JPH0242419Y2 - - Google Patents
Info
- Publication number
- JPH0242419Y2 JPH0242419Y2 JP1023085U JP1023085U JPH0242419Y2 JP H0242419 Y2 JPH0242419 Y2 JP H0242419Y2 JP 1023085 U JP1023085 U JP 1023085U JP 1023085 U JP1023085 U JP 1023085U JP H0242419 Y2 JPH0242419 Y2 JP H0242419Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- cooling
- thermal conductivity
- high thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1023085U JPH0242419Y2 (enrdf_load_stackoverflow) | 1985-01-28 | 1985-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1023085U JPH0242419Y2 (enrdf_load_stackoverflow) | 1985-01-28 | 1985-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61125412U JPS61125412U (enrdf_load_stackoverflow) | 1986-08-07 |
| JPH0242419Y2 true JPH0242419Y2 (enrdf_load_stackoverflow) | 1990-11-13 |
Family
ID=30491219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1023085U Expired JPH0242419Y2 (enrdf_load_stackoverflow) | 1985-01-28 | 1985-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242419Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7381599B2 (en) | 1993-09-20 | 2008-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
-
1985
- 1985-01-28 JP JP1023085U patent/JPH0242419Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7381599B2 (en) | 1993-09-20 | 2008-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US7525158B2 (en) | 1993-09-20 | 2009-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having pixel electrode and peripheral circuit |
| US7569856B2 (en) | 1993-09-20 | 2009-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61125412U (enrdf_load_stackoverflow) | 1986-08-07 |