JPH0250626B2 - - Google Patents

Info

Publication number
JPH0250626B2
JPH0250626B2 JP57022530A JP2253082A JPH0250626B2 JP H0250626 B2 JPH0250626 B2 JP H0250626B2 JP 57022530 A JP57022530 A JP 57022530A JP 2253082 A JP2253082 A JP 2253082A JP H0250626 B2 JPH0250626 B2 JP H0250626B2
Authority
JP
Japan
Prior art keywords
layer
lattice
contact holes
active element
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57022530A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58139445A (ja
Inventor
Kunimitsu Fujiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57022530A priority Critical patent/JPS58139445A/ja
Publication of JPS58139445A publication Critical patent/JPS58139445A/ja
Publication of JPH0250626B2 publication Critical patent/JPH0250626B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP57022530A 1982-02-15 1982-02-15 半導体集積回路装置 Granted JPS58139445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57022530A JPS58139445A (ja) 1982-02-15 1982-02-15 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57022530A JPS58139445A (ja) 1982-02-15 1982-02-15 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS58139445A JPS58139445A (ja) 1983-08-18
JPH0250626B2 true JPH0250626B2 (pm) 1990-11-02

Family

ID=12085346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57022530A Granted JPS58139445A (ja) 1982-02-15 1982-02-15 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS58139445A (pm)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6047440A (ja) * 1983-08-26 1985-03-14 Fujitsu Ltd 半導体集積回路
JPS6119146A (ja) * 1984-07-06 1986-01-28 Nec Corp Ｃｍｏｓ集積回路
JPH0644593B2 (ja) * 1984-11-09 1994-06-08 株式会社東芝 半導体集積回路装置
US5168342A (en) * 1989-01-30 1992-12-01 Hitachi, Ltd. Semiconductor integrated circuit device and manufacturing method of the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
JPS5483787A (en) * 1977-12-16 1979-07-04 Fujitsu Ltd Master slice semiconductor device
JPS56108242A (en) * 1980-01-31 1981-08-27 Nec Corp Master slice semiconductor device
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
JPS6422734A (en) * 1987-07-17 1989-01-25 Fujitsu Ltd Paper feed cassette for facsimile
JPH0689026B2 (ja) * 1987-08-06 1994-11-09 帝人株式会社 メソトレキセート誘導体およびその製造方法

Also Published As

Publication number Publication date
JPS58139445A (ja) 1983-08-18

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