JPH0242420U - - Google Patents
Info
- Publication number
- JPH0242420U JPH0242420U JP12201388U JP12201388U JPH0242420U JP H0242420 U JPH0242420 U JP H0242420U JP 12201388 U JP12201388 U JP 12201388U JP 12201388 U JP12201388 U JP 12201388U JP H0242420 U JPH0242420 U JP H0242420U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insertion hole
- wiring board
- printed wiring
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の実施例を示す側面図、第２
図ａ乃至第２図ｄは、電子部品１をプリント配線
基板３に実装する様子を夫々示す本考案実施例の
側面図、第３図乃至第５図は従来例を示し、第３
図は側面図、第４図ａ乃至第４図ｃ及び第５図は
同上従来例の動作を説明する側面図である。
１……電子部品、１ａ，１ｂ……リード、３ａ
，３ｂ……折り返えし部、４……プリント配線基
板、５ａ，５ｂ……リード挿通穴、６……ランド
部。
Figure 1 is a side view showing an embodiment of the present invention, Figure 2 is a side view showing an embodiment of the present invention;
Figures a to 2d are side views of the embodiment of the present invention, respectively showing how the electronic component 1 is mounted on the printed wiring board 3; Figures 3 to 5 are side views of the conventional example;
The figure is a side view, and FIGS. 4a to 4c and 5 are side views for explaining the operation of the conventional example. 1...Electronic component, 1a, 1b...Lead, 3a
, 3b...Folded portion, 4...Printed wiring board, 5a, 5b...Lead insertion hole, 6...Land portion.
Claims (1)
挿通穴への挿通部先端が折り返えされ、且つこれ
らの折り返えし部の自由状態での開口部間隔が前
記リード挿通穴の径よりも広く設定されているこ
とを特徴とする電子部品のリード構造。 The tip of the insertion part of the lead of the electronic component into the lead insertion hole of the printed wiring board is folded back, and the opening interval in the free state of these folded parts is set to be wider than the diameter of the lead insertion hole. A lead structure for electronic components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201388U JPH0242420U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201388U JPH0242420U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242420U true JPH0242420U (en) | 1990-03-23 |
Family
ID=31369550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12201388U Pending JPH0242420U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242420U (en) |
-
1988
- 1988-09-16 JP JP12201388U patent/JPH0242420U/ja active Pending