JPH01183371A - Extremely thin cutting blade - Google Patents
Extremely thin cutting bladeInfo
- Publication number
- JPH01183371A JPH01183371A JP438288A JP438288A JPH01183371A JP H01183371 A JPH01183371 A JP H01183371A JP 438288 A JP438288 A JP 438288A JP 438288 A JP438288 A JP 438288A JP H01183371 A JPH01183371 A JP H01183371A
- Authority
- JP
- Japan
- Prior art keywords
- blade
- cutting
- cutting blade
- thin cutting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000003082 abrasive agent Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 238000007772 electroless plating Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 101100433727 Caenorhabditis elegans got-1.2 gene Proteins 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、シリコン半導体材料のような硬脆材料の精密
切断及び溝加工に適した極薄切断ブレードに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ultra-thin cutting blade suitable for precision cutting and grooving of hard and brittle materials such as silicon semiconductor materials.
従来、かかる極薄切断ブレードとしては、特開昭４８−
２３５９４号公報に記載されているように、砥材をレジ
ン結合材によって結合した単一組成を有し、カレンダー
ロール圧延法、粉末チャージホットプレス法、コールド
プレス法、印刷法等によって製造された厚さが０．５ｆ
ｆｌｆｆ１以下のレジンボンド型のものが使用され、切
れ味が優れているという利点がある。Conventionally, such ultra-thin cutting blades have been disclosed in Japanese Patent Application Laid-open No. 48-
As described in Japanese Patent No. 23594, it has a single composition in which an abrasive material is bonded with a resin binder, and is manufactured by a calender roll rolling method, a powder charge hot press method, a cold press method, a printing method, etc. Saga 0.5f
A resin bond type with a flff of 1 or less is used, and has the advantage of excellent sharpness.
近年、半導体製造の効率化に伴い、単結晶材料の切断速
度を早めることがそのキーポイントを締めるに至ってい
る。In recent years, as semiconductor manufacturing becomes more efficient, increasing the cutting speed of single-crystal materials has become key.
ところが、従来の極薄切断ブレードではブレード強度上
の問題があり、単結晶素材の切断速度の高速度化に際し
て発生ず・る高衝撃に耐えることができない。However, conventional ultra-thin cutting blades have problems with blade strength, and cannot withstand the high impact that occurs when cutting single crystal materials at high speeds.
本発明の目的は、このような高硬度で、且つ高脆性を有
する半導体材料の高速度切断のニーズに対応するために
、切断時のブレードの折れに対しての強度、曲げ強度を
改善することにある。The purpose of the present invention is to improve the strength and bending strength of the blade against breakage during cutting, in order to meet the needs for high-speed cutting of semiconductor materials that have high hardness and high brittleness. It is in.
本発明の極薄切断ブレードは、ブレード自体をサントイ
フチ構造とすることによってブレードの曲げ強度を高め
て上記目的を達成したものである。The ultra-thin cutting blade of the present invention achieves the above object by increasing the bending strength of the blade by making the blade itself have a straight-edge structure.
第１図は本発明の極薄切断ブレードの全体構造を示すも
ので、第２図は第１図のＡ−Ａ線における断面構造を示
す図である。FIG. 1 shows the overall structure of the ultra-thin cutting blade of the present invention, and FIG. 2 is a diagram showing the cross-sectional structure taken along the line AA in FIG. 1.
本発明の極薄切断ブレード１０は、断面構造を示す第２
図を参照して、１は基板２の全表面に薄（形成された砥
材層を示す。The ultra-thin cutting blade 10 of the present invention has a second cross-sectional structure.
Referring to the figure, 1 indicates a thin (formed) abrasive material layer on the entire surface of the substrate 2.
上記サンドイッチ構造にするに当たっては、ブレード自
体の厚みを厚くしてはならず、また、その切れ味を低下
させてはならないという条件を満たす必要がある。In creating the above-mentioned sandwich structure, it is necessary to satisfy the conditions that the thickness of the blade itself must not be increased and its sharpness must not be reduced.
第３図はその構造の詳細を示す。FIG. 3 shows details of the structure.
同図を参照して、砥材層１としては、全ブレードの厚み
の約ｌＯ％で充分であり、砥材３の種類、粒度はとくに
限定されないが、一般的に刃厚の１／２〜１／３の粒度
のものを使用することが好ましい。Referring to the figure, it is sufficient for the abrasive material layer 1 to be approximately 10% of the thickness of the entire blade, and the type and particle size of the abrasive material 3 are not particularly limited, but are generally 1/2 to 1/2 of the blade thickness. It is preferable to use particles with a particle size of 1/3.
基材２としては、フェノール、ノボラック等の合成樹脂
ボンド材のように、通電性を有し、薄板に加工容易で、
その上曲げ強度の高い材料を使用する。The base material 2 may be a synthetic resin bond material such as phenol or novolak, which has electrical conductivity and is easy to process into a thin plate.
Moreover, a material with high bending strength is used.
基板２として樹脂を使用した場合には、表面に形成する
砥材層１は焼結による形成が不可能となるので、電着あ
るいは無電解メッキによって砥材層を形成させるのが良
い。When resin is used as the substrate 2, it is impossible to form the abrasive layer 1 on the surface by sintering, so it is preferable to form the abrasive layer by electrodeposition or electroless plating.
砥材層１を電着によって形成する場合には、基板２にリ
ード線をつけ、基板２表面に砥材を散布した後に電着浴
において通電させる電気メッキを行うことができる。When the abrasive material layer 1 is formed by electrodeposition, electroplating can be performed by attaching lead wires to the substrate 2, spreading the abrasive material on the surface of the substrate 2, and then applying electricity in an electrodeposition bath.
また、電着に代わって、無電解Ｎ！メッキによる砥材層
１の形成は、非電導体へのメッキが可能で、凹凸のある
表面にも均一な厚さのメッキを析出させることが可能で
あり、さらには、膜厚の制御が容易である、メッキ層の
機械的性質が優れている、メッキに際しての装置や治具
が簡単である等の点から好ましい。Also, in place of electrodeposition, electroless N! Forming the abrasive material layer 1 by plating allows plating on non-conductors, depositing a uniform thickness of plating even on uneven surfaces, and furthermore, making it easy to control the film thickness. It is preferable because the mechanical properties of the plating layer are excellent, and the equipment and jig used for plating are simple.
粉末ホットプレス法によって、厚み０．１９ｍ、内径４
０ｍｍ、外径５２則のサイズの樹脂とダイヤからなる基
板２を作成した。By powder hot press method, thickness 0.19m, inner diameter 4
A substrate 2 made of resin and diamond with a size of 0 mm and an outer diameter according to the rule of 52 was created.
同基板２０表面を脱脂後にセンシタイザ−法で還元力の
強い錫イオンを表面に吸着させて、アクナベ−ター法で
無電解メッキの触媒になるパラジウム金属を吸着させた
後に、ダイヤモンド粒子からなる砥材層を表面に分布し
たのち、９０℃、２０分の条件で無電解メッキを施して
、均一にＮｉが分散して、基材２との接着状態が良好の
０．０１ｍ５厚みを有する砥材層１を得た。After degreasing the surface of the substrate 20, a sensitizer method is used to adsorb tin ions with strong reducing power on the surface, and an aqunavator method is used to adsorb palladium metal, which becomes a catalyst for electroless plating. After distributing the layer on the surface, electroless plating was performed at 90° C. for 20 minutes to form an abrasive layer with a thickness of 0.01 m5, in which Ni was uniformly dispersed and the adhesive state with the base material 2 was good. I got 1.
その結果、基材２の全表面に得られた極薄切断ブレード
は、従来の極薄切断ブレードと比較して以下の通りの特
性を有するものであった。As a result, the ultra-thin cutting blade obtained on the entire surface of the base material 2 had the following characteristics compared to the conventional ultra-thin cutting blade.
すなわち、ダイシングＭ／Ｃにて、ガラス、セラミック
からなる複合材料を切断すると、以下の表に示すごとく
、従来に比べて切断速度を少なくとも２倍以上にするこ
とが可能となる。That is, when a composite material made of glass and ceramic is cut with a dicing M/C, the cutting speed can be at least twice as high as that of the conventional method, as shown in the table below.
本発明の極薄切断ブレードは表面硬度は高いが、内部は
切れ味の良いレジン砥材層の性質をもち、比較的厳しい
切断の条件下で、ブレードだおれによる曲がり切れおよ
びチッピングの面で優れたもので、以下のとおりの効果
を奏する。The ultra-thin cutting blade of the present invention has a high surface hardness, but the inside has a resin abrasive layer with good sharpness, and is excellent in terms of bending and chipping due to blade sagging under relatively severe cutting conditions. It has the following effects.
イ、レジン極薄切断作業において、切り込み深さ。A. Depth of cut in ultra-thin resin cutting work.
切断速度を増加させても、従来のブレードと比較してブ
レードの倒れ発生が少なくなり、直線切りが可能となる
。Even if the cutting speed is increased, the blade is less prone to collapse compared to conventional blades, making straight cuts possible.
口８表面が熱伝導性に優れており、クールカットが可能
である。The surface of the mouth 8 has excellent thermal conductivity, allowing for cool cuts.
ハ、基材レジン砥石と電着部との砥粒径をコントロール
して、チッピングの少ないもの、切れ味重視のものとい
うように、ブレード応用範囲が拡大できる。C. By controlling the abrasive grain size of the base resin grindstone and the electrodeposited part, the range of blade applications can be expanded, such as those with less chipping and those with emphasis on sharpness.
第１図は本発明の極薄切断ブレードの全体構造を示し、
第２図はその断面構造を示す。また、第３図は本発明の
極薄切断ブレードの構造の詳細を示す。FIG. 1 shows the overall structure of the ultra-thin cutting blade of the present invention,
FIG. 2 shows its cross-sectional structure. FIG. 3 also shows details of the structure of the ultra-thin cutting blade of the present invention.
Claims (1)
形成したことを特徴とする極薄切断ブレード。 ２、基板がボンド材からなり、表面層がメッキ砥材層か
らなることを特徴とする特許請求の範囲第１項に記載の
極薄切断ブレード。[Claims] 1. An ultra-thin cutting blade characterized in that a surface abrasive layer is provided on the surface of a substrate to form a sandwich structure. 2. The ultra-thin cutting blade according to claim 1, wherein the substrate is made of a bond material and the surface layer is made of a plating abrasive material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP438288A JPH01183371A (en) | 1988-01-11 | 1988-01-11 | Extremely thin cutting blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP438288A JPH01183371A (en) | 1988-01-11 | 1988-01-11 | Extremely thin cutting blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01183371A true JPH01183371A (en) | 1989-07-21 |
Family
ID=11582807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP438288A Pending JPH01183371A (en) | 1988-01-11 | 1988-01-11 | Extremely thin cutting blade |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01183371A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691547A (en) * | 1991-05-23 | 1994-04-05 | Mitsubishi Materials Corp | Flexible disk grinding wheel |
| JPH0691548A (en) * | 1991-05-23 | 1994-04-05 | Mitsubishi Materials Corp | Flexible disk grinding wheel |
| JP2006082187A (en) * | 2004-09-16 | 2006-03-30 | Mitsubishi Materials Corp | Thin blade grinding wheel |
| JP2012223867A (en) * | 2011-04-21 | 2012-11-15 | Mitsubishi Materials Corp | Cutting blade |
| JP2012223868A (en) * | 2011-04-21 | 2012-11-15 | Mitsubishi Materials Corp | Cutting blade |
| JP2013154425A (en) * | 2012-01-27 | 2013-08-15 | Tokyo Seimitsu Co Ltd | Cutting blade |
-
1988
- 1988-01-11 JP JP438288A patent/JPH01183371A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691547A (en) * | 1991-05-23 | 1994-04-05 | Mitsubishi Materials Corp | Flexible disk grinding wheel |
| JPH0691548A (en) * | 1991-05-23 | 1994-04-05 | Mitsubishi Materials Corp | Flexible disk grinding wheel |
| JP2006082187A (en) * | 2004-09-16 | 2006-03-30 | Mitsubishi Materials Corp | Thin blade grinding wheel |
| JP2012223867A (en) * | 2011-04-21 | 2012-11-15 | Mitsubishi Materials Corp | Cutting blade |
| JP2012223868A (en) * | 2011-04-21 | 2012-11-15 | Mitsubishi Materials Corp | Cutting blade |
| JP2013154425A (en) * | 2012-01-27 | 2013-08-15 | Tokyo Seimitsu Co Ltd | Cutting blade |
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