JPH0253939B2 - - Google Patents

Info

Publication number
JPH0253939B2
JPH0253939B2 JP62126432A JP12643287A JPH0253939B2 JP H0253939 B2 JPH0253939 B2 JP H0253939B2 JP 62126432 A JP62126432 A JP 62126432A JP 12643287 A JP12643287 A JP 12643287A JP H0253939 B2 JPH0253939 B2 JP H0253939B2
Authority
JP
Japan
Prior art keywords
cooling
substrate
heating
plate
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62126432A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63291419A (ja
Inventor
Hitoshi Shidahara
Masaharu Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsumo KK
Original Assignee
Tatsumo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsumo KK filed Critical Tatsumo KK
Priority to JP62126432A priority Critical patent/JPS63291419A/ja
Priority to US07/197,883 priority patent/US4863547A/en
Publication of JPS63291419A publication Critical patent/JPS63291419A/ja
Publication of JPH0253939B2 publication Critical patent/JPH0253939B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP62126432A 1987-05-24 1987-05-24 加熱処理装置 Granted JPS63291419A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62126432A JPS63291419A (ja) 1987-05-24 1987-05-24 加熱処理装置
US07/197,883 US4863547A (en) 1987-05-24 1988-05-24 Equipment for heating and cooling substrates for coating photo resist thereto

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62126432A JPS63291419A (ja) 1987-05-24 1987-05-24 加熱処理装置

Publications (2)

Publication Number Publication Date
JPS63291419A JPS63291419A (ja) 1988-11-29
JPH0253939B2 true JPH0253939B2 (enExample) 1990-11-20

Family

ID=14935048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62126432A Granted JPS63291419A (ja) 1987-05-24 1987-05-24 加熱処理装置

Country Status (2)

Country Link
US (1) US4863547A (enExample)
JP (1) JPS63291419A (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970005713B1 (en) * 1992-07-31 1997-04-19 Nec Kk Process for correcting warped surface of plastic encapsulated semiconductor device
JP3983831B2 (ja) * 1995-05-30 2007-09-26 シグマメルテック株式会社 基板ベーキング装置及び基板ベーキング方法
US6432203B1 (en) * 1997-03-17 2002-08-13 Applied Komatsu Technology, Inc. Heated and cooled vacuum chamber shield
US6073366A (en) 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6957690B1 (en) 1998-09-10 2005-10-25 Asm America, Inc. Apparatus for thermal treatment of substrates
EP1142001B1 (en) 1998-11-20 2007-10-03 Steag RTP Systems, Inc. Fast heating and cooling apparatus for semiconductor wafers
US6499777B1 (en) 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
WO2000074117A1 (en) 1999-05-27 2000-12-07 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
US7037797B1 (en) 2000-03-17 2006-05-02 Mattson Technology, Inc. Localized heating and cooling of substrates
US6643604B1 (en) 2000-06-30 2003-11-04 Advanced Micro Devices, Inc. System for uniformly heating photoresist
KR20030032034A (ko) * 2000-09-15 2003-04-23 어플라이드 머티어리얼스, 인코포레이티드 처리 장비용 두 개의 이중 슬롯 로드록
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
AU2003270613A1 (en) 2002-09-10 2004-04-30 Axcelis Technologies, Inc. Method of heating a substrate in a variable temperature process using a fixed temperature chuck
US20040137059A1 (en) * 2003-01-09 2004-07-15 Thierry Nivaggioli Biodegradable ocular implant
US7207766B2 (en) 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7497414B2 (en) 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US7845891B2 (en) 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7665951B2 (en) 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US8124907B2 (en) 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
JP2017157746A (ja) * 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR860002082B1 (ko) * 1983-01-19 1986-11-24 가부시기가이샤 도시바 레지스트 패턴의 형성 방법 및 장치
US4543147A (en) * 1984-08-20 1985-09-24 Tetrahedron Associates, Inc. Laminating process and apparatus

Also Published As

Publication number Publication date
US4863547A (en) 1989-09-05
JPS63291419A (ja) 1988-11-29

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