JPH01121177A - Cutting blade - Google Patents

Abstract

PURPOSE:To make one-sided wear in a cutting blade hard to occur as well as to abate the bend of a blade edge by laminating each second layer, easy to wear as compared with a first layer, at both sides of the first layer hard to be worn out into a thickness of less than 20% of thickness of the cutting blade. CONSTITUTION:A tip of a three-layer structural cutting blade 4 is worn out into an angular form making a first layer 1 hard to wear an apex, and cutting advances with this angular apex as a criterion. At this time, since the first layer coming to this angular apex is thinned as less than 20% in the whole thickness of the cutting blade 4, the angular apex always exists in a portion proximate to the center of the whole thickness of the cutting blade 4, therefore cutting rectilinearity comes so better. In addition, the tip of the cutting blade 4 is worn out as the first layer 1 hard to wear in the center of this cutting blade 4 and the second layers 2, 3 easy to wear at both sides are regulated with one another, so that one-sided wear becomes lessened. Moreover, since a portion, coming into contact with the cutting surface of a work material, consists of these second layers 2, 3 being relatively softened, any possible scratches, chipping and so on are hard to occur on the cutting surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting blade for precisely cutting or grooving hard and brittle materials such as silicon, ferrite, glass, and ceramics.

[Conventional technology]

Conventionally, as a cutting blade for precisely cutting this type of hard and brittle material, a cutting blade made only of a plate-shaped material containing abrasive grains has been used.

Further, as a relatively thick cutting blade, a cutting blade having an abrasive layer only on the outer periphery of the alloy, such as by pasting an abrasive layer chip on the outer periphery of the alloy, is also used.

The abrasive grain layer portion of these cutting blades is generally a single-layer cutting blade made of only one type of composition.

[Problems to be solved by the invention] As shown in Fig. 5, a single-layer cutting blade consisting of only one type of composition
Since the cutting blade edge bends during cutting, there are disadvantages such as (1) the cut surface of the material to be cut is not at right angles, and (2) poor straightness in the cutting direction.

Ideally, if the components of a single-layer cutting blade are uniformly dispersed, the cutting blade edge should be cut as shown in Figure 3. However, slight unevenness in the components of the cutting blade causes uneven wear as shown in Figure 4, and a lateral force is applied to the blade tip of the unevenly worn blade, causing the cutting blade edge to change as shown in Figure 5. It is easy to bend.

The above-mentioned drawbacks of a single-layer cutting blade become more problematic as the thickness of the cutting blade becomes thinner.

The present invention solves the above-mentioned drawbacks of conventional cutting blades, and
The main purpose is to provide a cutting blade with excellent perpendicularity of the cutting surface, without causing uneven wear.

[Means (and effects) for solving the problem] The cutting blade according to the present invention has a first layer on both sides of the first layer, which is less likely to wear and has a thickness of 20% or less of the thickness of the cutting blade, and which is more easily worn than the first layer. It is characterized by having a layered structure in which two layers are laminated.

That is, in the present invention, the total thickness of the cutting blade, which is the middle layer, is 20
% or less (by creating a structure in which a second layer, which is more abrasive than the first layer, which is the outer layer, is laminated on both sides of the first layer, the part that is abrasive in the thickness direction of the cutting blade) As a result, each part wears while regulating the other, which prevents uneven wear.

In other words, as shown in Figure 2, the tip of the cutting blade wears in a chevron shape with its apex in the first layer, which is less likely to wear, but this tip, which determines the direction of cutting, is in the second layer, which is the total thickness of the cutting blade. Since it is located close to the center of the thickness of 20% or less, straightness of cutting is good.

The present invention will be described below with reference to illustrated examples.

FIG. 1 is a drawing showing a typical cutting blade according to the present invention. A cutting blade having a three-layer structure in which a second layer 2 is laminated, which is more easily worn than the first layer, is shown.

When cutting the material using such a cutting blade,
Since the cutting blade tip wears out while the first layer that is hard to wear and the second layer that wears easily restrict each other, uneven wear of the cutting blade tip is less likely to occur.

In addition, as shown in Figure 2, when the tip of the cutting blade is worn in a chevron shape with the apex of the first layer, which is less likely to wear, when cutting a material, the cutting progresses based on the apex of this chevron. Since the first layer, which is the apex of the cutting blade, is as thin as 20% or less of the total thickness of the cutting blade, the peak of the chevron is always located near the center of the total thickness of the cutting blade, and therefore the straightness of cutting is good.

In addition, a cutting blade equipped with an outer layer that is easily worn as shown in Figure 1 has a relatively soft part that comes into contact with the cut surface of the material to be cut, so scratches and chipping are less likely to occur on the cut surface. In order to achieve this effect, fine powder as a hardness regulator is mixed in.

(2) The abrasive grain size of the first layer is made larger than the abrasive grain size of the second layer.

(3) Differences in the difficulty of wear are created by differences in the content of the hardness modifier mixed in each layer.

(4) Use a harder binder for the first layer than the binder for the second layer.

(5) Use abrasive grains in the first layer that are harder than the abrasive grains in the second layer.

(6) Use two or more of these methods in combination.

Furthermore, as shown in Figure 5, one of the causes of the bending of the cutting blade edge is that the strength of the cutting blade itself is weak, especially in ultra-thin resinoid bond cutting blades, so the strength of the cutting blade itself is increased. Therefore, SiC whiskers can be applied only to the first layer, or both
It is desirable to mix it into both layers.

Moreover, in this case, Si mixed in each of the first layer and the second layer
It is also possible to differentiate the ease of abrasion between the first layer and the second layer based on the difference in the content of C whiskers.

[Example 1] The components of the first layer and the second layer were blended as shown in Table 1, and the thickness of the first layer was 0.04 mm, and the total thickness was 0.2 mm.
A resinoid bond cutting blade having a three-layer structure of mm was prepared.

When silicon wafers were repeatedly cut using this three-layered resinoid bond cutting blade, the tip of the cutting blade gradually wore out into a shape with an apex at the center of the thickness, as shown in Figure 2. At this time, compared to cutting silicon wafers with a conventional single-layer resinoid bond cutting blade, the cut surface is not distorted, the cutting is superior in straightness, and there are fewer scratches and chippings that occur on the cut surface. did.

[Example 2] The components of the first layer and the second layer were blended as shown in Table 2, and the thickness of the first layer was 0.03 mm, and the total thickness was 0.2 mm.
A resinoid bond cutting blade having a three-layer structure of mm was prepared.

When silicon wafers were repeatedly cut using this three-layer resinoid bond cutting blade, the same results as in Example 1 were obtained.

[Example 3] The components of the first layer and the second layer were mixed as shown in Table 3, and the thickness of the first layer was 0.02 mm, and the total thickness was 0.2 m.
A resinoid bond cutting blade with a three-layer structure of m was fabricated.

Table 3 When silicon wafers were repeatedly cut using this three-layered resinoid bond cutting blade, the same results as in the first example were obtained.

[Example 4] The components of the first layer and the second layer were blended as shown in Table 4, of which SiC fine powder and SiC whiskers were used as hardness modifiers, and the blending ratio was 1:1 for the first layer. 2. The second layer is 2:
The thickness of the first layer was 0.03 mm.

A resinoid bond cutting blade having a three-layer structure with a total thickness of 0.2 mm was manufactured.

Table 4 When silicon wafers were repeatedly cut using this three-layer resinoid bond cutting blade, the same results as in Example 1 were obtained.

Although all embodiments according to the present invention have been described with respect to resinoid bond cutting blades, similar results can be obtained with metal bond cutting blades in which the binder is a metal such as nickel or copper.

In addition, in the present invention, all three-layer structure cutting blades have been described, but similar results can be obtained with multi-layer structure cutting blades in which multiple thin layers are gradually overlaid with layers of easily worn components starting from the center of the thickness. can get. However, in this case, layers of the same composition must be arranged symmetrically in the thickness direction.

The reason for stacking a large number of layers in this way is that if each layer is thick, uneven wear may occur within each layer, so if the total thickness of the cutting blade is relatively thick, multiple layers may be stacked. It is particularly effective to laminate thin layers of as described above.

〔Effect of the invention〕

As described above, the cutting blade according to the present invention has the following advantages since uneven wear does not occur and the cutting edge is hard to bend.

■The cut surface of the material to be cut is curved.

■Good straightness of the cut surface in the cutting direction.

■Prevents scratches and chipping from occurring on the cut surface.

■No need to constantly modify the shape of the cutting blade tip.

[Brief explanation of the drawing]

FIG. 1 is an external view of a typical cutting blade having a three-layer structure according to the present invention. FIG. 2 is a cross-sectional view taken along the line AA' in FIG. 1, showing the state of wear at the tip of the cutting blade according to the present invention during cutting. FIG. 3 is a diagram showing the wear state of the tip of a conventional single-layer cutting blade during cutting, and shows the ideal worn state. FIG. 4 is a diagram showing the state of wear of the tip of a conventional single-layer cutting blade during cutting, and shows a state of uneven wear. FIG. 5 is a diagram schematically showing a state in which a material to be cut is being cut with a conventional single-layer cutting blade, and shows a state in which the cutting blade edge is bent during cutting. 1 is a first layer of a cutting blade 2 is a second layer of a cutting blade 3 is a third layer of a cutting blade 4 is a cutting blade 5 having a three-layer structure according to the present invention; cutting material

Claims (4)

[Claims] (1) A cutting blade characterized by having a layered structure in which a second layer that is more easily worn than the first layer is laminated on both sides of a first layer that is less likely to wear and has a thickness of 20% or less of the thickness of the cutting blade. . (2) The cutting blade according to claim 1, which contains a hardness modifier in each layer of the cutting blade. (3) The cutting blade according to claim 1, which includes SiC whiskers in the first layer. (4) By mixing SiC whiskers into the first and second layers, the difference in the content of SiC whiskers between the first and second layers can cause a difference in the ease of wear between the first and second layers. A cutting blade according to claim 3.