JPH0243023U - - Google Patents
Info
- Publication number
- JPH0243023U JPH0243023U JP12197788U JP12197788U JPH0243023U JP H0243023 U JPH0243023 U JP H0243023U JP 12197788 U JP12197788 U JP 12197788U JP 12197788 U JP12197788 U JP 12197788U JP H0243023 U JPH0243023 U JP H0243023U
- Authority
- JP
- Japan
- Prior art keywords
- interdigital transducer
- propagation path
- cap material
- substrate
- surround
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010897 surface acoustic wave method Methods 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の一実施例の分解斜視図、第２
図は従来の表面波装置を説明するための分解斜視
図、第３図は第２図の表面波装置の問題点を説明
するための断面図であり、第２図の−線に沿
う部分の完成断面図、第４図は第１図実施例の組
立てた状態の第１図の−線に沿う断面図であ
る。
図において、１１は圧電基板、１２，１３はイ
ンターデジタルトランスデユーサ、１６は環状部
材としての吸音材、１８はキヤツプ材、１９は接
着材を示す。
Fig. 1 is an exploded perspective view of one embodiment of the present invention;
The figure is an exploded perspective view for explaining the conventional surface wave device, and FIG. 3 is a sectional view for explaining the problems of the surface wave device in FIG. 2. 4 is a sectional view taken along the line - in FIG. 1 of the assembled embodiment of FIG. 1. In the figure, 11 is a piezoelectric substrate, 12 and 13 are interdigital transducers, 16 is a sound absorbing material as an annular member, 18 is a cap material, and 19 is an adhesive material.
Claims (1)
ーサを、または絶縁性基板上に圧電薄膜との間に
インターデジタルトランスデユーサを形成し、前
記インターデジタルトランスデユーサ及び表面波
伝搬路上に空間を設けるために、インターデジタ
ルトランスデユーサ及び表面波伝搬路を囲むよう
にキヤツプ材を設けた表面波装置において、 前記基板上においてインターデジタルトランス
デユーサ及び表面波伝搬路を囲むように環状部材
を配置し、環状部材よりも外側領域で前記キヤツ
プ材を圧電基板に直接にまたは圧電薄膜を介して
接合したことを特徴とする表面波装置。[Claims for Utility Model Registration] An interdigital transducer is formed on a piezoelectric substrate, or an interdigital transducer is formed between a piezoelectric thin film on an insulating substrate, and the interdigital transducer and surface wave In a surface acoustic wave device in which a cap material is provided to surround an interdigital transducer and a surface wave propagation path in order to provide a space on a propagation path, a cap material is provided on the substrate to surround the interdigital transducer and a surface wave propagation path. 1. A surface acoustic wave device, characterized in that an annular member is disposed at the top of the cap, and the cap material is bonded to a piezoelectric substrate directly or via a piezoelectric thin film in an area outside the annular member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12197788U JPH0243023U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12197788U JPH0243023U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243023U true JPH0243023U (en) | 1990-03-26 |
Family
ID=31369481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12197788U Pending JPH0243023U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243023U (en) |
-
1988
- 1988-09-16 JP JP12197788U patent/JPH0243023U/ja active Pending
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