JPH0252376U - - Google Patents
Info
- Publication number
- JPH0252376U JPH0252376U JP12859688U JP12859688U JPH0252376U JP H0252376 U JPH0252376 U JP H0252376U JP 12859688 U JP12859688 U JP 12859688U JP 12859688 U JP12859688 U JP 12859688U JP H0252376 U JPH0252376 U JP H0252376U
- Authority
- JP
- Japan
- Prior art keywords
- component
- hole
- adhesive sheet
- printed circuit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の原理図、第２図は本考案の実
施例の工程図、第３図は従来の部品実装構造の断
面図である。
図中、１は基板、２は部品挿入用穴、３は部品
ランド、４は粘着シート、５は部品、６は半田で
ある。
FIG. 1 is a principle diagram of the present invention, FIG. 2 is a process diagram of an embodiment of the present invention, and FIG. 3 is a sectional view of a conventional component mounting structure. In the figure, 1 is a board, 2 is a component insertion hole, 3 is a component land, 4 is an adhesive sheet, 5 is a component, and 6 is solder.
Claims (1)
のない面に、該穴に挿入された部品を仮止めする
粘着シート４を貼付してなることを特徴とするプ
リント基板。 Component land 3 of board 1 having component insertion hole 2
A printed circuit board characterized in that an adhesive sheet 4 for temporarily fixing a component inserted into the hole is attached to the side without the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12859688U JPH0252376U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12859688U JPH0252376U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252376U true JPH0252376U (en) | 1990-04-16 |
Family
ID=31382085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12859688U Pending JPH0252376U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252376U (en) |
-
1988
- 1988-09-30 JP JP12859688U patent/JPH0252376U/ja active Pending