JPH0253566A - Extremely thin cutting blade - Google Patents

Abstract

PURPOSE:To reduce the unevenness in thickness of each layer and to constrain the deflection after integral forming by adjusting a resin binder for bonding with the abrasive grains of each layer to a plastic material and forming this plastic material in an extremely thin sheet like material by a calender roll. CONSTITUTION:A 1st plate like material 1 is made by rolling by a roll the plastic material adding a solvent to a refined abrasive grain powder and bonding resin binder. The plastic materials 2, 3 having different composition from this plastic material are rolled by a roll and a 2nd plate like material is made. The 2nd plate like materials 2, 3 are rolled after laminating on the both side faces of this 1st plate like material 1 and the extremely thin cutting blade 4 in <=0.5mm the total thickness having the three layer structure formed by heating with pressurizing after pressure-fitting this laminating material. Consequently, the thickness unevenness of each layer can be reduced and the deflection of after integral forming can be restrained.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention is an ultra-thin material with a total thickness of 0.5 mm or less for precisely cutting or grooving hard and brittle materials such as silicon, ferrite, glass, and ceramics. It relates to a cutting blade.

[Prior Art] Conventionally, a cutting blade made of a plate-shaped material containing abrasive grains has been used as a cutting blade for precisely cutting this type of hard and brittle material.

The abrasive grain layer of these cutting blades is generally a single-layer cutting blade consisting of only one type of composition;
Some cutting blades have a layered structure in the thickness direction, as shown in the figure.

[Problems to be Solved by the Invention] The three-layer structure cutting blade manufactured by the method shown in the above-mentioned layer construction method (KOKAI Publication No. 62-88577) has a thickness of each layer that is equal to or smaller than that of the abrasive grains and the bonding resin bond material. ■ Because the thickness of each layer is determined by molding a mixture with a mold, which is a method that is extremely difficult to control, uneven thickness is likely to occur within a single layer.

■ For the same reason, it is difficult to manufacture multilayer cutting blades with a good reproducibility consisting of extremely thin layers.

■ For the same reason, there is a drawback that it is difficult to manufacture cutting blades with extremely thin overall thickness with good reproducibility.

Furthermore, as shown in FIG. 5, in conventional cutting plates made of only one type of composition, the cutting edge of the cutting plate tends to bend during cutting, so that (1) the cut surface of the material to be cut is not at right angles.

■ The straightness of the cut surface in the cutting direction is poor.

■ The cutting plate tends to hit one side, causing scratches on the cut surface.
Chipping is likely to occur.

■ As a result, it is necessary to frequently modify the shape of the cutting blade edge.

There are some drawbacks. This drawback becomes noticeable in ultrathin cutting blades with a total thickness of 0.5 mm or less.

This means that for a cutting blade made of a single layer of plate material, if the components of the cutting blade are evenly distributed, ideally the cutting edge of the cutting plate will wear out in a symmetrical cross-section as shown in Figure 3. In fact, slight unevenness in the components of the cutting blade causes uneven wear as shown in Figure 4.A lateral force is applied to the tip of the blade on the unevenly worn plate, causing the cutting blade edge to become uneven. This is because it is easy to bend as shown in 5.

[Means (and effects) for solving the problem] The present invention is a multi-layer ultra-thin cutting blade in which the abrasive grains and bonding resin bond material of each layer are adjusted to a plastic material, and this plastic material is ultra-thin using a calendar roll. By using an easy-to-control method of forming thin sheets of material, it is possible to eliminate uneven thickness of each layer as much as possible.
Since press pressure is not used to form each layer, density unevenness due to non-uniformity of press pressure does not occur between each layer, and unbalanced internal stress is not left in the ultra-thin cutting plate, so warpage is prevented after integral molding. It was assumed that it would never occur.

As described above, the ultra-thin cutting blade of the present invention.

The thickness of each layer does not vary even within a single layer, the thickness can be precisely controlled, and there is no density unevenness, so even an ultra-thin cutting blade with a total thickness of 0.5 mm or less does not cause warpage.

In addition, in order to solve the problem of bending during cutting with an ultra-thin cutting blade made of a single layer of plate material, the layers on both sides of the center layer have a structure that has a lower wear rate than the center layer, and the ultra-thin cutting blade By providing a portion that is easily worn and a portion that is less likely to wear in the thickness direction, it is possible to create a structure that is less likely to cause uneven wear.

[Example] In the multilayer structure ultra-thin cutting blade of the present invention, it is preferable that the abrasive grains contained in at least the outer layer be superabrasive grains, or other general abrasive grains may be used depending on the case. especially,
Natural and synthetic diamonds, CBN, carborundum (C).

Green carborundum (aC), arantum (A),
White alundum (WA), boron carbide, etc. are used alone or in combination depending on the purpose.

The grain size of the abrasive grains is selected depending on the purpose of ultra-thin cutting. Abrasive grain rate (concentration) is normally 2 to 70vo 1%, - 6 for boat fishing
~30vo 1%, preferably 7.5-20vo 1%
That's about it.

The abrasive material layer may contain an appropriate amount of a predetermined aggregate or filler other than the abrasive grains. An inorganic or organic filler is used as the aggregate, and the inorganic materials include Ca, Mg
, B.A., K.

Carbonates such as Na, sulfates such as Ca and Ba, Zn, Zr,
Metal oxides such as An, Cr, Se, brass, Cu, AK,
Metal powders such as Fe, Ni, and Co, asbestos, short glass fibers, inorganic fibers such as carbon fibers, and other graphite and carbon.

It is composed of MoS, etc.

When a resin bond is used, a calendar roll rolling method is used as the manufacturing method, since it is easy to control the layer thickness.

■ Prevents uneven thickness within the layer.

■ A plate material with a uniform composition can be stably obtained.

It is desirable from this point of view.

For example, when providing hard abrasive layers l at both ends of the abrasive material thickness as shown in FIG. 1, after changing the composition of each abrasive material layer and manufacturing sheets with different properties, Laminate rolling is performed to obtain a sheet sandwiched between hard parts, which is then pressure fired.

The resin binder in this case can be thermosetting or thermoplastic, such as epoxy resin,
Phenolic resins (novolac type, resol type or mixtures thereof), various modified phenolic resins (epoxy modified,
(aniline modified, rubber modified, thermoplastic resin modified, furan modified, etc.), melamine resin, polyimide resin, natural rubber, rigid rubber, diallyl phthalate resin, shellac, urea resin, nylon, saturated or unsaturated polyester resin, silicone resin, fluorine Resin, cellulose resin, acrylic resin, etc. are used. Preferably, a novolac type or resol type phenolic resin or a modified phenolic resin is used. In addition to these, known binders for resin bonded grindstones can be used.

Example 1 FIG. 1 shows an example where the present invention is applied.

The raw materials consisting of were weighed, transferred into a mortar, and sufficiently mixed and stirred to obtain a plastic material.

In addition, with the aim of creating a three-layer structure, the blending ratio or material of the plastic material is changed to create differences in hardness and softness, that is, differences in wear rate.

Here, in the aforementioned formulation, white alundum (
A plastic material in which the entire amount of WA) was made of phenolic resin was separately prepared and used for the soft layer (calendar months with high wear rate).

The obtained plastic materials were each rolled using a calendar roll to obtain two types of sheet-like abrasive plate materials.

As shown in FIG. 1, in order to provide abrasive layers with a small wear rate at both ends in the thickness direction of the abrasive material, a sheet for the soft layer of the composition of the above formulation example is sandwiched from both sides with a sheet for the hard layer. This was laminated and then pressure-rolled using a calendar roll method to obtain a three-layer or integrally laminated sheet.

This sheet was punched into a predetermined shape and heated in an oven from room temperature to 190° C. for about 8 hours to obtain an ultra-thin cut plate having a homogeneous three-layer structure with a total thickness of 2004 m and a thickness variation of ±5 gm or less.

Using this three-layer resin bond cutting blade,
When a silicon wafer was repeatedly cut, the tip of the cutting plate gradually wore out into a shape with two peaks on the outer layer side, as shown in FIG. This is because compared to the first plate-like material which is the center layer, the second plate-like material which is the outer layer is hard to wear because it is a hard abrasive layer. This is because they wear out while regulating each other. As a result, the center layer, which is less likely to cause uneven wear and is more likely to wear, is quickly reduced and only the outer surface remains, resulting in the shape shown in FIG. 2. At this time, compared to when cutting silicon wafers using a conventional single-layer cutting plate, the cut surface does not curve, the straightness of the cut is not as good, and the cutting blade does not have excessive force applied to it. The reduction in vibration also reduces scratches and chipping on the cutting surface.

The reason for this is that the uneven wear of the cutting blade is small and no excessive force is applied to the cutting blade, and the ridges on both sides hit the object to be cut first, and these two ridges cause the material to be cut. This is because two grooves are formed on the blade, and the two grooves mutually restrict the course of the blade as it cuts through the entire thickness of the blade. In addition, deviations in cutting dimensions are small, and cutting can be performed in a stable state for a long time, so the time required for shape correction processing (truing, tracing) of ultra-thin cutting blades has been significantly extended.

Example 2 The ratio of the abrasive grains made of synthetic diamond in Example 1 to the resin binder was changed, that is, the degree of concentration was changed to create a hardness/softness difference in the three-layer structure. Here, synthetic diamond abrasive grains of 10vo 1% are used as soft materials, and 25vo
1% is considered a hard material. The rest was the same as in Example 1 to obtain an ultra-thin cutting blade with a three-layer structure.

In this example as well, the same effects as in Example 1 were obtained.

[Other Examples] Example 3 Similar to Example 2, a first plate-shaped material made of a mixture of diamond abrasive grains and a bonding resin bond material was coated on both sides with a wear rate equal to that of the first plate-shaped material. The second method, in which the blending ratio of diamond abrasive grains and bonding resin bond material was changed so that the size was smaller than
A third plate material having the same composition as the first plate material is further laminated on the outside of the three-layer plate material made of laminated plate materials to form a five-layer structure plate material. It has an ultra-thin cutting blade. The manufacturing method was the same as in Example 2 except for the five-layer structure.

When silicon wafers were repeatedly cut using the resin bond ultra-thin cutting blade with the five-layer structure created as described above, an example work was obtained.

Not only was the same effect as in Example 2 obtained, but the third plate material, which is the outermost layer, has a relatively low abrasive grain content, which reduces scratches and chipping that occur on the cut surface of the material to be cut. etc. were further reduced than in Example 2.

In addition, in this example, ultra-thin cutting blades with a three-layer or five-layer structure were described, but an ultra-thin cutting blade with a multi-layer structure in which multiple thin layers are stacked one on top of the other while gradually changing the composition from the center of the thickness is also described. Thinning blades can also be obtained. however,
In this case, it is necessary to arrange the thicknesses of the same composition symmetrically in the thickness direction.

[Effects of the invention] According to the present invention, the multi-layered ultra-thin cutting blade has a structure that ■ minimizes uneven thickness of each layer, ■ prevents warping after integral molding, and ■ makes the total thickness extremely thin. ■ The thickness of each layer can be precisely controlled.

In addition, it uses a calendar roll method that facilitates automated manufacturing management, making it easy to mass-produce ultra-thin cutting blades with uniform performance. Furthermore, in this ultra-thin cutting blade, by making the wear rate of both side layers smaller than that of the center layer, even though it is an ultra-thin cutting blade with a total thickness of 0.5 mm or less, uneven wear is less likely to occur. As a result, ■The cut surface does not curve, ■Good straightness of cutting.
It is possible to obtain an ultra-thin cutting blade with a layered structure that is less likely to cause scratches, chipping, etc. on the cutting surface, and which greatly reduces the need to modify the shape of an ultra-thin cutting blade.

[Brief explanation of the drawing]

FIG. 1 is an external view of a three-layer ultra-thin cutting blade according to the present invention. FIG. 2 is a cross-sectional view taken along the line AA' in FIG. 1, showing the state of wear at the tip of the cutting blade in use according to the present invention. FIG. 3 is a cross-sectional view of the tip of a conventional monolayer cutting blade having a uniform composition, showing an ideally worn state. FIG. 4 is a sectional view of the tip of a conventional single-layer cutting blade having a uniform composition, showing a state of uneven wear. FIG. 5 is a cross-sectional view schematically showing how a conventional single-layer cutting blade having a uniform composition bends during cutting. l...First layer (inner layer) constituting the cutting blade 2.3
...Second layer (outer layer) 4 constituting the cutting blade...
Cutting blade 5 having a three-layer structure...Single layer cutting plate 6 with uniform composition...Material to be cut

Claims (3)

[Claims] (1) A plastic material made by adding a solvent to fine abrasive powder and a bonding resin bond material is rolled with a roll to form a first plate-shaped material,
A plastic material having a different composition from the plastic material is rolled with a roll to form a second plate material, and a second plate material is formed on both sides of the first plate material.
It has a layered structure formed by laminating plate-like materials, rolling them with rolls, compressing the laminated materials, and then heating while applying pressure.The total thickness is 0.5.
Ultra-thin cutting blade less than mm. (2) Extremely thin with a total thickness of 0.5 mm or less according to item 1, wherein the second plate material has a lower wear rate than the first plate material. cutting blade. (3) Ultra-thin cutting with a total thickness of 0.5 mm or less characterized by providing a plurality of plate-like materials on the outside of the second plate-like material in item 1 by the same method as described in item 1. blade.