JPH042119U - - Google Patents
Info
- Publication number
- JPH042119U JPH042119U JP4180390U JP4180390U JPH042119U JP H042119 U JPH042119 U JP H042119U JP 4180390 U JP4180390 U JP 4180390U JP 4180390 U JP4180390 U JP 4180390U JP H042119 U JPH042119 U JP H042119U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- package
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第１図は本考案の一実施例を示す側面図、第２
図は従来の弾性表面波装置の一例を示す側面図で
ある。
１，１１……パツケージ、２，１２……弾性表
面波素子、３……凸部、４……空隙、１３……接
着剤。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a side view showing an example of a conventional surface acoustic wave device. 1, 11...Package, 2, 12...Surface acoustic wave element, 3...Convex portion, 4...Gap, 13...Adhesive.
Claims (1)
表面波素子と前記弾性表面波素子を実装するパツ
ケージとにより構成される弾性表面波装置におい
て、前記交叉指状電極から離れた前記弾性表面波
素子の一方端裏面部分に対応する前記パツケージ
の実装面に凸部を設け、前記弾性表面波素子の他
方端裏面部分と前記パツケージの実装面との間に
空隙を有するように前記弾性表面波素子の一方端
裏面部分と前記凸部とを接着することを特徴とす
る弾性表面波装置。 In a surface acoustic wave device that includes a surface acoustic wave device having interdigitated electrodes formed on a piezoelectric substrate and a package mounting the surface acoustic wave device, the surface acoustic wave device is configured such that the surface acoustic wave separated from the interdigital electrodes is A convex portion is provided on the mounting surface of the package corresponding to the back surface of one end of the element, and the surface acoustic wave element is arranged such that there is a gap between the back surface of the other end of the surface acoustic wave element and the mounting surface of the package. A surface acoustic wave device characterized in that a back surface portion of one end of the surface acoustic wave device is bonded to the convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4180390U JPH042119U (en) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4180390U JPH042119U (en) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042119U true JPH042119U (en) | 1992-01-09 |
Family
ID=31552787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4180390U Pending JPH042119U (en) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042119U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50156121U (en) * | 1974-06-12 | 1975-12-24 |
-
1990
- 1990-04-19 JP JP4180390U patent/JPH042119U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50156121U (en) * | 1974-06-12 | 1975-12-24 |