JPH0254858B2 - - Google Patents
Info
- Publication number
- JPH0254858B2 JPH0254858B2 JP59103917A JP10391784A JPH0254858B2 JP H0254858 B2 JPH0254858 B2 JP H0254858B2 JP 59103917 A JP59103917 A JP 59103917A JP 10391784 A JP10391784 A JP 10391784A JP H0254858 B2 JPH0254858 B2 JP H0254858B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- acid
- resistant material
- organic group
- photosensitive heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002253 acid Substances 0.000 claims description 15
- 239000003779 heat-resistant material Substances 0.000 claims description 15
- 125000000962 organic group Chemical group 0.000 claims description 13
- -1 aziridine compound Chemical class 0.000 claims description 12
- 229920002396 Polyurea Polymers 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 claims 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical class OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- MLIWQXBKMZNZNF-PWDIZTEBSA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1\C(=C\C=2C=CC(=CC=2)N=[N+]=[N-])CC(C)C\C1=C/C1=CC=C(N=[N+]=[N-])C=C1 MLIWQXBKMZNZNF-PWDIZTEBSA-N 0.000 description 1
- UZNOMHUYXSAUPB-UNZYHPAISA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]cyclohexan-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1\C=C(/CCC\1)C(=O)C/1=C/C1=CC=C(N=[N+]=[N-])C=C1 UZNOMHUYXSAUPB-UNZYHPAISA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- FSAONUPVUVBQHL-UHFFFAOYSA-N 1,3-bis(4-azidophenyl)prop-2-en-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C=CC(=O)C1=CC=C(N=[N+]=[N-])C=C1 FSAONUPVUVBQHL-UHFFFAOYSA-N 0.000 description 1
- BLYXNIHKOMELAP-UHFFFAOYSA-N 1,8-Dinitropyrene Chemical compound C1=C2C([N+](=O)[O-])=CC=C(C=C3)C2=C2C3=CC=C([N+]([O-])=O)C2=C1 BLYXNIHKOMELAP-UHFFFAOYSA-N 0.000 description 1
- ARKQRZXCXIMZHG-UHFFFAOYSA-N 1-azido-4-[(4-azidophenyl)methyl]benzene Chemical compound C1=CC(N=[N+]=[N-])=CC=C1CC1=CC=C(N=[N+]=[N-])C=C1 ARKQRZXCXIMZHG-UHFFFAOYSA-N 0.000 description 1
- HWEONUWVYWIJPF-OWOJBTEDSA-N 1-azido-4-[(e)-2-(4-azidophenyl)ethenyl]benzene Chemical compound C1=CC(N=[N+]=[N-])=CC=C1\C=C\C1=CC=C(N=[N+]=[N-])C=C1 HWEONUWVYWIJPF-OWOJBTEDSA-N 0.000 description 1
- WIOZZYWDYUOMAY-UHFFFAOYSA-N 2,5-diaminoterephthalic acid Chemical compound NC1=CC(C(O)=O)=C(N)C=C1C(O)=O WIOZZYWDYUOMAY-UHFFFAOYSA-N 0.000 description 1
- XEZCCHVCBAZAQD-UHFFFAOYSA-N 2-(aziridin-1-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCN1CC1 XEZCCHVCBAZAQD-UHFFFAOYSA-N 0.000 description 1
- ILPDVOFDSNNCNY-UHFFFAOYSA-N 4,6-diaminobenzene-1,3-dicarboxylic acid Chemical compound NC1=CC(N)=C(C(O)=O)C=C1C(O)=O ILPDVOFDSNNCNY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- AXCSBFRIHQXBSG-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 AXCSBFRIHQXBSG-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XDIFOIHGJGSGQB-UHFFFAOYSA-N acridine-1-carbonitrile Chemical compound C1=CC=C2C=C3C(C#N)=CC=CC3=NC2=C1 XDIFOIHGJGSGQB-UHFFFAOYSA-N 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- CHFBCXOSLARLKB-UHFFFAOYSA-N bis(4-azidophenyl)methanone Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)C1=CC=C(N=[N+]=[N-])C=C1 CHFBCXOSLARLKB-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59103917A JPS60245636A (ja) | 1984-05-21 | 1984-05-21 | 感光性耐熱材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59103917A JPS60245636A (ja) | 1984-05-21 | 1984-05-21 | 感光性耐熱材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60245636A JPS60245636A (ja) | 1985-12-05 |
| JPH0254858B2 true JPH0254858B2 (enrdf_load_stackoverflow) | 1990-11-22 |
Family
ID=14366776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59103917A Granted JPS60245636A (ja) | 1984-05-21 | 1984-05-21 | 感光性耐熱材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60245636A (enrdf_load_stackoverflow) |
-
1984
- 1984-05-21 JP JP59103917A patent/JPS60245636A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60245636A (ja) | 1985-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4311785A (en) | Method for the preparation of highly heat-resistant relief structures and the use thereof | |
| JPH0680776A (ja) | ポリイミド前駆体及び組成物 | |
| US5177181A (en) | Diamines and photosensitive polyimides made therefrom | |
| JP6007510B2 (ja) | 感光性樹脂組成物、保護膜および半導体装置 | |
| US4598038A (en) | Preparation of polyimide and polyisoindoloquinazoline dione relief structures | |
| JPH0159571B2 (enrdf_load_stackoverflow) | ||
| US4332883A (en) | Method for the manufacture of highly heat-resistant relief structures | |
| EP0308270B1 (en) | Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof | |
| JPH0254858B2 (enrdf_load_stackoverflow) | ||
| JPH0254857B2 (enrdf_load_stackoverflow) | ||
| KR100244981B1 (ko) | 감광성 폴리이미드 전구체 | |
| JP3462713B2 (ja) | 半導体装置、その製造方法および表面保護膜 | |
| JPS6121131A (ja) | 感光性耐熱材料 | |
| JPH0159570B2 (enrdf_load_stackoverflow) | ||
| JPS6121130A (ja) | 感光性耐熱材料 | |
| JPS6194043A (ja) | 感光性耐熱材料 | |
| JPH0153969B2 (enrdf_load_stackoverflow) | ||
| JPS59100135A (ja) | 樹脂組成物 | |
| JPH0159568B2 (enrdf_load_stackoverflow) | ||
| JPH0450926B2 (enrdf_load_stackoverflow) | ||
| JP2894565B2 (ja) | 接着性耐熱コーティング剤 | |
| JPS61279852A (ja) | 感光性耐熱材料 | |
| JPH0820737B2 (ja) | ポリイミド樹脂の厚膜加工方法 | |
| JPH0159569B2 (enrdf_load_stackoverflow) | ||
| JPH07278301A (ja) | ポリイミド前駆体、ポリイミド前駆体組成物およびそれを用いた樹脂封止型半導体装置の製造方法 |