JPH0257009A - Piezoelectric resonator - Google Patents

Piezoelectric resonator

Info

Publication number
JPH0257009A
JPH0257009A JP20854088A JP20854088A JPH0257009A JP H0257009 A JPH0257009 A JP H0257009A JP 20854088 A JP20854088 A JP 20854088A JP 20854088 A JP20854088 A JP 20854088A JP H0257009 A JPH0257009 A JP H0257009A
Authority
JP
Japan
Prior art keywords
vibrating body
electrode
oscillating body
disk
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20854088A
Other languages
Japanese (ja)
Inventor
Toshitsugu Ueda
敏嗣 植田
Daisuke Yamazaki
大輔 山崎
Mina Kobayashi
小林 みな
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP20854088A priority Critical patent/JPH0257009A/en
Publication of JPH0257009A publication Critical patent/JPH0257009A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To form the piezoelectric resonator of a high Q-value and a small secular change by forming a step part, whose cross-section is projected, in central parts on the both surfaces of a disk, forming an oscillating body, for which a linking beam is formed in the position of zero power sensitivity coefficient, and an electrode plate with using the crystal of same quality as this oscillating body and forming a metallic layer, which goes to be a spacer, with metal. CONSTITUTION:An oscillating body 20 is a disk to be produced from an AT cut crystal substrate and the center (a B-part) of the both surfaces is made slightly thick and formed in the projecting shape in the cross section. Near the surrounding edge of this disk, a circle-shaped through hole 28 is formed with remaining a linking beam 27 in four spots in the position, where the power sensitivity coefficient goes to be zero. In the central parts of electrode boards 21 and 22 which are formed from an AT cut crystal substrate of the same quality as the oscillating body, thin film electrodes 23 and 24 of Au are formed and in the surrounding edge, metallic layers 25 and 26 of the Au are formed to be operated as the spacer. Since a projecting part is provided in the oscillating body, oscillation energy can be shut in the projecting part. Accordingly, since the deplacement of a part excepting for the projecting part of the oscillating body can be decreased, the Q-value can be improved.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は圧電共振器に関し、振動子および電極板の加工
容易化に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a piezoelectric resonator, and relates to facilitating the processing of a vibrator and an electrode plate.

〈従来の技術〉 第9図はこの種の圧電共振器の従来例を示す断面図であ
る。第9図において1は円板状の振動体であり1一方の
面は平面、他方の面は球状に形成されている。2,3は
電極板で中央部に電極4゜5が形成され周縁にはリング
状にスペーサ6.7が形成されている。8.9は電極4
,5に接続された電源接続端子である。なお1図は振動
体と電極板を組合せる前の状態を示しており1組み合せ
た状態ではイで示す周縁部が電極板2,3のスペサ6,
7に挟まれ電fii4と振動体の球面および電極5と平
面部が僅かな距離を隔てて対向して固定される。
<Prior Art> FIG. 9 is a sectional view showing a conventional example of this type of piezoelectric resonator. In FIG. 9, reference numeral 1 denotes a disc-shaped vibrating body, one surface of which is flat and the other surface spherical. Reference numerals 2 and 3 refer to electrode plates having an electrode 4.degree.5 formed in the center and a ring-shaped spacer 6.7 formed on the periphery. 8.9 is electrode 4
, 5 is the power supply connection terminal. Note that Figure 1 shows the state before the vibrating body and the electrode plate are combined.
7, the electric fii 4 and the spherical surface of the vibrating body, and the electrode 5 and the flat surface are fixed facing each other with a small distance between them.

第10図は振動体の平面図である。図において10はリ
ング状の貫通孔で振動体の周縁近傍に中央部口と周縁部
イを連結する4本の連結梁11を残して形成されている
。なお、これらは図示しない容器内に収納される。
FIG. 10 is a plan view of the vibrating body. In the figure, reference numeral 10 denotes a ring-shaped through hole, which is formed near the periphery of the vibrating body, leaving four connecting beams 11 connecting the central opening and the peripheral edge A. Note that these are stored in a container (not shown).

上記構成において、接続端子8.9に交流電源を接続す
ると連結梁11に支持された振動部口か固有振動により
振動する。
In the above configuration, when an AC power source is connected to the connection terminal 8.9, the vibrating portion supported by the connecting beam 11 vibrates due to natural vibration.

〈発明が解決しようとする問題点〉 ところで、上記従来例において振動体の一面を球状に加
工しであるのは振動体に発生した振動を内部に封じ込め
て振動の減衰を防止する為である。
<Problems to be Solved by the Invention> By the way, in the above-mentioned conventional example, one side of the vibrating body is processed into a spherical shape in order to confine the vibration generated in the vibrating body inside and prevent vibration attenuation.

しかしなからこの従来例の様に振動体の一方の面を球状
に加工すると、その球面の加]−のみならず電極板の面
も球面加工をしなければならないので製作費か高価にな
るという問題かある。また従来は貫通孔を超音波加工に
より加圧しているが。
However, if one surface of the vibrating body is machined into a spherical shape as in this conventional example, not only the spherical surface must be processed, but also the surface of the electrode plate must be processed into a spherical shape, which increases manufacturing costs. There's a problem. Furthermore, conventionally, the through holes are pressurized by ultrasonic machining.

この加工方法は大量生産に不向きであり、また加工後歪
みが残るので経年変化が発生し固有振動数か変化すると
いう問題があった。
This processing method is not suitable for mass production, and since distortion remains after processing, there is a problem that deterioration occurs over time and the natural frequency changes.

本発明は上記従来技術の問題点に鑑みて為されたもので
振動体を加工が簡単な形状とし、加工歪みのない方法を
用いることにより、Q値が高く長期的に安定度の高い圧
電共振器を実現することを目自勺とする。
The present invention has been made in view of the above-mentioned problems of the prior art, and by making the vibrating body into a shape that is easy to process and using a method that does not cause processing distortion, piezoelectric resonance with a high Q value and high stability over the long term can be achieved. The aim is to realize the vessel.

く課題を解決するための手段〉 」1記問題点を解決するための本発明の構成は円板の両
面の中心部に断面凸状の段部か形成されるとともに、前
記円板の周縁部近傍に力感度係数か0となる位置に前記
中心部と周縁部を連結する4本の連結梁を残してリンク
状に形成された貫通孔を有する水晶振動体と、前記振動
体と約同径とされ、一方の面の中心部に電極が形成され
るとともにその周縁に前記凸部より厚い厚さの金属j脅
か形成された一対の電極板を有j〜、前記振動体の段部
と電極板の電極を対向さぜな状態で前記振動体を前記電
極板でザンドイッチ状に固定したことを特徴とするもの
である。
The structure of the present invention for solving the problem described in item 1 is that a stepped portion having a convex cross section is formed at the center of both sides of the disc, and a step portion having a convex cross section is formed at the center of both sides of the disc, and the peripheral edge of the disc is a crystal vibrating body having a through hole formed in a link shape with four connecting beams connecting the center portion and the peripheral portion remaining in the vicinity at a position where the force sensitivity coefficient becomes 0; and a crystal vibrating body having a diameter approximately the same as that of the vibrating body. An electrode is formed at the center of one surface, and a pair of electrode plates formed of metal thicker than the convex portion is formed on the periphery of the electrode, and the stepped portion of the vibrating body and The vibrating body is fixed to the electrode plate in a sandwich shape with the electrodes of the electrode plate facing each other.

く実方缶例〉 以下2本発明を図面に基づいて説明する。第1図は本発
明に係かる圧電共振子の一実施例を示ず断面構成図、第
2図は振動体の平面図、第3図は電極板の平面図である
Practical Can Example> Two aspects of the present invention will be explained below based on the drawings. FIG. 1 is a cross-sectional configuration diagram showing an embodiment of a piezoelectric resonator according to the present invention, FIG. 2 is a plan view of a vibrating body, and FIG. 3 is a plan view of an electrode plate.

これらの図において、振動体2oはA Tカット水晶基
板から製作された円板であり1両面の中央(口部)かわ
すかに厚内とされ断面凸状に形成されている。この円板
の周縁近傍には力感度係数が0となる位fi (−1−
X軸がら左右に約60°回転した位置と、そこから更に
約60’回転した位置)の4箇所に連結梁27を残して
円状の貫通孔28か形成されている。
In these figures, the vibrating body 2o is a disk made from an AT-cut crystal substrate, and has a convex cross-section with a slightly thick center (mouth) on one side. Near the periphery of this disk, the force sensitivity coefficient becomes 0, fi (-1-
Circular through-holes 28 are formed with connecting beams 27 remaining at four locations (a position rotated about 60° left and right about the X-axis, and a position further rotated about 60' from there).

23、.22は振動体と同様の材質のATカッ1へ水晶
基板から形成された電極板で、その中央部にA uの薄
膜電極23.24が形成され4周縁にはスペーサとして
機能するA uの金属層2526が形成されている。な
お、中央部の薄膜電極2324は第3図に示すようにリ
ンク状の金属層の一部を削除して外部へ取り出される。
23. Reference numeral 22 denotes an electrode plate formed from a crystal substrate to an AT cup 1 made of the same material as the vibrating body, with thin film electrodes 23 and 24 made of Au formed in the center thereof, and metal made of Au which functions as a spacer around the 4th periphery. Layer 2526 is formed. Note that the central thin film electrode 2324 is taken out to the outside by removing a part of the link-shaped metal layer, as shown in FIG.

上記構成において1図示しない電源から電極23.24
に交流電圧を印加すると振動体2oが固有振動数で振動
するか、振動体に凸部を設けているなめ、その振動は貫
通孔の位置まで伝わらす凸部との境界の段部て反射する
。その結果振動エネルギーを凸部に閉じこめることが出
来る。従って振動体の凸部以外の部分の変位を低減する
ことが出来、Q値を高めることが出来る。
In the above configuration, electrodes 23 and 24 are connected to the power source (not shown).
When an AC voltage is applied to the vibrating body 2o, the vibrating body 2o vibrates at its natural frequency, or because the vibrating body has a convex part, the vibration is reflected at the step at the boundary with the convex part, which is transmitted to the position of the through hole. . As a result, vibration energy can be confined in the convex portion. Therefore, the displacement of the parts other than the convex portions of the vibrating body can be reduced, and the Q value can be increased.

第4図は振動体の連結梁の位置と力感度係数の関係を示
す図で、−+−X軸を中心としてここから角度ψの位置
に力Fを印加しながら感度係数を求めたものである。図
によれば、+X軸を中心として左右に約60°の位置と
約120°の位置で力感度係数が0になることが分る。
Figure 4 is a diagram showing the relationship between the position of the connecting beam of the vibrating body and the force sensitivity coefficient.The sensitivity coefficient was obtained while applying force F at a position at an angle ψ centered on the -+-X axis. be. According to the figure, it can be seen that the force sensitivity coefficient becomes 0 at a position of about 60 degrees and a position of about 120 degrees left and right about the +X axis.

従って本発明ではこの位置に連結梁を形成することによ
り、支持部1.5mm、凸部の径aを8mmおよび10
mmとし1段差量と振動振幅の減衰量の関係を示すもの
である。
Therefore, in the present invention, by forming a connecting beam at this position, the support part is 1.5 mm, and the diameter a of the convex part is 8 mm and 10 mm.
The relationship between the amount of one step difference and the amount of attenuation of vibration amplitude is shown in mm.

図によれば段差量を1〜3μm程度とすることにより振
動振幅の減衰量を99%以下にすることか出来る。
According to the figure, by setting the step amount to about 1 to 3 μm, the amount of attenuation of the vibration amplitude can be reduced to 99% or less.

第6図は本発明の振動体の概略加エエ稈を示す説明図で
ある。二り稈に従って簡単に説明する。
FIG. 6 is an explanatory view schematically showing the processed culm of the vibrating body of the present invention. I will briefly explain it according to the two culms.

工程 1) 水晶ウェハを洗浄する。Process 1) Clean the crystal wafer.

工程 2) ウェハの両面にCrとAuのスパッタリングを行う。Process 2) Cr and Au are sputtered on both sides of the wafer.

工程 3) レジストを塗布し型抜きレジストパターニングを行う。Process 3) Apply resist and perform resist patterning.

工程 4) パターニングを行って露出しなAu、Crのエツチング
を行い1段部(厚内)とすべき部分のレジストパターニ
ングを行う。
Step 4) Perform patterning to etch the exposed Au and Cr, and perform resist patterning on the portion that is to be the first step (within thickness).

工程 5) 水晶の異方性エツチングを行い1円板状の振動体を形成
する。
Step 5) Perform anisotropic etching of the crystal to form a disc-shaped vibrating body.

工程 6) 周縁部をエツチングして段部を形成する。Process 6) Etch the peripheral edge to form a step.

工程 7) Au、Crのエツチングを行う。Process 7) Perform etching of Au and Cr.

次に第7図を用いて電極板の概略加工工程を示す。工程
に従って簡単に説明する。
Next, a schematic processing process of the electrode plate will be shown using FIG. A simple explanation will be given step by step.

工程 1) 水晶ウェハを洗浄する。Process 1) Clean the crystal wafer.

工程 2) ウェハの両面にCrとAuのスパッタリングを行い、レ
ジストを塗布し金属層を形成すべき形状にパターニング
を行う。
Step 2) Cr and Au are sputtered on both sides of the wafer, resist is applied, and patterned into the shape in which the metal layer is to be formed.

工程 3) Cr、Au層の上にAuメツキを行って約10μm程度
の厚さに金属層を形成する。
Step 3) Perform Au plating on the Cr and Au layers to form a metal layer with a thickness of about 10 μm.

工程 4) 金属層を含むウェハ全体にレジストを塗布し。Process 4) Apply resist to the entire wafer including the metal layer.

電極板の形状にパターニングを行う。Patterning is performed in the shape of the electrode plate.

工程 5) パターニングにより露出しなAu、Orのエツチングを
行い水晶を露出させる。
Step 5) Etch the Au and Or that are not exposed by patterning to expose the crystal.

工程 6) 水晶の異方性エツチングを行い2円板状の電極板を形成
する。
Step 6) Perform anisotropic etching of the crystal to form two disc-shaped electrode plates.

工程 7) Au、Crのエツチングを行う。Process 7) Perform etching of Au and Cr.

本発明の振動体および電極板は上記工程により製作する
が、水晶の加工に際してはすべてエツチングを用いてい
る為、加工による応力か発生することがない。
The vibrating body and electrode plate of the present invention are manufactured by the above-mentioned process, but since etching is used in all crystal processing, no stress is generated due to processing.

第8図は振動体の他の実施例を示すもので凸部を複数段
に形成している。この様な形状に加工することにより、
より完全に振動エネルギーを凸部に閉じこめることが可
能である。
FIG. 8 shows another embodiment of the vibrating body, in which the convex portions are formed in multiple stages. By processing it into such a shape,
It is possible to more completely confine vibration energy in the convex portion.

〈発明の効果〉 以上、実施例とともに具体的に説明したように本発明に
よれば1円板の両面の中心部に断面凸状の段部を形成し
、力感度係数がOとなる位置に連結梁を形成した振動体
と、この振動体と同様の材質の水晶を用いて電極板を作
成し、スペーサとなる金属層を金で形成したので、Q値
の高い経年変化の少ない圧電共振器を実現することが出
来る。
<Effects of the Invention> As specifically explained above in conjunction with the embodiments, according to the present invention, a stepped portion having a convex cross section is formed at the center of both sides of one circular plate, and a stepped portion is formed at a position where the force sensitivity coefficient is O. We created a piezoelectric resonator with a high Q value and little deterioration over time because we created an electrode plate using a vibrating body that formed a connecting beam and a crystal made of the same material as the vibrating body, and a metal layer that served as a spacer was made of gold. can be realized.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の共振器の一実施例を示す断面構成図、
第2図は振動体の平面図、第3図は電極板の平面図、第
4図は連結梁の位置と力感度係数の関係を示す図、第5
図は振動梁の段部における振動振幅の減衰状態を示す図
、第6図は振動体の概略加工工程を示す図、第7図は電
極板の概略加工工程を示す図、第8図は振動体の他の実
施例を示す図、第9図、第10図は従来例を示す図であ
る。 20・・・振動体、21.22・・・電極板、23.2
4・・・電極、25.26・・・金属層、27・・・連
結梁。 28・・・貫通孔。 セ〈゛?徒漿張 覧敲茸ハ1蛤にE 第 乙 図 工杼 氷晶 c====================フe−C
ヒ、AαS〕 に〕 ロロぐ=iミコ 口Ω(コζC 口OC〕て口 第 図 第 1θ 図
FIG. 1 is a cross-sectional configuration diagram showing an embodiment of the resonator of the present invention,
Fig. 2 is a plan view of the vibrating body, Fig. 3 is a plan view of the electrode plate, Fig. 4 is a diagram showing the relationship between the position of the connecting beam and the force sensitivity coefficient, and Fig. 5 is a plan view of the vibrating body.
The figure shows the attenuation state of the vibration amplitude at the step part of the vibrating beam, Figure 6 shows the outline of the machining process of the vibrating body, Figure 7 shows the outline of the machining process of the electrode plate, and Figure 8 shows the vibration Figures 9 and 10 showing other embodiments of the body are diagrams showing conventional examples. 20... Vibrating body, 21.22... Electrode plate, 23.2
4... Electrode, 25.26... Metal layer, 27... Connecting beam. 28...Through hole. Se〈゛? A waste of time to see the mushrooms 1 clam E 2nd drawing ice crystal c====================F e-C
Hi, AαS〕 に〕 Rolog = i Mikoguchi Ω (KζC 口OC] Teguchi Diagram 1θ Figure

Claims (1)

【特許請求の範囲】 1)円板の両面の中心部に断面凸状の段部が形成される
とともに,前記円板の周縁部近傍に力感度係数が0とな
る位置に前記中心部と周縁部を連結する4本の連結梁を
残してリング状に形成された貫通孔を有する水晶振動体
と,前記振動体と約同径とされ,一方の面の中心部に電
極が形成されるとともにその周縁に前記凸部より厚い厚
さの金属層が形成された一対の電極板を有し,前記振動
体の段部と電極板の電極を対向させた状態で前記振動体
を前記電極板でサンドイッチ状に固定したことを特徴と
する圧電共振器。 2)前記水晶振動体および電極板はAT板を用いてフォ
トリソグラフィと異方性エッチングの技術を用いて形成
され,電極および金属層の材質として金を用いたことを
特徴とする特許請求の範囲第1項記載の圧電共振器。
[Scope of Claims] 1) A stepped portion with a convex cross section is formed at the center of both sides of the disk, and the center and the periphery are formed near the periphery of the disk at a position where the force sensitivity coefficient is 0. A crystal vibrating body having a through hole formed in a ring shape, leaving four connecting beams connecting the parts, having approximately the same diameter as the vibrating body, and having an electrode formed in the center of one surface. It has a pair of electrode plates each having a metal layer thicker than the convex portion formed on its periphery, and the vibrating body is held between the electrode plates with the stepped portion of the vibrating body facing the electrode of the electrode plate. A piezoelectric resonator characterized by being fixed in a sandwich shape. 2) Claims characterized in that the crystal vibrating body and the electrode plate are formed using an AT plate using photolithography and anisotropic etching techniques, and gold is used as the material of the electrode and the metal layer. The piezoelectric resonator according to item 1.
JP20854088A 1988-08-23 1988-08-23 Piezoelectric resonator Pending JPH0257009A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20854088A JPH0257009A (en) 1988-08-23 1988-08-23 Piezoelectric resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20854088A JPH0257009A (en) 1988-08-23 1988-08-23 Piezoelectric resonator

Publications (1)

Publication Number Publication Date
JPH0257009A true JPH0257009A (en) 1990-02-26

Family

ID=16557881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20854088A Pending JPH0257009A (en) 1988-08-23 1988-08-23 Piezoelectric resonator

Country Status (1)

Country Link
JP (1) JPH0257009A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
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US5304887A (en) * 1991-10-19 1994-04-19 Northern Telecom Limited Crystal resonator device
JPH06291587A (en) * 1992-07-08 1994-10-18 Matsushita Electric Ind Co Ltd Piezoelectric vibrator
US7485238B2 (en) 2001-08-31 2009-02-03 Daishinku Corporation Etching method, etched product formed by the same, and piezoelectric vibration device, method for producing the same
JP2009246645A (en) * 2008-03-31 2009-10-22 Daishinku Corp Crystal vibration piece, and crystal vibrator
JP2011166352A (en) * 2010-02-08 2011-08-25 Fujitsu Ltd Vibrator and oscillator
EP2456069A1 (en) 2010-11-19 2012-05-23 Seiko Epson Corporation Piezoelectric resonator element and piezoelectric resonator
US9030078B2 (en) 2011-03-09 2015-05-12 Seiko Epson Corporation Vibrating element, vibrator, oscillator, and electronic device
US9431995B2 (en) 2014-07-31 2016-08-30 Seiko Epson Corporation Resonator element, resonator, resonator device, oscillator, electronic device, and mobile object
US9503045B2 (en) 2015-01-19 2016-11-22 Seiko Epson Corporation Resonator element, resonator, oscillator, electronic apparatus, and moving object
US9948275B2 (en) 2011-03-18 2018-04-17 Seiko Epson Corporation Piezoelectric vibration element, piezoelectric vibrator, piezoelectric oscillator, and electronic device

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JPH06291587A (en) * 1992-07-08 1994-10-18 Matsushita Electric Ind Co Ltd Piezoelectric vibrator
US7485238B2 (en) 2001-08-31 2009-02-03 Daishinku Corporation Etching method, etched product formed by the same, and piezoelectric vibration device, method for producing the same
JP2009246645A (en) * 2008-03-31 2009-10-22 Daishinku Corp Crystal vibration piece, and crystal vibrator
JP2011166352A (en) * 2010-02-08 2011-08-25 Fujitsu Ltd Vibrator and oscillator
US8766514B2 (en) 2010-11-19 2014-07-01 Seiko Epson Corporation Piezoelectric resonator element and piezoelectric resonator
EP2456069A1 (en) 2010-11-19 2012-05-23 Seiko Epson Corporation Piezoelectric resonator element and piezoelectric resonator
US9231184B2 (en) 2010-11-19 2016-01-05 Seiko Epson Corporation Piezoelectric resonator element and piezoelectric resonator
US9030078B2 (en) 2011-03-09 2015-05-12 Seiko Epson Corporation Vibrating element, vibrator, oscillator, and electronic device
US9837982B2 (en) 2011-03-09 2017-12-05 Seiko Epson Corporation Vibrating element, vibrator, oscillator, and electronic device with stepped excitation section
US9948275B2 (en) 2011-03-18 2018-04-17 Seiko Epson Corporation Piezoelectric vibration element, piezoelectric vibrator, piezoelectric oscillator, and electronic device
US9431995B2 (en) 2014-07-31 2016-08-30 Seiko Epson Corporation Resonator element, resonator, resonator device, oscillator, electronic device, and mobile object
US9716484B2 (en) 2014-07-31 2017-07-25 Seiko Epson Corporation Resonator element, resonator, resonator device, oscillator, electronic device, and mobile object
US9503045B2 (en) 2015-01-19 2016-11-22 Seiko Epson Corporation Resonator element, resonator, oscillator, electronic apparatus, and moving object

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