JPH0250626B2 - - Google Patents

Info

Publication number
JPH0250626B2
JPH0250626B2 JP57022530A JP2253082A JPH0250626B2 JP H0250626 B2 JPH0250626 B2 JP H0250626B2 JP 57022530 A JP57022530 A JP 57022530A JP 2253082 A JP2253082 A JP 2253082A JP H0250626 B2 JPH0250626 B2 JP H0250626B2
Authority
JP
Japan
Prior art keywords
layer
lattice
contact holes
active element
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57022530A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58139445A (ja
Inventor
Kunimitsu Fujiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57022530A priority Critical patent/JPS58139445A/ja
Publication of JPS58139445A publication Critical patent/JPS58139445A/ja
Publication of JPH0250626B2 publication Critical patent/JPH0250626B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP57022530A 1982-02-15 1982-02-15 半導体集積回路装置 Granted JPS58139445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57022530A JPS58139445A (ja) 1982-02-15 1982-02-15 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57022530A JPS58139445A (ja) 1982-02-15 1982-02-15 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS58139445A JPS58139445A (ja) 1983-08-18
JPH0250626B2 true JPH0250626B2 (it) 1990-11-02

Family

ID=12085346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57022530A Granted JPS58139445A (ja) 1982-02-15 1982-02-15 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS58139445A (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6047440A (ja) * 1983-08-26 1985-03-14 Fujitsu Ltd 半導体集積回路
JPS6119146A (ja) * 1984-07-06 1986-01-28 Nec Corp Ｃｍｏｓ集積回路
JPH0644593B2 (ja) * 1984-11-09 1994-06-08 株式会社東芝 半導体集積回路装置
US5168342A (en) * 1989-01-30 1992-12-01 Hitachi, Ltd. Semiconductor integrated circuit device and manufacturing method of the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028796A (it) * 1973-04-30 1975-03-24
JPS5483787A (en) * 1977-12-16 1979-07-04 Fujitsu Ltd Master slice semiconductor device
JPS56108242A (en) * 1980-01-31 1981-08-27 Nec Corp Master slice semiconductor device
JPS57112062A (en) * 1980-12-05 1982-07-12 Cii High density integrated circuit device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6422734A (en) * 1987-07-17 1989-01-25 Fujitsu Ltd Paper feed cassette for facsimile
JPH0689026B2 (ja) * 1987-08-06 1994-11-09 帝人株式会社 メソトレキセート誘導体およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028796A (it) * 1973-04-30 1975-03-24
JPS5483787A (en) * 1977-12-16 1979-07-04 Fujitsu Ltd Master slice semiconductor device
JPS56108242A (en) * 1980-01-31 1981-08-27 Nec Corp Master slice semiconductor device
JPS57112062A (en) * 1980-12-05 1982-07-12 Cii High density integrated circuit device

Also Published As

Publication number Publication date
JPS58139445A (ja) 1983-08-18

Similar Documents

Publication Publication Date Title
CA2126479C (en) Symmetrical multi-layer metal logic array with continuous substrate taps and extension portions for increased gate density
JP3154411B2 (ja) Ｃａｄによってレイアウトされた２金属層集積回路ゲート・アレイ
US6987293B2 (en) Semiconductor integrated circuit device and standard cell placement design method
US4516312A (en) Method for constructing delay circuits in a master slice IC
US4893170A (en) Semiconductor device with multi-level wiring in a gate array
JPS647508B2 (it)
US4710897A (en) Semiconductor memory device comprising six-transistor memory cells
US4524377A (en) Integrated circuit
US8507994B2 (en) Semiconductor device
JPH0434309B2 (it)
US4951111A (en) Integrated circuit device
JPH0113222B2 (it)
JPH0243349B2 (it)
JPH04216668A (ja) 半導体集積回路
US5404034A (en) Symmetrical multi-layer metal logic array with continuous substrate taps
US20040056280A1 (en) Semiconductor device and a method of manufacturing the same
JPH0250626B2 (it)
US4034243A (en) Logic array structure for depletion mode-FET load circuit technologies
JPS583379B2 (ja) 半導体装置
US11217528B2 (en) Semiconductor structure having buried power rail disposed between two fins and method of making the same
JPH0252428B2 (it)
JP3289999B2 (ja) 半導体集積回路
JP2833291B2 (ja) Ｃｍｏｓ型半導体集積回路装置
US6097042A (en) Symmetrical multi-layer metal logic array employing single gate connection pad region transistors
JPH0122733B2 (it)