JPH0247033U - - Google Patents
Info
- Publication number
- JPH0247033U JPH0247033U JP1988126606U JP12660688U JPH0247033U JP H0247033 U JPH0247033 U JP H0247033U JP 1988126606 U JP1988126606 U JP 1988126606U JP 12660688 U JP12660688 U JP 12660688U JP H0247033 U JPH0247033 U JP H0247033U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cradles
- pair
- rotary drying
- receiving port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001035 drying Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126606U JPH069501Y2 (ja) | 1988-09-27 | 1988-09-27 | 基板の回転乾燥装置 |
| KR1019890013807A KR900005566A (ko) | 1988-09-27 | 1989-09-26 | 기판의 회전 건조장치 |
| US07/413,331 US4987687A (en) | 1988-09-27 | 1989-09-27 | Rotary wafer drier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126606U JPH069501Y2 (ja) | 1988-09-27 | 1988-09-27 | 基板の回転乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0247033U true JPH0247033U (US20100223739A1-20100909-C00005.png) | 1990-03-30 |
| JPH069501Y2 JPH069501Y2 (ja) | 1994-03-09 |
Family
ID=14939359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126606U Expired - Lifetime JPH069501Y2 (ja) | 1988-09-27 | 1988-09-27 | 基板の回転乾燥装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4987687A (US20100223739A1-20100909-C00005.png) |
| JP (1) | JPH069501Y2 (US20100223739A1-20100909-C00005.png) |
| KR (1) | KR900005566A (US20100223739A1-20100909-C00005.png) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3190929B2 (ja) * | 1992-10-26 | 2001-07-23 | 保 目崎 | 半導体材料の水切乾燥装置 |
| JP2709568B2 (ja) * | 1994-06-30 | 1998-02-04 | 日本プレシジョン・サーキッツ株式会社 | ダウンフロー型スピンドライヤ |
| US5772784A (en) * | 1994-11-14 | 1998-06-30 | Yieldup International | Ultra-low particle semiconductor cleaner |
| US5634978A (en) * | 1994-11-14 | 1997-06-03 | Yieldup International | Ultra-low particle semiconductor method |
| US5849104A (en) * | 1996-09-19 | 1998-12-15 | Yieldup International | Method and apparatus for cleaning wafers using multiple tanks |
| US5958146A (en) * | 1994-11-14 | 1999-09-28 | Yieldup International | Ultra-low particle semiconductor cleaner using heated fluids |
| US5571337A (en) * | 1994-11-14 | 1996-11-05 | Yieldup International | Method for cleaning and drying a semiconductor wafer |
| JP2604561B2 (ja) * | 1994-12-26 | 1997-04-30 | 山形日本電気株式会社 | ウェーハ乾燥装置 |
| US6047717A (en) * | 1998-04-29 | 2000-04-11 | Scd Mountain View, Inc. | Mandrel device and method for hard disks |
| US20060182535A1 (en) * | 2004-12-22 | 2006-08-17 | Mike Rice | Cartesian robot design |
| US7396412B2 (en) * | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
| US7651306B2 (en) * | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
| US7699021B2 (en) * | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
| US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| US7819079B2 (en) * | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
| US20060241813A1 (en) * | 2005-04-22 | 2006-10-26 | Applied Materials, Inc. | Optimized cluster tool transfer process and collision avoidance design |
| DK201370239A1 (en) | 2013-04-30 | 2014-10-31 | Semi Stål As | Container drying device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629635A (ja) * | 1985-07-08 | 1987-01-17 | Oki Electric Ind Co Ltd | 半導体ウエハの回転乾燥装置 |
| US4777732A (en) * | 1986-06-12 | 1988-10-18 | Oki Electric Industry Co., Ltd. | Wafer centrifugal drying apparatus |
| JPH0745958Y2 (ja) * | 1987-05-11 | 1995-10-18 | 黒谷 信子 | 半導体材料の水切乾燥装置 |
-
1988
- 1988-09-27 JP JP1988126606U patent/JPH069501Y2/ja not_active Expired - Lifetime
-
1989
- 1989-09-26 KR KR1019890013807A patent/KR900005566A/ko not_active Application Discontinuation
- 1989-09-27 US US07/413,331 patent/US4987687A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR900005566A (ko) | 1990-04-14 |
| US4987687A (en) | 1991-01-29 |
| JPH069501Y2 (ja) | 1994-03-09 |
