JPH024679B2 - - Google Patents
Info
- Publication number
- JPH024679B2 JPH024679B2 JP57039077A JP3907782A JPH024679B2 JP H024679 B2 JPH024679 B2 JP H024679B2 JP 57039077 A JP57039077 A JP 57039077A JP 3907782 A JP3907782 A JP 3907782A JP H024679 B2 JPH024679 B2 JP H024679B2
- Authority
- JP
- Japan
- Prior art keywords
- plated
- metal
- plating
- thickness
- ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 19
- 229910021645 metal ion Inorganic materials 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000010949 copper Substances 0.000 description 21
- 239000000047 product Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 229910052709 silver Inorganic materials 0.000 description 14
- 239000004332 silver Substances 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 230000008021 deposition Effects 0.000 description 13
- 239000000956 alloy Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 150000002739 metals Chemical class 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000005275 alloying Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910001295 No alloy Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- -1 silver ions Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3907782A JPS58157988A (ja) | 1982-03-12 | 1982-03-12 | メッキ物の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3907782A JPS58157988A (ja) | 1982-03-12 | 1982-03-12 | メッキ物の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58157988A JPS58157988A (ja) | 1983-09-20 |
| JPH024679B2 true JPH024679B2 (US07935154-20110503-C00006.png) | 1990-01-30 |
Family
ID=12543043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3907782A Granted JPS58157988A (ja) | 1982-03-12 | 1982-03-12 | メッキ物の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58157988A (US07935154-20110503-C00006.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2805041B2 (ja) * | 1994-08-12 | 1998-09-30 | 工業技術院長 | 結晶成長方法及び装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947611A (US07935154-20110503-C00006.png) * | 1972-05-01 | 1974-05-08 |
-
1982
- 1982-03-12 JP JP3907782A patent/JPS58157988A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947611A (US07935154-20110503-C00006.png) * | 1972-05-01 | 1974-05-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58157988A (ja) | 1983-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4869971A (en) | Multilayer pulsed-current electrodeposition process | |
| US9125333B2 (en) | Electrical barrier layers | |
| US20080261071A1 (en) | Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components | |
| DE2554691A1 (de) | Verfahren zum herstellen elektrischer leiter auf einem isolierenden substrat | |
| US20050249969A1 (en) | Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components | |
| WO2018131962A1 (ko) | 캐리어박 부착 극박동박 | |
| JP2533227B2 (ja) | 熱圧着ボンデイング部材及びその製造方法 | |
| US20050249968A1 (en) | Whisker inhibition in tin surfaces of electronic components | |
| CN110301040B (zh) | 附有载体箔的超薄铜箔 | |
| Djurfors et al. | Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging | |
| JPH0533187A (ja) | スズメツキホイスカーの抑制方法 | |
| JPS60248892A (ja) | 高純度パラジウム・ニッケル合金メッキ液及び方法 | |
| JPH024679B2 (US07935154-20110503-C00006.png) | ||
| JP4856896B2 (ja) | リードフレームのめっき方法およびリードフレーム | |
| US5038195A (en) | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | |
| US5074969A (en) | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | |
| KR101776149B1 (ko) | 발열 및 비정질 특성을 가진 합금 도금용 도금장치 및 도금방법 | |
| JP2000174191A (ja) | 半導体装置およびその製造方法 | |
| JPH10245683A (ja) | 錫合金膜の形成方法およびその錫合金めっき浴 | |
| US20230189439A1 (en) | Carrier-foil-attached ultra-thin copper foil | |
| JPH0565659A (ja) | 無電解銅ニツケル合金めつき方法 | |
| JPS62250178A (ja) | 無電解めつきの初期析出方法 | |
| US5203931A (en) | Electrodeposition of indium-thallium shape memory alloys | |
| JPH07300696A (ja) | 電着錫めっき方法 | |
| JPH06340981A (ja) | 合金皮膜およびその製造方法 |