JPH0245027Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an ID card attached with an object.

Do not insert other objects into the hole in the card base material of the ID card.
For example, when a photograph, an IC module, a magnetic recording medium, etc. are mounted, an overlay film is placed on both sides, and the product is molded by heating and pressurizing, the conventional overlay film has the disadvantage that the image printed on it is distorted.

Conventionally, an ID card equipped with such an object has a mounting hole 2 provided in a card base material 1, as shown in Fig. 1.
An object 3 such as an IC module was attached to the card base material 1, and an overlay film 4 was thermally bonded to both sides of the card base material 1. However, in the case of such an ID card, the overlay film 4 and the card base material 1 are softened and fluidized by heating, and the softened resin is pressurized to form a small gap between the card base material 1 and the object 3. As a result, the overlay film 4 is sandwiched between the card base material 1 and the object 3, as shown in the enlarged view in FIG. 1, and the pattern printed on the overlay film 4 is disturbed. Put it away. For this reason, the pattern had a drawback in that it formed a ring around the object 3, resulting in a low commercial value.

In particular, when the thickness of the object 3 was thinner than the card base material 1, the above-mentioned drawbacks were noticeable.

The purpose of the present invention is to eliminate the above-mentioned drawbacks of the conventional technology and provide an ID card with a uniform pattern.

The present invention is an ID card in which an IC module object is mounted in a mounting hole provided in a card base material, and an overlay film is adhered to both sides. Then, a film-like resin having a softening point lower than that of the card base material 1 is laminated between the card base material 1 and the overlay film 4 so as to fill the gap and the thickness difference between the card base material and the object. This ID card is characterized in that the object, the card base material, and the overlay film are heat-sealed by intervening arrangement.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 2 shows an embodiment of the present invention. An object 3 such as a photograph, an IC module, a barcode chip, or other recording material is mounted in the mounting hole 2 provided in the card base material 1, and a molding film 5 of approximately the same size as the object 3 is placed on both sides of the object 3. An ID card 6 is formed by placing an arbitrary number of overlay films 4 on both sides and heat-sealing them by heat and pressure.

In this embodiment, the object 3 is thinner than the card base material 1, and the number of forming films 5 is placed to compensate for the difference in thickness between the object 3 and the card base material 1. It is preferable to set the number of sheets so that the thickness slightly exceeds the difference in thickness of the material 1. Note that if the object 3 shrinks due to heating, the number of sheets is adjusted with this point in mind.

It is preferable to use a resin having a lower melting point than the card base material 1 for the molding film 5, and to use a thin film so that an arbitrary thickness can be compensated for.

By using such a molding film 5, the resin of the molding film 5 is softened and fluidized before the card base material 1 is fluidized during heating and pressurization.
The gap between the card base material 1 and the object 3 and the difference in thickness between the object 3 and the card base material 1 are filled.

As the resin for the molding film 5, it is possible to use resins with a low softening point such as polyethylene, nylon, vinyl chloride, vinylidene chloride, vinyl acetate, acrylic ionomer, hot melt, etc. Furthermore, these resins can be made into a film. If a material is used, it can be easily processed into various shapes. Furthermore, several types of shaping films 5 having different thicknesses may be used, or the shaping film 5 may be placed only on one side of the object 3.

FIG. 3 shows another embodiment of the present invention, in which the object 3 is thicker than the card base material 1. An arbitrary number of molding films 5 were placed near the object 3 on both sides of the card base material 1, and molded by heating and pressing.
It is an ID card. In this embodiment as well, the number of molding films 5 is sufficient to compensate for the difference in thickness between the object 3 and the card base material 1, and a resin having a softening point lower than that of the card base material 1 is used. Card base material 1
The forming film 5 may be placed only on one side.

FIG. 4 shows another embodiment of the present invention, in which an IC module 7 is used as the object 3, and an IC module 7 is used as the object 3.
This is a case where the module 7 is thinner than the card base material 1.

Into the mounting hole 2 provided in the bone white PVC card base material 1.
The ID card 7 is attached, and the molding film 5, which is approximately the same size as the IC module 7, is attached to the IC module 7.
A white vinyl chloride film 9 is placed on the back side of the molding film 5, and on the back side of the vinyl chloride film 9,
A transparent vinyl chloride overlay film 4 is placed, and the transparent vinyl chloride overlay film 4 on which an opaque hiding layer 10 is applied by printing or the like is placed on the front side of the IC module 7 where the external terminals 8 are located. It is heated and pressurized.

As shown in FIG. 5, the overlay film 4 may be coated with a resin having a softening point lower than that of the card base material 1 to form a molding resin layer 11 of a predetermined thickness, and then heated and pressed. Furthermore, the molding resin layer 11
may be coated on the object 3 as shown in FIG. 6, or may be coated on the card base material 1. Further, it is also possible to appropriately combine the above-described molding film 5 and molding resin layer 11. As the resin for the molding resin layer 11, it is preferable to use a resin that can be used for the molding film 5 described above.

In the present invention, an IC module object is fitted into a mounting hole provided in a card base material, and the IC module has a lower softening point than the card base material 1 so as to fill the gap and thickness difference between the card base material and the object. By interposing a film-like resin between the card base material 1 and the overlay film 4 in a laminated state and thermally fusing the object, the card base material, and the overlay film, the interposition of a low softening point resin layer is achieved. This allows the overlay film to absorb distortion of the image and maintain its adhesive properties, making it possible to create an ID card without disturbing the image on the overlay film, and even without using adhesives as a card base material. Since it can fill gaps and differences in thickness between the card base material and objects such as IC modules, even if there is a thickness difference between the card base material and the object, the product can be properly fixed to the card base material, and there can be no unevenness on the card surface. In addition to making it possible to create an ID card with a good appearance without causing any damage, it also simplifies the manufacturing process of the card and reduces the number of component parts, greatly increasing productivity and making it possible to produce high-quality cards at a significantly lower cost. There are practical effects that are possible.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a conventional ID card; Figure 2 is a cross-sectional view of a conventional ID card;
3, 4, 5, and 6 are cross-sectional views of embodiments of the present invention. DESCRIPTION OF SYMBOLS 1... Card base material, 2... Mounting hole, 3... Object, 4... Overlay film, 5... Molding film, 6... ID card, 7... IC module, 8... External terminal, 9 ... Vinyl chloride film, 10 ... Hiding layer, 11 ... Molding resin layer.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) An ID card in which an IC module object is attached to a mounting hole provided in a card base material, and an overlay film is adhered to both sides of the card. The IC module object is inserted into the card base material 1 and the card base material 1 is laminated with a film-like resin having a lower softening point than the card base material 1 so as to fill the gap and thickness difference between the card base material and the object. An ID card characterized in that the object, the card base material, and the overlay film are heat-sealed by being interposed between the ID card and an overlay film 4. (2) A plurality of the resin layers are placed on one side of the IC module with the same dimensions as the IC module.
2. The card according to claim 1, wherein an ink layer for hiding the IC module is formed on the overlay film on the terminal side of the module. (3) The card according to claim 1, wherein the resin layer is coated on an overlay film. (4) The card according to claim 1, wherein the resin layer is coated on the object. (5) Utility model registration claim 1, in which the resin layer is coated on the card base material
Cards listed in section.