671788 U JP13671788 U JP 13671788U JP H0258356 U JPH0258356 U JP H0258356U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
hole portions
sided
corners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13671788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13671788U priority Critical patent/JPH0258356U/ja
Publication of JPH0258356U publication Critical patent/JPH0258356U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP13671788U 1988-10-21 1988-10-21 Pending JPH0258356U (US06650917-20031118-M00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13671788U JPH0258356U (US06650917-20031118-M00005.png) 1988-10-21 1988-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13671788U JPH0258356U (US06650917-20031118-M00005.png) 1988-10-21 1988-10-21

Publications (1)

Publication Number Publication Date
JPH0258356U true JPH0258356U (US06650917-20031118-M00005.png) 1990-04-26

Family

ID=31397485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13671788U Pending JPH0258356U (US06650917-20031118-M00005.png) 1988-10-21 1988-10-21

Country Status (1)

Country Link
JP (1) JPH0258356U (US06650917-20031118-M00005.png)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513818A (ja) * 1991-07-05 1993-01-22 Sharp Corp 表面実装型発光ダイオード
JPH05114751A (ja) * 1991-10-23 1993-05-07 Sharp Corp 光半導体装置
JPH09181359A (ja) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk チップ型発光ダイオード
JP2001160630A (ja) * 1999-12-03 2001-06-12 Rohm Co Ltd チップ型半導体装置
JP2013105784A (ja) * 2011-11-10 2013-05-30 Seiko Instruments Inc 光センサ装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107283A (en) * 1979-02-09 1980-08-16 Matsushita Electric Ind Co Ltd Luminous diode
JPS6210456B2 (US06650917-20031118-M00005.png) * 1980-12-10 1987-03-06 Sanyo Denki Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107283A (en) * 1979-02-09 1980-08-16 Matsushita Electric Ind Co Ltd Luminous diode
JPS6210456B2 (US06650917-20031118-M00005.png) * 1980-12-10 1987-03-06 Sanyo Denki Kk

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513818A (ja) * 1991-07-05 1993-01-22 Sharp Corp 表面実装型発光ダイオード
JPH05114751A (ja) * 1991-10-23 1993-05-07 Sharp Corp 光半導体装置
JPH09181359A (ja) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk チップ型発光ダイオード
JP2001160630A (ja) * 1999-12-03 2001-06-12 Rohm Co Ltd チップ型半導体装置
JP2013105784A (ja) * 2011-11-10 2013-05-30 Seiko Instruments Inc 光センサ装置およびその製造方法

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