JPH0245653U - - Google Patents
Info
- Publication number
- JPH0245653U JPH0245653U JP1988125089U JP12508988U JPH0245653U JP H0245653 U JPH0245653 U JP H0245653U JP 1988125089 U JP1988125089 U JP 1988125089U JP 12508988 U JP12508988 U JP 12508988U JP H0245653 U JPH0245653 U JP H0245653U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor
- land
- solder bumps
- side terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125089U JPH0245653U (cs) | 1988-09-24 | 1988-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125089U JPH0245653U (cs) | 1988-09-24 | 1988-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245653U true JPH0245653U (cs) | 1990-03-29 |
Family
ID=31375383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125089U Pending JPH0245653U (cs) | 1988-09-24 | 1988-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245653U (cs) |
-
1988
- 1988-09-24 JP JP1988125089U patent/JPH0245653U/ja active Pending
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