JPH0246466U - - Google Patents
Info
- Publication number
- JPH0246466U JPH0246466U JP12522888U JP12522888U JPH0246466U JP H0246466 U JPH0246466 U JP H0246466U JP 12522888 U JP12522888 U JP 12522888U JP 12522888 U JP12522888 U JP 12522888U JP H0246466 U JPH0246466 U JP H0246466U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- chips
- mounting board
- chip mounting
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Description
第１図は本考案による密着形イメージセンサの
一実施例を示す概略的平面図、第２図は同じく概
念図、第３図は従来の密着形イメージセンサを示
す概略的斜視図、第４図は第３図例におけるイメ
ージセンサＩＣチツプ実装基板を示す概念図であ
る。
４１〜４ｎ…イメージセンサＩＣチツプ、１０
…イメージセンサＩＣチツプ実装基板、１１…フ
レキシブル配線基板、１２…イメージセンサＩＣ
チツプ実装用基板、１３１−１〜１３ｎ−６…配
線。
Fig. 1 is a schematic plan view showing an embodiment of a contact type image sensor according to the present invention, Fig. 2 is a conceptual diagram as well, Fig. 3 is a schematic perspective view showing a conventional contact type image sensor, and Fig. 4 3 is a conceptual diagram showing the image sensor IC chip mounting board in the example of FIG. 3. FIG. 4 1 to 4 n ...Image sensor IC chip, 10
...Image sensor IC chip mounting board, 11...Flexible wiring board, 12...Image sensor IC
Chip mounting board, 13 1-1 to 13 n-6 ...wiring.
Claims (1)
イメージセンサＩＣチツプを一列に搭載してなる
イメージセンサＩＣチツプ実装基板と、該イメー
ジセンサＩＣチツプ実装基板に圧接されたフレキ
シブル配線基板とを具備して成る密着形イメージ
センサにおいて、 上記イメージセンサＩＣチツプ実装用基板には
上記イメージセンサＩＣチツプごとに、かつ、上
記イメージセンサＩＣチツプに沿つて配線を列設
し、そのうち、共通接続すべき配線については、
フレキシブル配線基板において共通接続するよう
にしたことを特徴とする密着形イメージセンサ。[Claims for Utility Model Registration] An image sensor IC chip mounting board in which a plurality of image sensor IC chips are mounted in a line on an image sensor IC chip mounting board, and flexible wiring that is pressure-bonded to the image sensor IC chip mounting board. In the contact type image sensor comprising a substrate, the substrate for mounting the image sensor IC chip has wiring arranged in rows for each of the image sensor IC chips and along the image sensor IC chips, Regarding the wiring to be connected,
A contact type image sensor characterized by common connection on a flexible wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12522888U JPH0246466U (en) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12522888U JPH0246466U (en) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246466U true JPH0246466U (en) | 1990-03-29 |
Family
ID=31375649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12522888U Pending JPH0246466U (en) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246466U (en) |
-
1988
- 1988-09-26 JP JP12522888U patent/JPH0246466U/ja active Pending