JPH0249711Y2 - - Google Patents
Info
- Publication number
- JPH0249711Y2 JPH0249711Y2 JP1904984U JP1904984U JPH0249711Y2 JP H0249711 Y2 JPH0249711 Y2 JP H0249711Y2 JP 1904984 U JP1904984 U JP 1904984U JP 1904984 U JP1904984 U JP 1904984U JP H0249711 Y2 JPH0249711 Y2 JP H0249711Y2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- nozzle
- lever
- solder
- holding block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000010586 diagram Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1904984U JPS60130643U (ja) | 1984-02-13 | 1984-02-13 | ノズル位置出し機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1904984U JPS60130643U (ja) | 1984-02-13 | 1984-02-13 | ノズル位置出し機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60130643U JPS60130643U (ja) | 1985-09-02 |
JPH0249711Y2 true JPH0249711Y2 (US07922777-20110412-C00004.png) | 1990-12-27 |
Family
ID=30508259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1904984U Granted JPS60130643U (ja) | 1984-02-13 | 1984-02-13 | ノズル位置出し機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60130643U (US07922777-20110412-C00004.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7341320B2 (ja) * | 2020-04-03 | 2023-09-08 | 平田機工株式会社 | 半田切断装置、半田切断ユニット、部品実装装置および生産システム |
-
1984
- 1984-02-13 JP JP1904984U patent/JPS60130643U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60130643U (ja) | 1985-09-02 |
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