JPH01121176A - Wafer-thin cutting blade - Google Patents

Abstract

PURPOSE:To make one-sided wear in a wafer-thin cutting blade hard to occur as well as to reduce a bend of the blade edge by setting a plate material low in grain content percentage to a first layer, and laminating each second layer or a plate material, high in the grain content percentage as compared with the first layer, at both sides of this first layer. CONSTITUTION:When a material is cut with a three-layer structural cutting blade 4 of less than 0.5mm in thickness, the side of second layers 2, 3 high in grain content percentage at both sides in harder to wear than a first layer 1 low in this grain content percentage, so that a tip of the blade 4 is gradually worn out into a form with each crest on two outer layers 2, 3. In addition, since there are provided with the first layer 1 easy to wear and the layers 2, 3 hard to wear in this cutting blade 4, these layers 1-3 are worn out as being regulated with one another, and thus one-sided wear is also little. With suchlike wear cause, a cutting surface of the material comes hard to be bent, and cutting rectilinearity in the cutting direction is improved and, what is more, any possible scratches, chipping and so on are hard to occur on the cutting surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is a method for precisely cutting or grooving hard and brittle materials such as silicon, ferrite, glass, and ceramics with a thickness of 0.5 mm.
The present invention relates to ultra-thin cutting blades of mm or less, and particularly relates to improvements in ultra-thin metal bond cutting blades.

[Conventional technology]

Conventionally, as a cutting blade for precisely cutting this type of hard and brittle material, a cutting blade made only of a plate-shaped material containing abrasive grains has been used. Further, as a relatively thick cutting blade, a cutting blade having an abrasive layer only on the outer periphery of the alloy, such as by pasting an abrasive layer chip on the outer periphery of the alloy, is also used.

The abrasive grain layer portion of these cutting blades is generally a single-layer cutting blade made of only one type of composition. A cutting blade made of a plate material has a uniform contact surface with the object to be cut, compared to a cutting blade that has a structure in which an abrasive grain layer is attached to the outer periphery of the alloy. ■It is easy to manufacture because it can be used as a cutting blade simply by forming and firing the abrasive grain layer.

■Since it does not have a base metal, relatively thin cutting blades can be manufactured. It has the following advantages.

[Problems to be Solved by the Invention] While the single-layer cutting blade made of plate-like material described in the prior art has the above-mentioned advantages, it has the disadvantages shown in FIG. As the cutting blade edge bends during cutting, the cut surface of the material to be cut will not be at right angles. ■Poor straightness in the cutting direction. There are drawbacks such as:

For a cutting blade made of a single layer of plate material, if the components of the cutting blade are uniformly dispersed, ideally the cutting blade edge will wear out in an N-symmetrical cross-section as shown in Figure 3. In reality, slight unevenness in the components of the cutting blade causes uneven wear as shown in Figure 4, and a lateral force is applied to the blade tip of the unevenly worn blade.
The cutting blade edge tends to bend as shown in FIG.

In a cutting blade having a structure in which an abrasive layer is provided only on the outer periphery of the alloy shown in the conventional example, for example, Japanese Utility Model Publication No. 53-139
As stated in Publication No. 91, it is proposed that a layered abrasive layer chip having a structure in which a member with a high abrasive grain content is attached to both sides of a member with a low abrasive grain content is attached to the outer periphery of the alloy. However, these blades have a structure that has an abrasive layer only on the outer periphery of the alloy, so the contact surface with the object to be cut is uniform (and the abrasive layer chip is attached to the blade). , it is difficult to manufacture.■ Due to the structure in which the abrasive layer chip is attached to the base metal, it has the general drawback that it is difficult to manufacture extremely thin blades, especially blades with a thickness of 0.5 m or less. Since the thickness of the cutting blade itself is thick, the problem of uneven wear within each abrasive grain layer in the layered structure may still remain.

The main object of the present invention is to provide an ultra-thin cutting blade that solves the above-mentioned drawbacks, that is, an ultra-thin cutting blade that does not cause uneven wear and has excellent perpendicularity of the cutting surface.

[Means (and operation) for solving the problem] The present invention provides a cutting blade having a total thickness of 0.5 mm or less, which is made up of an abrasive grain layer held by a metallic binder such as nickel or copper. In the thin cutting blade, the abrasive grain layer has a plate-like material with a low abrasive grain content as the first layer, and a plate-like material with a high abrasive grain content in comparison with the first layer on both sides of the first layer. It is characterized by having a layered structure in which two layers are laminated. That is, in the ultra-thin cutting blade according to the present invention, a second plate-like material having a high abrasive grain content as an outer layer is laminated on both sides of a first plate-like material having a low abrasive grain content as a center layer. By creating a layered structure in which the cutting blade has an easily worn part and a hard to wear part in the thickness direction of the cutting blade, each wears while regulating each other, which prevents uneven wear, and as shown in Figure 2. Since the tip wears out over time, the cutting progresses while the two peaks restrict each other, resulting in excellent straightness of cutting. As a result, an ultra-thin cutting blade has been provided which solves the above-mentioned problems.

Such a layered structure is particularly effective in ultra-thin cutting blades such as those of the present invention.

The present invention will be described below with reference to illustrated examples.

FIG. 1 is a drawing that best represents the present invention, in which a second plate material 2 with a high diamond abrasive grain content is laminated on both sides of a first plate material 1 with a low diamond abrasive grain content, and It constitutes a thin cutting blade 4.

When a material is cut using such a three-layered cutting blade, the tip of the cutting blade gradually wears into a shape with ridges on the two outer layers as shown in FIG. This is because the second layer with a high abrasive grain content is less likely to wear than the first layer with a low abrasive grain content. (Here, the level of abrasive grain content is a relative level of abrasive grain content when comparing the first layer and second layer, and is not an absolute level of abrasive grain content.) Also, cutting Since the blade has a layer that is easily worn and a layer that is hard to wear, these wear while regulating each other, so there is little uneven wear.

By causing the above-described wear, the cut surface of the material is less curved and the cutting straightness is also better than when cutting the material with a conventional single-layer cutting blade. Furthermore, since no unreasonable force is applied to the cutting blade, there is an effect of suppressing uneven contact and vibration of the cutting blade, and as a result, there is an advantage that less vibration is generated on the cutting surface.

In addition, the cutting blade has a five-layer structure, with layers laminated on both sides of the second layer that have a lower abrasive content (easier to wear) than the second layer, so that the cutting surface of the material to be cut and By softening the abrasive grain layer on the side surface of the cutting blade that comes into contact with it, it is also possible to further reduce scratches and chipping that occur on the cutting surface.

[Example 1] A cutting blade according to the present invention was manufactured by the following method.

70:20 diamond abrasive grains, copper, tin, and silver powder
: After mixing the metallic binder at a weight ratio of 10 and thoroughly dispersing it, compression molding was performed using a cold press.
This is used as the first plate material.

A second plate material, which was created in the same manner as the first plate material except for changing the blending ratio of diamond abrasive grains and metallic binder, was laminated on both sides of the first plate material. By sintering this in a hydrogen atmosphere, a three-layered cutting blade was obtained.

Cutting blades were prepared using the components of the first plate material and the second plate material as shown in Table 1.

Table 1 Figure 1 shows the three-layer structure produced as described above.
The cutting blade is shown. 1 indicates the first plate-like material with a low diamond abrasive content as the center layer, and 2 and 3 indicate the second plate-like material with a high diamond content as the outer layer, which together form a cutting blade. The result is 4. When silicon wafers were repeatedly cut using this three-layered metal pound cutting blade, the tip of the cutting blade gradually wore out into a shape with two peaks on the outer layer side, as shown in Figure 2. At this time, compared to cutting a silicon wafer with a conventional single-layer cutting blade,
The cut surface is not curved and the cutting straightness is excellent, and the vibration of the cutting blade is reduced because no excessive force is applied to the cutting blade, resulting in fewer scratches and chipping on the cut surface.

[Example 2] Same as Example 1 (the mixing ratio of diamond abrasive grains and metallic binder was changed on both sides of the first plate-shaped material made of a mixture of diamond abrasive grains and metallic binder) A third plate material having the same composition as the first plate material is laminated on the outer side of the three-layer plate material in which the second plate material is laminated to form a five-layer plate material. A cutting blade with a five-layer structure was obtained by sintering in a hydrogen atmosphere.The components of the first and third plate materials were as shown in Table 1. The components of the plate material are shown in Table 1.

When silicon wafers were repeatedly cut using the five-layered metal pound cutting blade fabricated as described above, not only the same effect as in Example 1 was obtained, but also the third layer, the outermost layer. Since the abrasive grain content of the plate material was relatively low, scratches, chipping, etc. occurring on the cut surface of the material to be cut were further reduced than in the example.

Although three-layer or five-layer cutting blades have been described, it is also possible to construct each layer with more thin layers to control wear. However, in this case, it is necessary to arrange layers of the same composition symmetrically in the thickness direction.

The reason why such a large number of layers are laminated is that if each layer is thick, a problem of uneven wear within each layer may occur.

〔Effect of the invention〕

As explained above, the ultra-thin cutting blade of the present invention is less likely to cause uneven wear and the cutting edge is less likely to bend.As a result, - The cut surface of the material to be cut is less likely to bend - Good straightness of cutting in the cutting direction - Cutting surface ■Do not frequently modify the shape of the cutting blade tip to prevent scratches, chipping, etc.

This has the effect of

[Brief explanation of the drawing]

FIG. 1 is an external view of an ultra-thin cutting blade having a three-layer structure according to the present invention. FIG. 2 is a sectional view taken along line A and -A' in FIG. 1, and shows the state of wear at the tip of the cutting blade during use. FIG. 3 is a cross-sectional view of the tip of a conventional monolayer cutting blade having a uniform composition, showing an ideally worn state. FIG. 4 is a sectional view of the tip of a conventional single-layer cutting blade having a uniform composition, showing a state of uneven wear. FIG. 5 is a cross-sectional view schematically showing how a conventional single-layer cutting blade having a uniform composition bends during cutting. (2) is the first layer (inner layer) that constitutes the cutting blade; 3 is the second layer (outer layer) that constitutes the cutting blade; 4 is the three-layer structure. cutting material

Claims (2)

[Claims] (1) In an ultra-thin cutting blade in which the entire cutting blade is composed of an abrasive grain layer held by a metallic binder, the abrasive grain layer has a plate-shaped material with a low abrasive grain content as the first layer, and the plate-shaped material An ultra-thin cutting blade with a total thickness of 0.5 mm or less, characterized in that it has a layered structure in which a second layer, which is a plate material with a higher abrasive grain content than the first layer, is laminated on both sides of the blade. . (2) Ultra-thin according to claim 1, characterized in that it has a layered structure in which a third layer, which is a third plate-like material with a low abrasive grain content, is laminated on both sides of the second layer. cutting blade.