JPH0249982B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component series in which a plurality of electronic components are held in a state distributed in the length direction by a tape-like holder. In particular, the present invention relates to an electronic component series in which a cover tape is heat-welded to a storage tape having storage recesses for storing each electronic component.

Summary of the Invention The present invention is designed to restrict the area to which the cover tape is thermally welded to a substantially constant width by forming a stepped portion on the storage tape and creating an area that does not come into contact with the cover tape in an electronic component series. This is what I did.

BACKGROUND ART FIG. 9 is a partially exploded perspective view of a conventional electronic component series. The electronic component series 1 shown here is
In order to hold a plurality of electronic components 2, a storage tape 3 is first provided. A plurality of storage recesses 4 are formed in the storage tape 3, distributed in the length direction thereof. When this storage tape 3 is made of, for example, a thermoplastic resin sheet, the storage recess 4 can be formed by embossing it. The storage tape 3 is also formed with a plurality of perforations 5 distributed in its length direction.

In order to hold the electronic components 2 housed in the storage recesses 4, a cover tape 6 is arranged along the length of the storage tape 3, thereby closing each storage recess 4. The cover tape 6 is made of thermoplastic resin, and the cover tape 6 is welded to the storage tape 3 by heating regions 7 near both side surfaces of the cover tape 6 indicated by crosshatching in FIG.

The above-mentioned welding process is generally carried out using a sealing iron 9 having a built-in heater 8, as shown in FIGS. 10 and 11. The sealing iron 9 has a pair of contact surfaces 10 that extend linearly parallel to each other. The sealing iron 9 is stored in the region 7 of the cover tape 6 shown in FIG. This achieves welding with the tape 3.

Problems to be Solved by the Invention FIGS. 12 to 14 show the electron beams obtained by welding the cover tape 6 to the storage tape 3 using the sealing trowel 9 shown in FIGS. 10 and 11, respectively. Three examples of component sequences are shown in plan view. In these drawings, the cross hatching near both side edges of the cover tape 6 is the heat welded part 1.
1 is shown. Further, the area surrounded by the dashed line is the contact heating area 1 that the contact surface 10 mentioned above comes into contact with.
2 is shown.

The electronic component series 1a, 1b, and 1c shown in FIGS. 12 to 14, respectively, are dimensionally standardized so that they can be commonly applied to a specific automatic machine, and the arrangement pitch of the storage recess and the spout hole 55 is standardized. , and the respective widths of the storage tape 3 and the cover tape 6 are set constant. However, the storage recesses 4a, 4b, 4c have different dimensions so that electronic components 2a, 2b, 2c of different sizes can be accommodated.

In the electronic component series 1a of FIG. 12, a relatively small storage recess 4a is formed. In this case, the thermally welded portion 11 is formed to have a width approximately equal to that of the contact heating area 12 .

The electronic component series 1b in FIG. 13 is relatively large.
In particular, it has a storage recess 4b that is wide in the width direction. In this case, even within the contact heating area 12,
The thermally welded portion 11 is not formed in the region below which the storage recess 4b is located, and the width of the thermally welded portion 11 is not constant and periodically widens and narrows.

The electronic component series 1c shown in FIG. 14 includes a housing recess 4c that is sandwiched between two contact heating areas 12. Therefore, the heat welding portion 11 is originally formed to coincide with the contact heating area 12, but due to the shape of the sealing iron 9 shown in FIGS. 10 and 11, , Undesirably, in the area between the adjacent storage recesses 4c,
The heat welded portion 11 is in a state of protruding inward. This is because the heat radiated from the vicinity of the contact surface 10 of the sealing iron 9 is applied to a relatively wide area of the cover tape 6. Therefore, in the part where the cover tape 6 and the storage tape 3 are in contact,
Welding can be achieved even in areas other than the contact heating area 12. Note that this phenomenon of the heat-welded portion protruding inward can be seen in Figures 12 and 13.
This also occurs in the electronic component series 1a and 1b shown in the figure, and as a result, there is a drawback in that the width of the heat-welded portion cannot be made constant regardless of the size of the storage recess.

As in the examples shown in FIGS. 12 to 14 described above, when the width of the heat-welded portion 11 varies, such an electronic component series 1b or 1c is actually used to adjust the width of the electronic component 2b or 2c. In the supply process, the following problems occur.

Generally, the series of electronic components is fed in its length direction through a feed hole, and at the same time, at a predetermined location, the cover tape is pulled upward and peeled off from the storage tape. Thereafter, the electronic component stored in the storage recess is taken out and supplied to a predetermined printed circuit board or the like.

Focusing on the cover tape peeling process mentioned above,
Figures 12 to 14 (especially Figures 13 and 14)
It can be seen that in the electronic component series 1b and 1c shown in the figure, the force required for peeling is not constant in the length direction of the cover tape 6. That is, a large force is required for peeling in a wide area of the thermally welded part 11, and a small force is required for peeling in a narrow part. Therefore, any electronic component series 1
Even for a, 1b, and 1c, the force required for peeling increases or decreases periodically. Such periodic fluctuations in peeling force are caused by the cover tape 6
At the location where the electronic component series 1b and 1c are to be peeled off,
This results in the storage tape 3 being vibrated in the vertical direction. In particular, the faster the peeling is performed, the more pronounced the waving phenomenon becomes.

The above-mentioned waving phenomenon can be caused by cover tape 6.
Storage recess 4 of storage tape 3 in the state after peeling
Electronic components 2b, 2c housed in b, 4c
to make something jump out or change its direction. This means that the electronic components 2b, 2c
This is not preferable because it obstructs the supply process.

Therefore, an object of the present invention is to provide an electronic component series in which a heat-welded portion can be formed with a uniform width regardless of the dimensions of the storage recess.

Means for Solving the Problems This invention provides a storage tape in which a plurality of storage recesses each storing an electronic component are formed distributed in the length direction of the storage tape, and a plurality of storage recesses each storing an electronic component are formed in order to hold the electronic component in each storage tape. The cover tape is arranged along the length of the storage tape so as to close the storage recess, and a thermoplastic resin is formed on at least the surface of the cover tape facing the storage tape by heating the vicinity of both side edges of the cover tape. In an electronic component series in which a cover tape is welded to a storage tape, the surface of the storage tape facing the cover tape side is
A region lower than the region to be welded is formed inside the region to be welded, with a stepped portion extending linearly along the length of the storage tape as a boundary. It is.

Effects of the Invention According to the present invention, on the surface of the storage tape facing the cover tape side, on the inside with the stepped portion as a boundary,
A region is formed that does not touch the cover tape. Therefore, even if a heating body such as a sealing iron comes into contact with the top surface of the cover tape, or even if heat radiated from the heating body is applied, thermal welding is prevented. Therefore, the area to be thermally welded does not extend beyond the step, and the end of the thermally welded portion is regulated by the step. Therefore, in this invention, such a stepped portion is formed to extend linearly along the length direction of the storage tape, so that the heat-welded portion of the cover tape is almost constant in the length direction. It can be done. As a result, in the process of removing the electronic components while peeling off the cover tape, the electronic components, especially the storage tape, are prevented from waving, and the electronic components do not jump out of the storage recess or change their orientation. do not have.

Embodiment FIG. 1 is an exploded perspective view showing a part of an electronic component series 13 according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view taken along the line - in FIG. 1.
Further, FIG. 3 shows a plan view of the electronic component series 13.

The electronic component series 13 shown in these drawings includes substantially the same components as the electronic component series 1 shown in FIG. That is, a plurality of electronic components 14
, a storage tape 15 , and a cover tape 16 . In the storage tape 15, a plurality of storage recesses 17 for storing the electronic components 14, respectively, are formed and distributed in the length direction thereof. Also, along one side edge of the storage tape 15, a plurality of spout holes 18 are provided.
are distributed in the length direction.

If you pay attention to the upper surface of the storage tape 15, you will see that a stepped portion 19 is formed there. Stepped portion 19
extends linearly along the length of the storage tape 13. This stepped portion 19 is formed by the cover tape 16
It is located inside the area in contact with which the cover tape 16 is to be welded, that is, the welding area 20, and forms a border with an area that is lower than this welding area 20, that is, a low area 21. In this embodiment, the width of the storage recess 17 is determined to match the width of the lower region 21.

When the cover tape 16 is thermally welded to the storage tape 15 by the action of the sealing trowel 9 as shown in FIGS. 10 and 11, a thermally welded portion 22 is formed in the cross-hatched area in FIG. is formed.
As is clear from FIG. 3, the heat welded portion 22 is
Coincident with the welding area 20 , each inner side of which is defined by a step 19 . Therefore, a heat-welded portion 22 having a substantially uniform width is obtained.

FIG. 4 is a plan view of a storage tape 15a used in another embodiment of the present invention, and FIG. 5 is an enlarged sectional view taken along the line - in FIG. 4. This embodiment is a slight modification of the embodiment described with reference to FIGS. 1 to 3, and for ease of comparison, similar reference numerals are given to corresponding parts to distinguish characteristic parts. Only the important parts will be explained below.

In this embodiment, the low-lying area 21 is designed such that it is present only at or near the area on which the contact surface 10 of the sealing trowel 9 acts. Therefore, the lower region 21 is divided into two parts, and the region sandwiched between the two lower regions 21 remains at the same height as the welding region 20.

FIG. 6 is a plan view showing a storage tape 15b used in still another embodiment of the present invention, and FIG. 7 is an enlarged sectional view taken along the line - in FIG. 6. This embodiment has a storage recess 17a that is relatively small, particularly small in width. In this case, the stepped portion 19 is formed outside the storage recess 17a at a position separated by a predetermined distance. Therefore, a storage recess 17a is formed in the lower region 21 formed inside the stepped portion 19. The welded area 20 formed on the outside of the stepped portion 19 has substantially the same position and dimensions on the storage tape 15b as the welded area 20 in each embodiment shown in FIGS. 3 and 4, respectively. Therefore, welding can be performed using a similar thermal welding device, such as the sealing trowel 9.

Storage tape 1 used in each of the embodiments described above
5, 15a, and 15b are made of thermoplastic resin sheets, which are embossed to form storage recesses 17, 17a, step portions 19, and the like. However, the electronic component series to which the present invention is applied may be of other types. An example thereof will be explained with reference to FIG.

FIG. 8 shows a part of a different type of electronic component series 23 in a perspective view. This electronic parts series 23
In this case, as the storage tape 24, a relatively thick material such as cardboard or a synthetic resin band is used. The storage tape 24 is provided with penetrating holes 25 distributed in its length direction.
When the lower tape 26 is pasted to close the holes 25 from below, a storage recess 27 is formed in each hole 25, respectively. This storage recess 2
7 houses an electronic component 28. Further, a plurality of feed holes 29 are provided along one side edge of the storage tape 24. This feed hole 29 penetrates the lower tape 26. Note that the lower tape 26 may have the same width as the cover tape described later, and in this case, the feed hole 29 is not formed.

When paying attention to the upper surface of the storage tape 24, a stepped portion 30 is formed there. Therefore, with this stepped portion 30 as a boundary, the welding region 31 and the lower region 3
2 will be formed. A cover tape 33 made of thermoplastic resin is arranged along the length of the storage tape 24. Then, using a sealing iron 9 as shown in FIGS. 10 and 11,
When the cover sheet 33 is thermally welded, thermal welding is achieved within the welding region 31. Therefore, the heat-welded portion is formed with a substantially constant width.

Although the invention has been described in connection with several illustrated embodiments, other embodiments are possible within the scope of the invention.

For example, in each of the illustrated embodiments, the electronic component 1
4,28 are shown very schematically, but in general,
These electronic components are intended to be chip-type. However, the present invention is equally applicable to a series of electronic components in which electronic components having protruding terminal leads are housed in a housing recess.

In addition, the cover tape 1 used in the above example
Nos. 6 and 33 were themselves made of thermoplastic resin, but in order to achieve thermal welding, it is sufficient that at least the thermoplastic resin faces the storage tape side. Cover tapes made of other coated materials may also be used.

[Brief explanation of the drawing]

FIG. 1 is a partially exploded perspective view of an electronic component series 13 according to an embodiment of the present invention. Second
The figure is an enlarged sectional view taken along the line - in FIG. 1. FIG. 3 is a plan view of the electronic component series 13 of FIG. 1. FIG. 4 is a plan view showing a storage tape 15a used in another embodiment of the invention. FIG. 5 is an enlarged sectional view taken along line - in FIG. 4. FIG. 6 is a plan view of a storage tape 15b used in yet another embodiment of the invention. 7th
The figure is an enlarged sectional view taken along the line - in FIG. 6. FIG. 8 is a perspective view showing a part of an electronic component series 23 according to still another embodiment of the present invention. FIG. 9 is a partially exploded perspective view of a conventional electronic component series 1. As shown in FIG. FIG. 10 is a sectional view schematically showing the process of thermally welding the cover tape to the storage tape. FIG. 11 is a front view of the process shown in FIG. 10. Figures 12 to 14 are
3, which have been changed regarding the dimensions of the storage recess, respectively.
FIG. 2 is a plan view showing different types of electronic component series 1a, 1b, and 1c, and illustrates the drawbacks of conventional electronic component series. In the figure, 13 and 23 are electronic component series, 14,
28 is an electronic component, 15, 15a, 15b, 24 is a storage tape, 16, 33 is a cover tape, 17,
17a, 27 are storage recesses, 19, 30 are step portions, 2
0, 31 is the area to be welded (welding area), 2
1 and 32 are lowered regions (lower regions), and 22 is a heat-welded portion.

Claims (1)

[Scope of Claims] 1. A plurality of storage recesses each housing an electronic component are formed and distributed in the length direction of the storage tape,
In order to hold electronic components in each storage recess, a cover tape that closes the abutting storage recess is arranged along the length of the storage tape, and by heating the vicinity of both side edges of the cover tape, at least one of the cover tapes is heated. In an electronic component series in which a cover tape is welded to a storage tape using a thermoplastic resin formed on the surface facing the storage tape, the surface of the storage tape facing the cover tape side has a surface that is smaller than the area to be welded. An electronic component series, characterized in that the lowered region is formed inside the region to be welded, with a stepped portion extending linearly along the length of the storage tape as a boundary.