JPH0252431B2 - - Google Patents

Info

Publication number
JPH0252431B2
JPH0252431B2 JP8992287A JP8992287A JPH0252431B2 JP H0252431 B2 JPH0252431 B2 JP H0252431B2 JP 8992287 A JP8992287 A JP 8992287A JP 8992287 A JP8992287 A JP 8992287A JP H0252431 B2 JPH0252431 B2 JP H0252431B2
Authority
JP
Japan
Prior art keywords
formula
polymer
printed wiring
weight
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8992287A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63255990A (ja
Inventor
Nobuyuki Tamai
Kyoteru Kashiwame
Shigeyuki Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP8992287A priority Critical patent/JPS63255990A/ja
Publication of JPS63255990A publication Critical patent/JPS63255990A/ja
Publication of JPH0252431B2 publication Critical patent/JPH0252431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP8992287A 1987-04-14 1987-04-14 プリント配線板用絶縁基材 Granted JPS63255990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8992287A JPS63255990A (ja) 1987-04-14 1987-04-14 プリント配線板用絶縁基材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8992287A JPS63255990A (ja) 1987-04-14 1987-04-14 プリント配線板用絶縁基材

Publications (2)

Publication Number Publication Date
JPS63255990A JPS63255990A (ja) 1988-10-24
JPH0252431B2 true JPH0252431B2 (cs) 1990-11-13

Family

ID=13984193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8992287A Granted JPS63255990A (ja) 1987-04-14 1987-04-14 プリント配線板用絶縁基材

Country Status (1)

Country Link
JP (1) JPS63255990A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025089142A1 (ja) * 2023-10-23 2025-05-01 株式会社ダイセル 置換型ポリフェニレンサルファイド樹脂を含む樹脂組成物
WO2025089141A1 (ja) * 2023-10-23 2025-05-01 株式会社ダイセル 置換型ポリフェニレンサルファイド樹脂を含む樹脂組成物

Also Published As

Publication number Publication date
JPS63255990A (ja) 1988-10-24

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