JPH0247038U - - Google Patents
Info
- Publication number
- JPH0247038U JPH0247038U JP12644488U JP12644488U JPH0247038U JP H0247038 U JPH0247038 U JP H0247038U JP 12644488 U JP12644488 U JP 12644488U JP 12644488 U JP12644488 U JP 12644488U JP H0247038 U JPH0247038 U JP H0247038U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- integrated circuit
- semiconductor integrated
- semiconductor chip
- tab pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12644488U JPH0247038U (enExample) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12644488U JPH0247038U (enExample) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247038U true JPH0247038U (enExample) | 1990-03-30 |
Family
ID=31377975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12644488U Pending JPH0247038U (enExample) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247038U (enExample) |
-
1988
- 1988-09-27 JP JP12644488U patent/JPH0247038U/ja active Pending