JPH0247039U - - Google Patents
Info
- Publication number
- JPH0247039U JPH0247039U JP12590388U JP12590388U JPH0247039U JP H0247039 U JPH0247039 U JP H0247039U JP 12590388 U JP12590388 U JP 12590388U JP 12590388 U JP12590388 U JP 12590388U JP H0247039 U JPH0247039 U JP H0247039U
- Authority
- JP
- Japan
- Prior art keywords
- chips
- bonded
- circuit board
- different types
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の回路基板の一実施例を示す平
面図。第２図は従来の回路基板を示す平面図。 １……通常用ボンデイングパツド、２……異種
用ボンデイングパツド。
面図。第２図は従来の回路基板を示す平面図。 １……通常用ボンデイングパツド、２……異種
用ボンデイングパツド。
Claims (1)
- 直接ベアチツプをボンデイングする回路基板に
おいて、同一ボンデイング個所に異種のチツプを
ボンデイングすることを特徴とする回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12590388U JPH0247039U (ja) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12590388U JPH0247039U (ja) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247039U true JPH0247039U (ja) | 1990-03-30 |
Family
ID=31376922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12590388U Pending JPH0247039U (ja) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247039U (ja) |
-
1988
- 1988-09-27 JP JP12590388U patent/JPH0247039U/ja active Pending