JPH0246056Y2 - - Google Patents
Info
- Publication number
- JPH0246056Y2 JPH0246056Y2 JP6348584U JP6348584U JPH0246056Y2 JP H0246056 Y2 JPH0246056 Y2 JP H0246056Y2 JP 6348584 U JP6348584 U JP 6348584U JP 6348584 U JP6348584 U JP 6348584U JP H0246056 Y2 JPH0246056 Y2 JP H0246056Y2
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- stem
- cap
- protrusion
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 30
- 238000005452 bending Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
【考案の詳細な説明】
産業上の利用分野
この考案は光半導体装置に関し、より詳しくは
一部に透光性窓部を有するカンケース内に、発光
ダイオード等の発光型やCdS素子等の受光型の光
半導体素子を固着封止した光半導体装置に好適す
るものである。[Detailed description of the invention] Industrial application field This invention relates to an optical semiconductor device, and more specifically, a light-emitting type such as a light-emitting diode or a light-receiving type such as a CdS element is placed inside a can case that partially has a translucent window. It is suitable for an optical semiconductor device in which a type of optical semiconductor element is fixedly sealed.
従来技術
従来、発光ダイオード等の発光型やCdS素子等
の受光型の光半導体素子は、一部に透光性部材を
有するカンケース内に固着封止されている。第２
図はそのような光半導体装置の一例の断面図であ
る。図において、１はカンケースで、ステム２と
キヤツプ３とを溶接して構成されている。ステム
２は、鉄等よりなる平板状のステム基板４の両端
部にシヤーシ等への取付孔５，５を有するととも
に、中央部近傍にリード線封着用の透孔６，６を
有し、各透孔６，６にソーダ系等のガラス７，７
を介して鉄・ニツケル合金等よりなるリード線
８，８が気密絶縁して封着されている。前記キヤ
ツプ３はコバールと称される鉄・ニツケル・コバ
ルト合金（Fe；55％，Ni；28％，Co；17％）よ
りなるキヤツプ本体９の透光10にガラスやサフア
イヤ等の透光性部材１１を溶着ないし低融点ガラ
ス等で固着したものである。前記ステム２の中央
部には、光半導体素子１２が固着され、その上部
電極が金属細線１３，１４を介してリード線８，
８に接続されている。BACKGROUND ART Conventionally, light-emitting type optical semiconductor elements such as light-emitting diodes and light-receiving type optical semiconductor elements such as CdS elements have been firmly sealed in can cases that partially have a light-transmitting member. Second
The figure is a cross-sectional view of an example of such an optical semiconductor device. In the figure, 1 is a can case, which is constructed by welding a stem 2 and a cap 3 together. The stem 2 has holes 5, 5 for attaching to a chassis etc. at both ends of a flat stem substrate 4 made of iron or the like, and has through holes 6, 6 for sealing lead wires near the center. Soda-based glass 7, 7 in the through holes 6, 6
Lead wires 8, 8 made of iron/nickel alloy or the like are hermetically insulated and sealed via the lead wires 8, 8. The cap 3 has a cap body 9 made of an iron-nickel-cobalt alloy called Kovar (Fe: 55%, Ni: 28%, Co: 17%) and a translucent member 10 such as glass or sapphire. 11 is welded or fixed with low melting point glass or the like. An optical semiconductor element 12 is fixed to the center of the stem 2, and its upper electrode is connected to the lead wires 8, 12 via thin metal wires 13, 14.
8 is connected.
考案が解決しようとする問題
ところで、上記の構造の光半導体装置において
は、カンケース１を取付孔５，５を利用してシヤ
ーシ等に取り付けようとする場合、ステム２に反
りがあると、ステム２に曲げ応力が作用して、ガ
ラス７，７に亀裂が生じたり、ステム２から光半
導体素子１２が剥離したり亀裂が生じたり、透光
性部材１１が破損することがあつた。このような
問題を解決するためには、例えばステム２の平面
度を厳しく管理する方法もあるが、実際にはステ
ム２は約1000℃の高温でリード線８，８をガラス
封着する工程を経て製造されるため、完全な平面
度を得ることは困難であつた。Problem to be Solved by the Invention Incidentally, in the optical semiconductor device having the above structure, when the can case 1 is attached to a chassis etc. using the mounting holes 5, if the stem 2 is warped, the stem The bending stress applied to the stem 2 caused cracks to occur in the glasses 7, 7, the optical semiconductor element 12 to peel off from the stem 2 and cracks to occur, and the translucent member 11 to be damaged. In order to solve this problem, for example, there is a method of strictly controlling the flatness of the stem 2, but in reality, the stem 2 is manufactured by a process of glass-sealing the lead wires 8, 8 at a high temperature of about 1000°C. Because it is manufactured over a long period of time, it is difficult to obtain perfect flatness.
そこで、第３図に示すような光半導体装置も提
案されている。この装置は、カンケース２０を構
成するステム２１に特徴があり、ステム基板２２
の中央部に円柱状の突起部２３を設けたものであ
る。このような構造にすれば、突起部２３の機械
的強度が増大して、仮にステム２１に反りがあつ
ても、ガラス７，７に亀裂が生じたり、ステム２
１から光半導体素子１２が剥離したり亀裂が生じ
たりすることはなくなるが、キヤツプ３の透光性
部材１１の亀裂を防止することができなかつた。
そこで、この考案はキヤツプの透明性部材に亀裂
が生じない光半導体装置を提供することを目的と
する。 Therefore, an optical semiconductor device as shown in FIG. 3 has also been proposed. This device is characterized by a stem 21 that constitutes a can case 20, and a stem substrate 22.
A cylindrical protrusion 23 is provided at the center. With such a structure, the mechanical strength of the protrusion 23 increases, and even if the stem 21 is warped, cracks will not occur in the glasses 7, 7, and the stem 23 will not crack.
Although the optical semiconductor element 12 from the cap 1 is prevented from peeling off or cracking, it was not possible to prevent the light-transmitting member 11 of the cap 3 from cracking.
Therefore, the object of this invention is to provide an optical semiconductor device in which cracks do not occur in the transparent member of the cap.
問題点を解決するための手段
この考案は、カンケースを構成するステムの中
央部に階段状の突起部を形成して、上段の突起部
に光半導体素子を固着するとともに、下段の突起
部にキヤツプを固着したことを特徴とするもので
ある。Means for Solving the Problem This invention forms a step-like protrusion in the center of the stem constituting the can case, fixes the optical semiconductor element to the upper protrusion, and fixes the optical semiconductor element to the lower protrusion. It is characterized by a fixed cap.
作 用
上記のように、ステム基板に階段状の突起部を
形成すると、この突起部の機械的強度が増大し、
仮にステムに反りがあつても、光半導体装置をシ
ヤーシ等に取り付ける場合の曲げ応力がキヤツプ
の固着部に及ばず、したがつてキヤツプの透光性
部材に亀裂が生じることがなくなるのである。Effect As described above, when a stepped protrusion is formed on the stem substrate, the mechanical strength of this protrusion increases,
Even if the stem is warped, the bending stress when attaching the optical semiconductor device to a chassis or the like does not reach the fixed portion of the cap, so that cracks do not occur in the light-transmitting member of the cap.
実施例
第１図はこの考案の一実施例の光半導体装置の
断面図を示す。図において、次の点を除いては第
２図および第３図と同様なので同一部分には同一
参照符号を付しており、その説明を省略する。こ
の実施例のカンケース３０のステム３１は、ステ
ム基板３２の中央部に２段の階段状の突起部３
３，３４を設けてあり、上段の突起部３３に光半
導体素子１２を固着するとともに、下段の突起部
３４にキヤツプ３を固着している。Embodiment FIG. 1 shows a sectional view of an optical semiconductor device according to an embodiment of this invention. The figure is similar to FIGS. 2 and 3 except for the following points, so the same parts are given the same reference numerals and their explanation will be omitted. The stem 31 of the can case 30 of this embodiment has a two-step stepped protrusion 3 at the center of the stem base plate 32.
3 and 34 are provided, and the optical semiconductor element 12 is fixed to the upper protrusion 33, and the cap 3 is fixed to the lower protrusion 34.
上記の構成によれば、突起部３３，３４によつ
て機械的強度が増大するので、仮にステム３２に
反りがあつて、光半導体装置をシヤーシ等に取り
付ける際にステム３２に曲げ応力が作用しても、
この曲げ応力がガラス７，７の封着部や光半導体
素子１２の固着部に作用しないことはもちろん、
キヤツプ３の固着部にも作用しないので、キヤツ
プ３の透光性部材１１に亀裂が生じることがなく
なる。 According to the above configuration, the mechanical strength is increased by the protrusions 33 and 34, so even if the stem 32 is warped, bending stress will be applied to the stem 32 when the optical semiconductor device is attached to a chassis or the like. Even though
Of course, this bending stress does not act on the sealed parts of the glasses 7 and 7 or the fixed parts of the optical semiconductor element 12.
Since it does not act on the fixed portion of the cap 3, cracks will not occur in the transparent member 11 of the cap 3.
なお、上記実施例は、光半導体素子１２を１個
だけ固着する場合について説明したが、２個以上
の光半導体素子，特に発光型と受光型の光半導体
素子を固着する場合にも実施できる。 In the above embodiment, the case where only one optical semiconductor element 12 is fixed is explained, but it can also be implemented when two or more optical semiconductor elements, especially a light emitting type and a light receiving type optical semiconductor element are fixed.
考案の効果
この考案は以上のように、ステムの中央部に階
段状の突起部を設け、上段の突起部に光半導体素
子を固着するとともに、下段の突起部に透光性部
材を有するキヤツプを固着したから、突起部によ
つて機械的強度が増大し、仮にステムに反りがあ
つてシヤーシ等に取り付ける場合にステムに曲げ
応力が作用しても、この曲げ応力がキヤツプの固
着位置，したがつて透光性部材に波及せず透光性
部材に亀裂が生じない。Effects of the invention As described above, this invention provides a step-like protrusion in the center of the stem, fixes the optical semiconductor element to the upper protrusion, and attaches a cap having a light-transmitting member to the lower protrusion. Since it is fixed, the mechanical strength is increased by the protrusion, and even if the stem is warped and bending stress is applied to the stem when it is attached to a chassis etc., this bending stress will affect the fixed position of the cap. This does not affect the light-transmitting member and does not cause cracks in the light-transmitting member.
第１図はこの考案の一実施例の光半導体装置の
断面図である。第２図および第３図は従来の異な
る光半導体装置の断面図である。
３……キヤツプ、５……取付孔、１１……透光
性部材、１２……光半導体素子、３０……カンケ
ース、３１……ステム、３２……ステム基板、３
３……上段の突起部、３４……下段の突起部。
FIG. 1 is a sectional view of an optical semiconductor device according to an embodiment of this invention. FIGS. 2 and 3 are cross-sectional views of different conventional optical semiconductor devices. 3... Cap, 5... Mounting hole, 11... Transparent member, 12... Optical semiconductor element, 30... Can case, 31... Stem, 32... Stem board, 3
3... Upper protrusion, 34... Lower protrusion.
Claims (1)
部材を有するキヤツプを固着したカンケース内
に、光半導体素子を封入してなる光半導体装置に
おいて、 前記ステムの中央部に階段状の突起部を設け、
上段の突起部に光半導体素子を固着するととも
に、下段の突起部に透光性部材を有するキヤツプ
を固着したことを特徴とする光半導体装置。[Scope of Claim for Utility Model Registration] An optical semiconductor device in which an optical semiconductor element is enclosed in a can case in which a cap having a partially translucent member is fixed to a stem having mounting holes at both ends, comprising: A step-like protrusion is provided in the center of the
An optical semiconductor device characterized in that an optical semiconductor element is fixed to an upper protrusion, and a cap having a light-transmitting member is fixed to a lower protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6348584U JPS60174260U (en) | 1984-04-26 | 1984-04-26 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6348584U JPS60174260U (en) | 1984-04-26 | 1984-04-26 | Optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60174260U JPS60174260U (en) | 1985-11-19 |
| JPH0246056Y2 true JPH0246056Y2 (en) | 1990-12-05 |
Family
ID=30593676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6348584U Granted JPS60174260U (en) | 1984-04-26 | 1984-04-26 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60174260U (en) |
-
1984
- 1984-04-26 JP JP6348584U patent/JPS60174260U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60174260U (en) | 1985-11-19 |
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