JPH025538A - Molding die and manufacture of resin-sealed semiconductor device - Google Patents
Molding die and manufacture of resin-sealed semiconductor deviceInfo
- Publication number
- JPH025538A JPH025538A JP15658388A JP15658388A JPH025538A JP H025538 A JPH025538 A JP H025538A JP 15658388 A JP15658388 A JP 15658388A JP 15658388 A JP15658388 A JP 15658388A JP H025538 A JPH025538 A JP H025538A
- Authority
- JP
- Japan
- Prior art keywords
- runner
- lead frame
- resin
- mold
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概 要〕
モールド金型のゲート部近傍の金型構造の改良及び樹脂
封止型半導体装置の製造方法に関し、容易に加工形成す
ることが可能な第２ランナーをリードフレームの挿入溝
に直接に接して設けることにより、この第２ランナー部
のモールド樹脂を飛散させずに、ランナー部の樹脂やゲ
ート部の樹脂と一体化させてリードフレームから分離す
ることが可能となるモールド金型及び樹脂封止型半導体
装置の製造方法の提供を目的とし、樹脂封止型半導体装
置の封止工程に用いるモールド金型であって、ランナー
及びゲートと接続し、リードフレームの挿入溝の前記ゲ
ート側に直接に接するように設けた第２ランナーを具備
するよう構成する。[Detailed Description of the Invention] [Summary] Regarding the improvement of the mold structure near the gate part of a mold die and the manufacturing method of a resin-sealed semiconductor device, we have developed a second runner that can be easily processed and formed. By providing it in direct contact with the insertion groove of the frame, the molded resin of this second runner part can be integrated with the resin of the runner part and the resin of the gate part and separated from the lead frame without scattering. The purpose of the present invention is to provide a mold die and a method for manufacturing a resin-sealed semiconductor device, which is a mold die used in the sealing process of a resin-sealed semiconductor device, which is connected to a runner and a gate, and into which a lead frame is inserted. A second runner is provided so as to be in direct contact with the gate side of the groove.
本発明は、モールド工程に係り、特にモールド金型のゲ
ート部近傍の金型構造の改良及び樹脂封虫型半導体装置
の製造方法６、二関するものである。The present invention relates to a molding process, and particularly to improvements in the mold structure near the gate portion of a mold, and a method for manufacturing a resin-sealed semiconductor device.
従来のモールド金型においては、モールドされる製品を
挿入する溝部の寸法は、許容最大寸法の製品の挿入が可
能な寸法に加工されている。In conventional molding dies, the dimensions of the groove into which the product to be molded is inserted are processed to allow insertion of a product of maximum allowable size.
このためモールド金型のキャビティにモ・−ルド樹脂を
高圧で充填する場合に、ゲート近傍のリードフレームの
外枠部とモールド金型の挿入溝との隙間にモールド樹脂
がしみ出し、外枠部の側面にパリが生じる。For this reason, when filling the cavity of the mold with mold resin at high pressure, the mold resin seeps into the gap between the outer frame of the lead frame near the gate and the insertion groove of the mold, and the outer frame Paris occurs on the side of the.
このパリは幅が製品の板厚で、厚さがリードフレームと
挿入溝との隙間に相当するので、非常に微小なために除
去するのには多くの工数を要し、パリが破片となって飛
散するから作業場の清浄化の障害になっている。The width of this paris is the thickness of the product, and the thickness is equivalent to the gap between the lead frame and the insertion groove, so it takes a lot of man-hours to remove it because it is so minute that it breaks into pieces. This is an obstacle to cleaning the workplace as it scatters.
以上のよ・うな状況からリードフレームの外枠部の側面
にモールド樹脂のパリが生じないモールド金型が要望さ
れている。In view of the above-mentioned circumstances, there is a need for a molding die that does not cause mold resin flakes to form on the side surfaces of the outer frame portion of the lead frame.
従来のモールド金型及び樹脂封止型半導体装置の製造方
法Ｉ：二ついて第４図・−・第７図により説明する。Conventional molding die and resin-sealed semiconductor device manufacturing method I: Two steps will be explained with reference to FIGS. 4 to 7.
第４図はモールド金型の概略構造を示す側断面図であり
、下型２１にはランナー１１１、ゲート１２、キャビテ
ィ１３及びリードフレームを挿入する挿入溝１５が設げ
られており、上型２２にはキャビティ１３及びモールド
樹脂注入孔１６が設けられている。FIG. 4 is a side sectional view showing the schematic structure of the molding die, in which the lower die 21 is provided with a runner 111, a gate 12, a cavity 13, and an insertion groove 15 into which a lead frame is inserted, and the upper die 22 is provided with an insertion groove 15 into which a lead frame is inserted. A cavity 13 and a mold resin injection hole 16 are provided.
モールド工程では、まずモールドするリードフレームを
下型２１の挿入溝１５に挿入し、上型２２を降下させて
下型２１と密着させる。この際に上型２２のキャビティ
１３と下型２１のキャビティ１３とはリードフレ−ムを
間にして対向する。In the molding process, first the lead frame to be molded is inserted into the insertion groove 15 of the lower mold 21, and the upper mold 22 is lowered to come into close contact with the lower mold 21. At this time, the cavity 13 of the upper mold 22 and the cavity 13 of the lower mold 21 face each other with the lead frame in between.
モ・−ルド樹脂注入孔１６から加熱１，７たモールド樹
脂を圧入すると、モールド樹脂はランナー１１の中を流
れ、ゲート１２を通ってキャビティ１３の中に流入し、
リードフレームと一体になる。When the heated mold resin is press-fitted from the mold resin injection hole 16, the mold resin flows through the runner 11, passes through the gate 12, and flows into the cavity 13.
Becomes integrated with the lead frame.
このゲート１２近傍の詳細は第５図に示すよ・うになっ
ており、ランナー１１からゲート１２を通りキャビティ
１３に流入するモールド樹脂には高圧が加えられている
ので、図示のよ・うにゲ−・１−１２の近傍のリードフ
レームと挿入溝との隙間にパリ１７が生じる。The details of the vicinity of this gate 12 are shown in FIG. 5. High pressure is applied to the mold resin flowing from the runner 11 through the gate 12 into the cavity 13, so that the gate 12 is closed as shown in the figure. - A gap 17 occurs in the gap between the lead frame and the insertion groove near 1-12.
このパリ１７は後の工程での障害となるので、取り除く
ことが必要である。Since this part 17 becomes an obstacle in the subsequent process, it is necessary to remove it.
従来のモールド工程においては第６図の工程図に示すよ
うに、モールド工程終了後、後工程に入る前に上記のパ
リを取り除いている。In the conventional molding process, as shown in the process diagram of FIG. 6, after the molding process is completed and before starting the subsequent process, the above-mentioned paris is removed.
このようなモールド工程の後に、リードフレームの切断
成形を行・うと、第７図（ａｌ及び（１））に示すよう
な形状の樹脂封止型半導体装置の製造が完了する。After such a molding step, when the lead frame is cut and molded, the manufacture of a resin-sealed semiconductor device having a shape as shown in FIG. 7 (al and (1)) is completed.
以上説明の従来の樹脂封止型半導体装置の製造方法にお
いては、ゲート近傍のリードフレームの外枠部とモー・
ルド金型の挿入溝との隙間にモールド樹脂がしみ出し１
、リードフレームの外枠部の側面にハリが生しる。、二
のパリは後の工程での障害となるので、モールド工程終
了後取り除かなければならないという問題点があり、ま
た除去したパリが破片となって飛散し、作業場を清浄に
保つことが困難になるという問題点もあった。In the conventional method of manufacturing a resin-sealed semiconductor device described above, the outer frame of the lead frame near the gate and the
Mold resin seeps into the gap between the mold and the insertion groove 1
, the sides of the outer frame of the lead frame become stiff. Since the second paris becomes an obstacle in the subsequent process, there is a problem that it must be removed after the molding process is completed, and the removed paris becomes fragments and scatters, making it difficult to keep the work area clean. There was also the problem of becoming.
本発明は以上のよ・うな状況から容易に加工形成するこ
とが可能な第２ランナーをリードフレームの挿入溝に直
接に接して設けることにより、この第２ランナー部のモ
ールド樹脂を飛散させずに、ランナー部の樹脂やゲート
部の樹脂と一体化させてリードフレームから分離するこ
とが可能となるモールド金型及び樹脂封止型半導体装置
の製造方法の提供を目的としたものである。The present invention provides a second runner that can be easily processed and formed in direct contact with the insertion groove of the lead frame, thereby preventing the molded resin of the second runner portion from scattering. The object of the present invention is to provide a mold and a method for manufacturing a resin-sealed semiconductor device that can be integrated with the resin of the runner portion and the resin of the gate portion and separated from the lead frame.
上記問題点は、樹脂封止型半導体装置の封止工程に用い
るモールド金型であって１、ランナー及びグーＩ・と接
続し、リードフレームの挿入溝のゲート側に直接に接す
るように設けた第２ランナーを具備する本発明によるモ
ールド金片！及びこのモールド金型を用いる樹脂封止型
半導体装置の製造方法によって解決される。The above problem lies in the mold used in the sealing process of resin-sealed semiconductor devices. A molded metal piece according to the invention with a second runner! The problem is solved by a method of manufacturing a resin-sealed semiconductor device using this mold.
即ち本発明においては、ランナー及びゲートと接続し、
リードフレームの挿入溝に直接に接するように第２ラン
ナーをモールド金型に設けるので、モールド成形した後
に、この第２ランナーとランナー及びゲートのモールド
樹脂が強固に一体化し、リードフレームの外枠部の側面
にパリが生じないので、これを除去する必要がなくなり
工数の削減が可能となり、パリの飛散が防止でき作業場
及び製品の清浄化が可能となる。That is, in the present invention, connecting to the runner and the gate,
Since the second runner is provided in the mold so as to be in direct contact with the insertion groove of the lead frame, after molding, the second runner and the molded resin of the runner and gate are firmly integrated, and the outer frame of the lead frame Since no paris is formed on the side surfaces of the product, there is no need to remove it, which reduces the number of man-hours, prevents scattering of paris, and makes it possible to clean the workplace and products.
以下、第１図〜第４図及び第７図によりモールド金型及
び樹脂封止型半導体装置の製造方法ついて本発明の一実
施例を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 4 and FIG. 7 regarding a molding die and a method for manufacturing a resin-sealed semiconductor device.
本発明に用いるモールド金型の概略構造は第４図に示す
ような従来のモールド金型と同様のモールド金型である
。The general structure of the mold used in the present invention is similar to the conventional mold as shown in FIG.
本発明においては第１図及び第２図に示すようにランナ
ー１と平行し、かつ両端にてランナー１と接続する第２
ランナー４をリードフレームの挿入？！ ５に直接に接
して設けるから、ランナー１゜ゲート２．第２ランナー
４が連結するので、モールド樹脂をランナー１から流入
すると、ランナー１、ゲート２．第２ランナー４の中に
充満したモールド樹脂が強固に一体となり、モールド工
程終了後に従来のようなリードフレームの側面にパリが
生じないので、リードフレームを取り出した場合に、リ
ードフレームと上記の一体化したモールド樹脂とを確実
に分離することが可能となる。In the present invention, as shown in FIGS. 1 and 2, a second runner parallel to the runner 1 and connected to the runner 1 at both ends.
Insert lead frame into runner 4? ! Since it is provided in direct contact with runner 1 and gate 2. Since the second runner 4 is connected, when the mold resin flows from the runner 1, the runner 1, the gate 2. The molding resin filled in the second runner 4 is firmly integrated, and there is no burr on the side of the lead frame after the molding process is finished, so when the lead frame is taken out, it will not be as if the lead frame is integrated with the above-mentioned one. It becomes possible to reliably separate the mold resin from the mold resin.
したがって、本発明のモールド工程においては第３図の
工程図に示すように、モールド工程終了後に目視検査を
行い、リードフレームとモールド樹脂とを分離するゲー
トブレイクを行った後にパリ取りを行う必要がない。Therefore, in the molding process of the present invention, as shown in the process diagram of FIG. 3, it is necessary to perform a visual inspection after the molding process is completed, perform a gate break to separate the lead frame and the mold resin, and then perform deburring. do not have.
このようなモールド工程の後に、リードフレームの切断
成形を行うと、第７図（ａ）及σ（ｂ）に示すような形
状の樹脂封止型半導体装置の製造が完了する。After such a molding step, the lead frame is cut and molded to complete the manufacture of a resin-sealed semiconductor device having the shape shown in FIGS. 7(a) and σ(b).
以上の説明から明らがなように本発明によれば、極めて
簡単な構造の第２ランナーを備えたモールド金型を用い
て樹脂封止型半導体装置を製造することにより、ゲート
ブレイクを行った後のパリ取り工数が不要となり、リー
ドフレームの側面に生じたパリが作業場に飛散するのを
防止することが可能となる等の利点があり、著しい経済
的及び、信頼性向上の効果が期待でき工業的には極めて
有用なものである。As is clear from the above description, according to the present invention, gate breaking is performed by manufacturing a resin-sealed semiconductor device using a molding die equipped with a second runner having an extremely simple structure. It has the advantage of eliminating the need for subsequent deburring work and making it possible to prevent the deburring that has formed on the side of the lead frame from scattering into the work area, and can be expected to have a significant economic and reliability improvement effect. It is extremely useful industrially.
第１図は本発明による一実施例のモールド金型を示す図
、
第２図は本発明による一実施例のモールド金型の詳細を
示す斜視図、
第３図は本発明のモールド金型を用いる工程図、第４図
はモールド金型の概略構造を示す側断面図、
第５図は従来のモールド金型の詳細を示す斜視図、
第６図は従来のモールド金型を用いる工程図、第７図は
樹脂封止型半導体装置の完成図、である。
図において、
１はランナー
２はゲート、
３はキャビティ、
４は第２ランナー
５は挿入溝、
を示す。FIG. 1 is a diagram showing a mold die according to an embodiment of the present invention, FIG. 2 is a perspective view showing details of a mold die according to an embodiment of the present invention, and FIG. 3 is a diagram showing a mold die according to an embodiment of the present invention. 4 is a side sectional view showing the schematic structure of the mold, FIG. 5 is a perspective view showing details of a conventional mold, and FIG. 6 is a process diagram using the conventional mold. FIG. 7 is a completed diagram of the resin-sealed semiconductor device. In the figure, 1 indicates a runner 2, a gate, 3 indicates a cavity, and 4 indicates a second runner 5, an insertion groove.
Claims (2)
ド金型であって、ランナー（１）及びゲート（２）と接
続し、リードフレームの挿入溝（５）の前記ゲート（２
）側に直接に接するように設けた第２ランナー（４）を
具備することを特徴とするモールド金型。(1) A mold used in the sealing process of a resin-sealed semiconductor device, which is connected to the runner (1) and the gate (2), and is connected to the gate (2) in the insertion groove (5) of the lead frame.
) A molding die characterized by comprising a second runner (4) provided so as to be in direct contact with the side.
形工程と、 前記リードフレームの外枠部の側面に形成された第２ラ
ンナー（４）の樹脂を、ゲート部の樹脂及びランナー部
の樹脂と一体化した状態で、前記リードフレームと分離
するゲートブレイク工程と、を含むことを特徴とする樹
脂封止型半導体装置の製造方法。(2) A molding step using the molding die according to claim 1, and the resin of the second runner (4) formed on the side surface of the outer frame portion of the lead frame is mixed with the resin of the gate portion and the resin of the runner portion. A method of manufacturing a resin-sealed semiconductor device, comprising: a gate breaking step of separating the lead frame from the lead frame while the lead frame is integrated with the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15658388A JPH025538A (en) | 1988-06-24 | 1988-06-24 | Molding die and manufacture of resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15658388A JPH025538A (en) | 1988-06-24 | 1988-06-24 | Molding die and manufacture of resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH025538A true JPH025538A (en) | 1990-01-10 |
Family
ID=15630937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15658388A Pending JPH025538A (en) | 1988-06-24 | 1988-06-24 | Molding die and manufacture of resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025538A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6021789A (en) * | 1998-11-10 | 2000-02-08 | International Business Machines Corporation | Wafer cleaning system with progressive megasonic wave |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62261414A (en) * | 1986-05-09 | 1987-11-13 | Fujitsu Ltd | Mold for transfer molding |
-
1988
- 1988-06-24 JP JP15658388A patent/JPH025538A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62261414A (en) * | 1986-05-09 | 1987-11-13 | Fujitsu Ltd | Mold for transfer molding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6021789A (en) * | 1998-11-10 | 2000-02-08 | International Business Machines Corporation | Wafer cleaning system with progressive megasonic wave |
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