JPH0254222U - - Google Patents

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Publication number
JPH0254222U
JPH0254222U JP13392088U JP13392088U JPH0254222U JP H0254222 U JPH0254222 U JP H0254222U JP 13392088 U JP13392088 U JP 13392088U JP 13392088 U JP13392088 U JP 13392088U JP H0254222 U JPH0254222 U JP H0254222U
Authority
JP
Japan
Prior art keywords
external lead
component body
iron
lead members
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13392088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13392088U priority Critical patent/JPH0254222U/ja
Publication of JPH0254222U publication Critical patent/JPH0254222U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本案の一実施例である樹脂外装型固体
電解コンデンサを示す正断面図である。第2図は
従来の樹脂外装型固体電解コンデンサの正断面図
、第3図は第2図の固体電解コンデンサのプリン
ト板への半田付け方法を説明するための要部正断
面図である。 図中、1は部品本体、4,5は外部リード部材
、6は半田部材、7は絶縁部材である。
FIG. 1 is a front sectional view showing a resin-clad solid electrolytic capacitor which is an embodiment of the present invention. FIG. 2 is a front sectional view of a conventional resin-clad solid electrolytic capacitor, and FIG. 3 is a front sectional view of essential parts for explaining a method of soldering the solid electrolytic capacitor of FIG. 2 to a printed board. In the figure, 1 is a component body, 4 and 5 are external lead members, 6 is a solder member, and 7 is an insulating member.

Claims (1)

【実用新案登録請求の範囲】 部品本体より導出した外部リード部材のうち、
少なくとも1本を部品本体に半田付けし、かつ部
品本体を含む主要部分を絶縁部材にて被覆したも
のにおいて、 上記外部リード部材のうち、所望の外部リード
部材を鉄又は鉄を主成分とする芯線に銅を被覆し
てなる16%導電率以下のCP線にて構成したこ
とを特徴とする電子部品。
[Scope of claim for utility model registration] Of the external lead members derived from the component body,
In a product in which at least one lead is soldered to the component body and the main part including the component body is covered with an insulating material, a desired external lead member among the above external lead members is made of iron or a core wire mainly composed of iron. An electronic component comprising a CP wire having a conductivity of 16% or less and coated with copper.
JP13392088U 1988-10-13 1988-10-13 Pending JPH0254222U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13392088U JPH0254222U (en) 1988-10-13 1988-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13392088U JPH0254222U (en) 1988-10-13 1988-10-13

Publications (1)

Publication Number Publication Date
JPH0254222U true JPH0254222U (en) 1990-04-19

Family

ID=31392225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13392088U Pending JPH0254222U (en) 1988-10-13 1988-10-13

Country Status (1)

Country Link
JP (1) JPH0254222U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522178B2 (en) * 1975-05-29 1980-06-14
JPS5767214A (en) * 1980-10-15 1982-04-23 Furukawa Electric Co Ltd Method of producing lead wire for electronic part

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5522178B2 (en) * 1975-05-29 1980-06-14
JPS5767214A (en) * 1980-10-15 1982-04-23 Furukawa Electric Co Ltd Method of producing lead wire for electronic part

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