JPH0243022U - - Google Patents
Info
- Publication number
- JPH0243022U JPH0243022U JP12197688U JP12197688U JPH0243022U JP H0243022 U JPH0243022 U JP H0243022U JP 12197688 U JP12197688 U JP 12197688U JP 12197688 U JP12197688 U JP 12197688U JP H0243022 U JPH0243022 U JP H0243022U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- piezoelectric thin
- substrate
- wave device
- cap member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 238000010897 surface acoustic wave method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の表面波装置を説明するための分解斜視図、
第３図は従来の表面波装置の断面図であり、第２
図の−線に沿う部分に相当する組立後の断面
図であり、第４図は本考案の一実施例のキヤツプ
材を取付ける前の状態を示す平面図である。
図において、１１は基板、１２，１３はインタ
ーデジタルトランスデユーサ、１６は圧電薄膜、
１９はキヤツプ材、２０は接着材を示す。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is an exploded perspective view for explaining a conventional surface wave device,
FIG. 3 is a cross-sectional view of a conventional surface wave device.
FIG. 4 is a cross-sectional view after assembly corresponding to a portion taken along the line - in the figure, and FIG. 4 is a plan view showing the state before a cap material is attached to an embodiment of the present invention. In the figure, 11 is a substrate, 12 and 13 are interdigital transducers, 16 is a piezoelectric thin film,
Reference numeral 19 indicates a cap material, and 20 indicates an adhesive material.
Claims (1)
上に形成されたインターデジタルトランスデユー
サと、 前記インターデジタルトランスデユーサ及び表
面波伝搬路上に空間を設けるために取付けられた
キヤツプ材とを備える表面波装置において、 前記キヤツプ材が圧電薄膜の外周縁の外側の領
域において前記基板に接合されていることを特徴
とする表面波装置。[Claims for Utility Model Registration] An insulating substrate, a piezoelectric thin film formed on the insulating substrate, and an interdigital transducer formed between the substrate and the piezoelectric thin film or on the piezoelectric thin film. , a surface acoustic wave device comprising the interdigital transducer and a cap member attached to provide a space on a surface wave propagation path, wherein the cap member is bonded to the substrate in a region outside the outer periphery of the piezoelectric thin film. A surface wave device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12197688U JPH0243022U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12197688U JPH0243022U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243022U true JPH0243022U (en) | 1990-03-26 |
Family
ID=31369479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12197688U Pending JPH0243022U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243022U (en) |
-
1988
- 1988-09-16 JP JP12197688U patent/JPH0243022U/ja active Pending